The interconnect of lolomi laupapa matagaluega faiga aofia chip-i-matagaluega laupapa, fesoʻotaʻiga totonu PCB ma fesoʻotaʻiga i le va PCB ma fafo masini. In RF design, the electromagnetic characteristics at the interconnect point is one of the main problems faced by engineering design. This paper introduces various techniques of the above three types of interconnect design, including device installation methods, isolation of wiring and measures to reduce lead inductance.

E i ai faʻailoga o loʻo lolomi laupapa faʻataʻitaʻi o loʻo fuafuaina ma faʻateleina taimi. As data rates continue to increase, the bandwidth required for data transmission also pushes the signal frequency ceiling to 1GHz or higher. This high frequency signal technology, although far beyond the millimeter wave technology (30GHz), does involve RF and low-end microwave technology.

RF inisinia metotia fuafuaina metotia tatau ona mafai ona taulimaina le sili atu malosi electromagnetic fanua aafiaga e masani ona gaosia i maualuga maualuga. Nei electromagnetic fanua mafai ona faʻaoso faʻailo luga vavalalata laina faʻailo poʻo PCB laina, mafua ai le manaʻomia crosstalk (faʻalavelave ma le aofaʻi leo) ma faʻaleagaina faiga faʻagaioiga. Backloss is mainly caused by impedance mismatch, which has the same effect on the signal as additive noise and interference.

High return loss has two negative effects: 1. The signal reflected back to the signal source will increase the noise of the system, making it more difficult for the receiver to distinguish noise from signal; 2. 2. Soʻo se atagia faailo o le a matua faʻaleagaina le tulaga lelei o le faʻailoga ona o le foliga o le faʻauluina faʻailo suiga.

E ui lava o polokalame faʻafuainumera e matua faʻatagaina lava aua naʻo fefaʻatauaiga ma 1 ma le 0 faʻailo, o le fealofani na tupu a o oso le fatu i le saoasaoa maualuga mafuaʻaga o le faʻailoga e sili atu ona vaivai ile maualuga maualuga. E ui lava o le faʻasaʻo o mea sese i luma e mafai ona aveʻesea nisi o le le lelei aʻafiaga, o se vaega o le system bandwidth e faʻaaogaina e lafoina redundant faʻamaumauga, e mafua ai le faʻaleagaina o galuega. O se fofo sili atu o le i ai o RF aafiaga e fesoasoani nai lo le toʻesea mai faʻailoga faʻamaoni. E fautuaina o le aofaʻi o tupe toe faʻafoi i le maualuga taimi masani o se numera numera (masani lava o se le lelei faʻamaumauga tulaga) avea -25dB, tutusa ma le VSWR o le 1.1.

PCB design aims to be smaller, faster and less costly. Mo RFPCB, maualuga-saoasaoa faʻailoga i nisi taimi faʻatapulaʻaina le miniaturization o PCB ata. I le taimi nei, o le autu metotia e foʻia ai le faʻafitauli vaʻaia o le faʻataunuʻuina o le eleele fesoʻotaʻiga pulega, faʻataʻitaʻi le va i le va o le faʻapipiʻi ma faʻaitiitia ai le faʻauluina o le ulu. O le auala autu e faʻaititia ai le toe faʻafoi o le impedance tutusa. Lenei metotia aofia ai lelei le faʻatonutonuina o mea faʻaʻeseʻese ma tuʻusaʻoina o gaioiga faʻailo laina ma eleele laina, aemaise lava i le va o le setete o le faʻailoga laina ma le eleele.

Talu ai o le fesoʻotaʻiga o le sili ona vaivai soʻotaga i le matagaluega filifili, i le RF mamanu, o le eletise elemeni o le fesoʻotaʻiga manatu o le autu faafitauli o loʻo feagai ma inisinia, o soʻotaga fesoʻotaʻiga manatu e tatau ona suʻesuʻeina ma o loʻo i ai faʻafitauli foia. Fesoʻotaʻiga laupapa matagaluega e aofia ai fesoʻotaʻiga vaʻavaʻa-i-matagaluega, fesoʻotaʻiga PCB ma faʻailoga faʻaulufaleina / faʻatulaʻiga fesoʻotaʻiga i le va o PCB ma fafo masini.

I. Fesoʻotaʻiga i le va o le chips ma le PCB laupapa

Pe aoga le vaifofo pe leai, na manino i le au auai, o le IC design tekinolosi e mamao mamao atu PCB tisaini tisainiina mo hf apalai.

Fesoʻotaʻi PCB

O metotia ma metotia mo hf PCB tisaini e faʻapea:

1. O le 45 ° Angle e tatau ona faʻaaogaina mo le tulimanu laina laina e faʻaititia ai le toe faʻafoʻi (ATA. 1);

2 faʻaʻesega tumau taua tusa ai ma le tulaga o le matua pulea maualuga-faatinoga insulated laupapa matagaluega. O lenei metotia e aoga mo lelei faʻatonutonuina o le electromagnetic fanua i le va o mea faʻamamaina ma laina fesoʻotaʻi.

3. PCB tisaini faʻapitoa mo maualuga le saʻo etching tatau ona faʻaleleia. Mafaufau faʻapitoa e faʻatonu se aofaʻiga o le lautele laina sese o +/- 0.0007 inisi, faʻatonutonu undercut ma koluse vaega o uaea foliga ma faʻamaoti tuʻuga pa puipui pa puipui tulaga. Overall management of wiring (wire) geometry and coating surfaces is important to address skin effects related to microwave frequencies and to implement these specifications.

4. E i ai le tap inductance i protruding auala. Aloʻese mai le faʻaaogaina o vaega ma lead. Mo maualuga siʻosiʻomaga siʻosiʻomaga, e sili ona faʻaaoga luga tiʻetiʻe vaega.

5. Mo faʻailo e ala i pu, aloese mai le faʻaaogaina o le PTH gaioiga i luga o le maaleale ipu, aua o lenei gaioiga mafai mafua mafua inductance taʻimua i le ala pu. Lead inductance can affect layers 4 to 19 if a through-hole in a 20-ply board is used to connect layers 1 to 3.

6. Tuʻuina tele faʻaputuga eleele. Moulded holes are used to connect these grounding layers to prevent 3d electromagnetic fields from affecting the circuit board.

7. Ina ia filifili eletise eletise e leai se eletise poʻo le faʻatofuina o ufiufi auro, aua le faʻaogaina le metotia plating HASL. Lenei electroplated luga maua ai se sili paʻu lelei aafiaga mo maualuga-taimi feʻaveaʻi (Ata 2). In addition, this highly weldable coating requires fewer leads, helping to reduce environmental pollution.

8. Solder resistance layer can prevent solder paste from flowing. Ae ui i lea, ona o le le mautinoa o le mafiafia ma le le mautinoa faʻaaogaina faʻamamaina, ufiufi le atoa ipu luga ma solder tetee mea o le a taʻitaʻia ai se tele suiga i le electromagnetic malosi i microstrip mamanu. Generally, solderdam is used as welding resistance layer.

Afai e te le masani i nei metotia, faʻafesoʻotaʻi le poto masani tisaini inisinia na galue i luga o le microwave circuit laupapa mo le militeli. You can also discuss with them what price range you can afford. Mo se faʻataʻitaʻiga, e sili atu le tamaoaiga o le faʻaaogaina o se kopa e lagolagoina le Copopar microstrip design nai lo le stripline design, ma e mafai ona e talanoaina lenei mea ma latou e maua ai ni fautuaga sili atu. Lelei inisinia ono le masani i le mafaufau e uiga i tau, ae oa latou fautuaga e mafai ona fai lava fesoasoani. O le a avea ma se taimi umi galuega e toleni talavou inisinia oe le masani i RF aafiaga ma leai se poto masani i le feagai ai ma RF aafiaga.

I se faʻaopopoga, o isi fofo e mafai ona taliaina, e pei o le faʻaleleia o le komepiuta faʻataʻitaʻiga ina ia mafai ai ona faʻatautaia RF aafiaga.

PCB fesoʻotaʻi ma fafo masini

E mafai nei ona tatou faʻapea ua uma ona tatou foʻia uma faʻailoilo faʻafitauli faafitauli i luga o le laupapa ma luga o fesoʻotaʻiga o vavaeʻese vaega. Ia faʻafefea la ona e fofoina le faʻailoga ulufale / faʻafitauli faafitauli mai le matagaluega laupapa i le uaea fesoʻotaʻi le masini taumamao? O le TrompeterElectronics, ose tagata e faʻatupulaia i le uaea coaxial cable, o loʻo galue i lenei faʻafitauli ma ua alualu i luma lona taua (faʻatusa 3). Also, take a look at the electromagnetic field shown in Figure 4 below. I lenei tulaga, matou te puleaina le liua mai le microstrip i le coaxial cable. I uaea coaxial, o le eleele faaputuga e fesoʻotaʻi i mama ma tutusa avanoa. I totonu o microbelts, o le grounding layer o loʻo i lalo ifo o le laina ola. Lenei faʻalauiloaina nisi pito aʻafiaga e manaʻomia ia malamalama, valoʻia, ma iloiloina i le taimi fuafuaina. Ioe, o lenei le tutusa fetaui mafai foi ona taitai atu ai i backloss ma tatau ona faʻaititia e aloese ai mai le pisa ma faʻalavelave faʻalavelave.

Ole faʻatautaia ole faʻafitauli i totonu ole fale e leʻose faʻafitauli e mafai ona le amanaʻia. O le impedance amata i luga o le matagaluega laupapa, pasi i totonu o le soʻoga soʻoga i le soʻoga, ma faʻaiʻu i le uaea coaxial. Ona o le impedance e fesuisuiaʻi ma le tele o taimi, o le maualuga o le alualu i luma, o le sili atu ona faigata o le puleaina o faʻafitauli. The problem of using higher frequencies to transmit signals over broadband appears to be the main design problem.