The interconnect of papa kaapuni i paʻi ʻia Aia i loko o ka ʻōnaehana chip-to-circuit board, interconnect ma waena o PCB a me interconnect ma waena o PCB a me nā hāmeʻa kūwaho. In RF design, the electromagnetic characteristics at the interconnect point is one of the main problems faced by engineering design. This paper introduces various techniques of the above three types of interconnect design, including device installation methods, isolation of wiring and measures to reduce lead inductance.

Aia kekahi mau hōʻailona e hoʻolālā ʻia nā papa kaapuni me ka hoʻonui pinepine ʻana. As data rates continue to increase, the bandwidth required for data transmission also pushes the signal frequency ceiling to 1GHz or higher. This high frequency signal technology, although far beyond the millimeter wave technology (30GHz), does involve RF and low-end microwave technology.

Pono e hiki i nā hana hoʻolālā ʻenehana RF ke lawelawe i nā hopena o ka electromagnetic ʻoi aku ka ikaika i hana ʻia ma nā alapine ʻoi. Hiki i kēia mau māla electromagnetic ke hoʻokomo i nā hōʻailona ma nā laina hōʻailona pili a i ʻole nā ​​laina PCB, e hoʻoulu ai i ka crosstalk makemake ʻole (keakea a me ka walaʻau holoʻokoʻa) a hōʻino i ka hana ʻōnaehana. Backloss is mainly caused by impedance mismatch, which has the same effect on the signal as additive noise and interference.

High return loss has two negative effects: 1. The signal reflected back to the signal source will increase the noise of the system, making it more difficult for the receiver to distinguish noise from signal; 2. 2. E hoʻohaʻahaʻa nui kēlā me kēia hōʻailona i ka maikaʻi o ka hōʻailona no ka mea ua loli ke ʻano o ka hōʻailona hoʻokomo.

ʻOiai ʻoluʻolu loa nā ʻōnaehana uila no ka mea pili wale lākou i nā hōʻailona 1 a me 0, hana nā mele like ke piʻi nei ka pā i ka wikiwiki e hoʻonāwaliwali ka hōʻailona ma nā alapine kiʻekiʻe. ʻOiai hiki i ka hoʻoponopono hewa ʻana i mua ke hoʻopau i kekahi o nā hopena maikaʻi ʻole, hoʻohana ʻia kahi ʻāpana o ka bandwidth band e hoʻoili i nā ʻikepili redundant, e hopena ana i ka hana degradation. ʻO kahi hopena ʻoi aku ka maikaʻi e loaʻa nā hopena RF e kōkua ai ma mua o ka haʻalele ʻana i ka pono o ka hōʻailona. Paipai ʻia ka huina hoʻi hoʻihoʻi ma ke alapine kiʻekiʻe loa o kahi ʻōnaehana uila (ʻo ka maʻa mau kahi ʻikepili ʻilihuna) e -25dB, e like me ka VSWR o 1.1.

Hoʻolālā ka hoʻolālā PCB i ka liʻiliʻi, wikiwiki a me ke kumu kūʻai. No RFPCB, hōʻailona wikiwiki wikiwiki i kekahi manawa palena i ka miniaturization o nā hoʻolālā PCB. I kēia manawa, ʻo ke ʻano nui e hoʻonā i ka pilikia kea ke hoʻokō i ka hoʻokele pili ʻāina, alakaʻi i ka hoʻokaʻawale ma waena o nā uea a hoʻēmi i ka inductance kēpau. ʻO ke ala nui e hōʻemi i ka nalo o ka hoʻihoʻi ʻana. Hoʻopili kēia hana i ka mālama pono ʻana i nā mea hoʻīpī a me ka hoʻokaʻawale ʻana i nā laina hōʻailona hana a me nā laina honua, keu hoʻi ma waena o ka mokuʻāina o ka laina hōʻailona a me ka honua.

Ma muli o ka pilina o ka loulou nāwaliwali loa i ke kaulahao kaapuni, i ka hoʻolālā RF, ʻo nā pono electromagnetic o ka helu interconnect ka pilikia nui e kū pono ana i ka hoʻolālā ʻenekini, pono e hoʻokolokolo ʻia kēlā me kēia kiko interconnect a hoʻoponopono ʻia nā pilikia e kū nei. Hoʻopili ka pilina kaapuni me ka pili o ka papa chip-to-circuit, ka pilina PCB a me ka hoʻopili hoʻokomo / huina hoʻohui ma waena o PCB a me nā hāmeʻa kūwaho.

I. Hoʻohui ma waena o ka chip a me ka papa PCB

Inā paha e holo kēia hopena, ua maopopo i ka poʻe i hele ma mua o ka ʻenehana hoʻolālā IC ma mua o ka ʻenehana hoʻolālā PCB no nā noi hf.

Hoʻohui PCB

ʻO nā ʻenehana a me nā ʻano hana no ka hf PCB hoʻolālā penei:

1. Pono e hoʻohana i kahi kihi 45 ° no ke kihi laina hoʻoili e hoʻemi ai i ka nalo hoʻihoʻi (FIG. 1);

2 insulation mau waiwai e like me ka pae o ka ikaika kaohi kiʻekiʻe-hana insulate kaapuni papa. He kūpono kēia hana no ka mālama pono ʻana i ka māla electromagnetic ma waena o nā mea insulate a me nā uea pili.

3. E hoʻomaikaʻi i nā kikoʻī hoʻolālā PCB no ka hoʻopaʻa pono ʻana i ka etching. E noʻonoʻo e hōʻike i ka hewa o ka laulā laina o +/- 0.0007 ʻīniha, ka mālama ʻana i nā ʻāpana undercut a me nā keʻa o nā ʻano pilina a e kuhikuhi ana i nā kūlana plating pā o ka pili. Overall management of wiring (wire) geometry and coating surfaces is important to address skin effects related to microwave frequencies and to implement these specifications.

4. Aia ka inductance piula wai i nā alakaʻi e protruding ana. Hōʻalo i ka hoʻohana ʻana i nā mea me nā kēpau. No nā wahi kiʻekiʻe pinepine, ʻoi aku ka maikaʻi o ka hoʻohana ʻana i nā ʻāpana i kau ʻia ma luna.

5. No ka hōʻailona ma o nā puka, e hōʻalo i ka hoʻohana ʻana i ke kaʻina PTH ma ka pā pili, no ka mea hiki i kēia hana ke hoʻoulu i ka inductance alakaʻi ma ka puka ma. Lead inductance can affect layers 4 to 19 if a through-hole in a 20-ply board is used to connect layers 1 to 3.

6. E hoʻolako i nā papa honua he nui. Moulded holes are used to connect these grounding layers to prevent 3d electromagnetic fields from affecting the circuit board.

7. No ke koho ʻana i ka plating nickel non-electrolysis a i ʻole ke kaʻina plating gula immersion, mai hoʻohana i ke ʻano plating HASL. Hāʻawi kēia ʻili electroplated i kahi hopena ʻili maikaʻi aʻe no nā kahe alapine kiʻekiʻe (Kiʻi 2). In addition, this highly weldable coating requires fewer leads, helping to reduce environmental pollution.

8. Solder resistance layer can prevent solder paste from flowing. Eia nō naʻe, no ka maopopo ʻole o ka mānoanoa a me ka hana hoʻowalewale ʻike ʻole ʻia, e uhi ana i ka pā o ka papa āpau me nā mea kūpale solder e alakaʻi i kahi hoʻololi nui o ka ikehu electromagnetic i ka hoʻolālā microstrip. Generally, solderdam is used as welding resistance layer.

Inā ʻaʻole ʻoe kamaʻāina i kēia mau hana, e nīnau i kahi ʻenekinia hoʻolālā ʻike i hana ma nā papa kaapuni hawewe no ka pūʻali koa. You can also discuss with them what price range you can afford. ʻO kahi laʻana, ʻoi aku ka maikaʻi o ka hoʻohana ʻana i kahi hoʻolālā microstrip kope ʻia i kākoʻo ʻia e ke keleawe ma mua o kahi hoʻolālā stripline, a hiki iā ʻoe ke kūkākūkā i kēia me lākou e loaʻa ai nā ʻōlelo aʻoi maikaʻi aʻe. ʻAʻole paha e hoʻohana ʻia nā ʻenekini maikaʻi e noʻonoʻo e pili ana i ke kumukūʻai, akā hiki ke kōkua maikaʻi i kā lākou ʻōlelo aʻoaʻo. He hana lōʻihi loa ia e hoʻomaʻamaʻa i nā ʻenekini ʻōpio i ʻike ʻole i nā hopena RF a nele i ka ʻike i ka hana ʻana me nā hopena RF.

Hoʻohui ʻia, hiki ke lawe ʻia nā hopena ʻē aʻe, e like me ka hoʻomaikaʻi ʻana i ke k computerkohu kamepiula e hiki ai ke lawelawe i nā hopena RF.

Hoʻohui PCB me nā hāmeʻa kūwaho

Hiki iā mākou ke noʻonoʻo ua hoʻoponopono mākou i nā pilikia hoʻokele hōʻailona ma ka papa a me nā pilina o nā mea discrete. No laila pehea ʻoe e hoʻoponopono ai i ka pilikia hoʻokomo / hōʻailona mai ka papa kaapuni i ka uea e hoʻopili ana i ka hāmeʻa mamao? ʻO TrompeterElectronics, kahi mea hana i ka ʻenehana coaxial cable, ke hana nei i kēia pilikia a ua holomua kekahi mea nui (helu 3). Also, take a look at the electromagnetic field shown in Figure 4 below. I kēia hihia, mālama mākou i ka hoʻololi mai ka microstrip i ke kaula coaxial. I nā kaula coaxial, hoʻopili ʻia nā papa o ka honua i nā apo a kaulike kaulike ʻia. I nā microbelts, aia ka papa honua lalo o ka laina hana. Hōʻike kēia i kekahi hopena hopena e pono e hoʻomaopopo, wānana ʻia, a noʻonoʻo ʻia i ka manawa hoʻolālā. ʻOiaʻiʻo, hiki i kēia kuhi hewa ʻole ke alakaʻi i backloss a pono e hoʻemi ʻia e hōʻalo ai i ka halulu a me ka hōʻailona hōʻailona.

ʻO ka hoʻokele o ka pilikia impedance kūloko ʻaʻole ia he pilikia hoʻolālā hiki ke nānā ʻole ʻia. Hoʻomaka ka impedance ma ka papa o ka papa kaapuni, hele ma waena o kahi hui solder i ka ami, a hoʻopau ma ke kaula coaxial. No ka mea ʻokoʻa ka impedance me ke alapine, ʻo ke kiʻekiʻe ke alapine, ʻo ka ʻoi aku ka paʻakikī o ka hoʻokele impedance. The problem of using higher frequencies to transmit signals over broadband appears to be the main design problem.