The interconnect of te papa poari panui kei roto i te punaha te maramara-ki-ara poari, honohono i roto i te PCB me te honohono i waenga i te PCB me nga taputapu o waho. In RF design, the electromagnetic characteristics at the interconnect point is one of the main problems faced by engineering design. This paper introduces various techniques of the above three types of interconnect design, including device installation methods, isolation of wiring and measures to reduce lead inductance.

He tohu kei te hangaia nga papaahiko taarua me te piki haere o te waa. As data rates continue to increase, the bandwidth required for data transmission also pushes the signal frequency ceiling to 1GHz or higher. This high frequency signal technology, although far beyond the millimeter wave technology (30GHz), does involve RF and low-end microwave technology.

Ko nga tikanga hoahoa hangarau RF me kaha ki te hapai i te kaha o te kaha o te hiko o te hiko e hangaia ana i nga waahanga teitei ake. Ka taea e enei mara electromagnetic te whakaputa tohu i runga i nga raina tohu tata raina PCB ranei, na te mea kaore e hiahiatia ana te pehanga (pokanoa me te haruru katoa) me te kino o te mahinga o te punaha. Backloss is mainly caused by impedance mismatch, which has the same effect on the signal as additive noise and interference.

High return loss has two negative effects: 1. The signal reflected back to the signal source will increase the noise of the system, making it more difficult for the receiver to distinguish noise from signal; 2. 2. Ko nga tohu whakaata ka tino whakaitihia te kounga o te tohu na te mea ka rereke te ahua o te tohu whakauru.

Ahakoa he ngoikoretanga nui o nga punaha a-tihi na te mea e mahi ana ratau ki nga tohu 1 me te 0, ko nga kotahitanga i hangaia i te wa e tere ana te pupuhi ka tere te ngoikore o te tohu ki nga teitei teitei. Ahakoa ko te whakatikatika hapa o mua ka taea te whakakore i etahi o nga awangawanga kino, ko te waahanga o te punaha bandwidth e whakamahia ana hei whakawhiti i nga raraunga taapiri, ka hua ake te ngoikoretanga o te mahi. Ko te rongoa pai ko te whai i nga awangawanga RF e awhina ana kaua ki te tango i te pono o te tohu. E taunaki ana ko te tapeke o te ngaronga whakahoki i te teitei rawa o te punaha matihiko (ko te nuinga he tohu raraunga koretake) -25dB, he rite ki te VSWR o 1.1.

Ko te hoahoa PCB he iti ake, he tere me te iti ake te utu. Mo te RFPCB, ko nga tohu tere-tere i etahi wa ka whakaiti i te whakaititanga o nga hoahoa PCB. I tenei wa, ko te tikanga matua ki te whakatau i te raru whakawhiti ko te kawe i te whakahaere hononga whenua, te whakahaere mokowhiti i waenga i nga waea waea me te whakaiti i te arataki mata. Ko te tikanga matua ki te whakaiti i te ngaronga o te hokinga mai ko te whakaurunga haangai. Ko tenei tikanga ko te whakahaere whaihua o nga rauemi kiriuhi me te wehenga o nga raina tohu kaha me nga raina whenua, ina koa i waenga i te ahua o te raina tohu me te papa.

Na te mea ko te honohono te hononga ngoikore i te mekameka porowhita, i te hoahoa RF, ko nga waahanga hiko o te waahi honohono te raru nui e pa ana ki te hoahoa hangarau, me tirotirohia ia waahanga honohono me te whakatau i nga raru o mua. Ko te honohono poari porowhita kei roto i te honohono poari maramara-ki-ara, hononga PCB me te hononga whakauru / whakaputa hononga i waenga PCB me nga taputapu o waho.

I. Te hononga i waenga i te maramara me te poari PCB

Ahakoa e pai ana tenei otinga, i marama ki nga kaiuru ko te hangarau hoahoa IC kei mua i mua i te hangarau hoahoa PCB mo nga tono hf.

Honoa PCB

Ko nga tikanga me nga tikanga mo te hoahoa PCB hf e whai ake nei:

1. Me whakamahi te koki 45 ° mo te kokonga raina whakawhiti hei whakaiti i te ngaronga o te hokinga (FIG. 1);

2 kiriweti uara tuturu kia rite ki te taumata o te tino whakahaere-nui-aarai-auri poari ara iahiko. He pai tenei tikanga mo te whakahaere pai i te mara aahiko i waenga i nga rauemi kiriuhi me nga waea taapiri.

3. Ko nga whakaritenga hoahoa PCB mo te whakairo tino teitei me whakapai ake. Whakaarohia te tohu he whanui whanui whanui o te +/- 0.0007 inihi, te whakahaere i te waahanga me nga waahanga whakawhiti o nga momo waea waea me te whakaatu i nga tikanga whakakikorua o te taha taha waea. Overall management of wiring (wire) geometry and coating surfaces is important to address skin effects related to microwave frequencies and to implement these specifications.

4. He tap he ki roto i nga tohu e putee ana. Kaua e whakamahi i nga waahanga me nga arahi. Mo nga taiao auau teitei, he pai ake te whakamahi i nga waahanga kua oti te whakanoho.

5. Mo te tohu na roto i nga poka, karo ki te whakamahi i te mahi PTH i runga i te pereti tairongo, na te mea ka taea e tenei mahinga te whakauru arataki i te poka. Lead inductance can affect layers 4 to 19 if a through-hole in a 20-ply board is used to connect layers 1 to 3.

6. Whakaratohia nga papanga papa whenua maha. Moulded holes are used to connect these grounding layers to prevent 3d electromagnetic fields from affecting the circuit board.

7. Hei kowhiri i te whakakikorua nickel kore-hiko i te mahinga whakakikorua koura rumaki ranei, kaua e whakamahi i te tikanga whakakikorua HASL. Ko tenei papa hiko e whakarato ana i te painga o te kiri pai ake mo nga auau-teitei (Whakaahua 2). In addition, this highly weldable coating requires fewer leads, helping to reduce environmental pollution.

8. Solder resistance layer can prevent solder paste from flowing. Heoi, na te kore papaku o te matotoru me te mahi kiriweti kaore i te mohiotia, ko te kapi i te mata o te pereti katoa me nga rauemi aukaha whakarake ka nui te rereketanga o te hiko hiko i te hoahoa microstrip. Generally, solderdam is used as welding resistance layer.

Mena kaore koe i te waia ki enei tikanga, ui atu ki tetahi kaipūkaha hoahoa mohio i mahi i nga papa ngaruiti ngaruiti mo te hoia. You can also discuss with them what price range you can afford. Hei tauira, he nui te ohanga ki te whakamahi i te hoahoa microstrip-a-koki-koki whakarahi i te hoahoa raina, ana ka taea e koe te korero ki a ratau kia pai ake ai nga tohutohu. Kaore pea nga miihini pai e waia ki te whakaaro mo te utu, engari he pai rawa atu a raatau tohutohu. He mahi mo te wa roa hei whakangungu i nga miihini taiohi kaore nei i te mohio ki nga paanga RF me te kore wheako ki te pa atu ki nga paanga RF.

Hei taapiri, ka taea te tango i etahi atu otinga, penei i te whakapai ake i te tauira rorohiko kia taea ai te whakahaere i nga paanga RF.

Honoa te PCB me nga taputapu o waho

Ka taea e maatau te kii kua whakaotihia e maatau nga raru whakahaere tohu katoa i runga i te papa me nga hononga honohono o nga waahanga wehe. Na me pehea te whakatau i te raru whakauru / whakaputa putanga mai i te poari ara iahiko ki te waea e hono ana i te taputapu mamao? Ko te TrompeterElectronics, he kaiwhakanao i te hangarau taura coaxial, e mahi ana mo tenei raru, aa, kua tino ahu whakamua ia (ahua 3). Also, take a look at the electromagnetic field shown in Figure 4 below. I tenei keehi, ka whakahaerehia e maatau te huri mai i te microstrip ki te taura coaxial. I roto i nga taura coaxial, ka honoa nga papa o te whenua ki roto i nga mowhiti ka rite te waahi. I roto i nga microbelts, kei raro te papa o te papa i te raina hohe. Ma tenei e whakaatu etahi awangawanga e tika ana kia maarama, kia matapae, kia whakaarohia i te waa hoahoa. Ae ra, ko tenei taupatupatu ka taea ano te whakahoki ki muri, me whakaitihia kia kore ai e haruru te haruru me te tohu.

Ko te whakahaere i te raru aukati o roto ehara i te raru hoahoa ka taea te karo. Ka tiimata te aukatinga ki te mata o te poari taiawhio, ka whakawhiti i tetahi hononga whakarewa ki te hononga, ka mutu i te taura coaxial. Na te mea ka rereke te rerekee ki te auau, ka teitei ake te auau, ka uaua te whakahaere aukati. The problem of using higher frequencies to transmit signals over broadband appears to be the main design problem.