The interconnect of yakadhindwa redunhu bhodhi Sisitimu inosanganisira chip-to-redunhu bhodhi, kubatana mukati mePCB uye kubatana pakati pePBB nemidziyo yekunze. In RF design, the electromagnetic characteristics at the interconnect point is one of the main problems faced by engineering design. This paper introduces various techniques of the above three types of interconnect design, including device installation methods, isolation of wiring and measures to reduce lead inductance.

Kune zviratidzo zvekuti akadhindwa wedunhu mabhodhi ari kugadzirwa nekuwedzera kuwanda. As data rates continue to increase, the bandwidth required for data transmission also pushes the signal frequency ceiling to 1GHz or higher. This high frequency signal technology, although far beyond the millimeter wave technology (30GHz), does involve RF and low-end microwave technology.

RF mainjiniya dhizaini nzira dzinogona kukwanisa kubata akasimba magetsi emagetsi mhedzisiro mhedzisiro ayo anowanzo kugadzirwa kumatunhu akakwirira. Aya magetsi emagetsi anokwanisa kukonzera masaini ari pedyo nemitsetse yemasaini kana mitsetse yePBB, zvichikonzera crosstalk isingadiwe (kupindirana neruzha ruzere) nekukuvadza mashandiro ehurongwa. Backloss is mainly caused by impedance mismatch, which has the same effect on the signal as additive noise and interference.

High return loss has two negative effects: 1. The signal reflected back to the signal source will increase the noise of the system, making it more difficult for the receiver to distinguish noise from signal; 2. 2. Chero chiratidzo chinoratidzirwa chinodzikisira mhando yechiratidzo nekuti chimiro chechiratidzo chekuisa chinoshanduka.

Kunyangwe dhijitari masisitimu ane mhosva kwazvo anoshivirira nekuti anongobata ne1 uye 0 zviratidzo, maamoni anogadzirwa kana kupomba kuri kukwira nekumhanya kwakanyanya kunoita kuti siginecha ive isina kusimba pamatanho epamusoro. Kunyangwe kumberi kukanganisa kururamisa kunogona kubvisa zvimwe zvakashata mhedzisiro, chikamu cheiyo system bandwidth inoshandiswa kuendesa yakawandisa dhata, zvichikonzera kuita kwekuita. Mhinduro irinani ndeyekuva neRF mhedzisiro iyo inobatsira pane kudzikamisa chiratidzo kubva pachiratidzo. Zvinokurudzirwa kuti kurasikirwa kwese kudzoka pahuwandu hwepamusoro hweiyo dhijitari system (kazhinji isina kunaka dhata poindi) ive -25dB, yakaenzana neVSWR ye1.1.

PCB design aims to be smaller, faster and less costly. For RFPCB, high-speed signals sometimes limit the miniaturization of PCB designs. Parizvino, nzira huru yekugadzirisa dambudziko rekuyambuka ndeyekuita manejimendi kubatanidza manejimendi, kuita nzvimbo pakati pewiring uye kudzora lead inductance. Iyo huru nzira yekudzora kudzoka kurasikirwa ndeye impedance inoenderana. Iyi nzira inosanganisira inoshanda manejimendi yezvinhu zvekudzivirira uye kusarudzika kwemitsara yemasaini anoshanda uye mitsara yepasi, kunyanya pakati penzvimbo yetambo yechiratidzo nepasi.

Nekuti iyo yekudyidzana ndiyo isina kusimba chinongedzo muketani cheni, muRF dhizaini, magetsi emagetsi epanzvimbo yekubatanidza ndiyo dambudziko rakakura rakatarisana neinjiniya dhizaini, yega yekubatanidza poindi inofanirwa kuferefetwa uye matambudziko aripo agadziriswa. Circuit board kubatanidza kunosanganisira chip-to-redunhu bhodhi kusangana, pcb yekubatana uye chiratidzo chekupinza / kuburitsa kubatana pakati pePCB neyekunze zvishandiso.

I. Kubatana pakati pechip uye pcb board

Kunyangwe mhinduro iyi ichishanda kana kwete, zvaive pachena kune vaipinda kuti IC dhizaini tekinoroji iri kumberi kwePCB dhizaini tekinoroji ye hf kunyorera.

Pcb inobatanidza

Iwo maitiro uye nzira dzeiyo hf pcb dhizaini ndeinotevera:

1. 45 ° Angle inofanira kushandiswa kune kona yekufambisa kona kudzikisa kurasikirwa kwekudzoka (FIG. 1);

2 kuputira kunogara kuchikosha zvinoenderana nedanho rekunyatso kudzora yepamusoro-kuita insulating wedunhu bhodhi. Iyi nzira inobatsira pakubata zvine mutsindo kwema electromagnetic field pakati pekudzivirira zvinhu uye padhuze newiring.

3.PBB dhizaini magadzirirwo emhando yepamusoro etching inofanirwa kuvandudzwa. Funga kudoma huwandu hwakazara hwemitsara upamhi hwe +/- 0.0007 inches, kutonga pasi pemuchinjikwa uye muchinjikwa zvikamu zvewiring maumbirwo uye kudoma wiring yemadziro madziro mamiriro. Overall management of wiring (wire) geometry and coating surfaces is important to address skin effects related to microwave frequencies and to implement these specifications.

4. Kune tapuro inductance mune yakabuda inotungamira. Dzivisa kushandisa zvinhu zvine lead. Kune akakwirira frequency nharaunda, zvakanakisa kushandisa nzvimbo dzakakwidzwa pamusoro.

5. Nechiratidzo kuburikidza nemakomba, dzivisa kushandisa iyo PTH maitiro pane yakaoma ndiro, sezvo maitiro aya anogona kukonzera lead inductance pane iyo kuburikidza gomba. Lead inductance can affect layers 4 to 19 if a through-hole in a 20-ply board is used to connect layers 1 to 3.

6. Ipa yakawanda ivhu matanda. Moulded holes are used to connect these grounding layers to prevent 3d electromagnetic fields from affecting the circuit board.

7. Kusarudza isiri-electrolysis nickel yakanamirwa pamvura kana kunyudza muitiro wegoridhe, usashandise HASL nzira yekupaka. Iyi electroplated pamusoro inopa nani ganda kuitika kweiyo yepamusoro-frequency masaisai (Mufananidzo 2). In addition, this highly weldable coating requires fewer leads, helping to reduce environmental pollution.

8. Solder resistance layer can prevent solder paste from flowing. Nekudaro, nekuda kwekusava nechokwadi kweukobvu uye kusazivikanwa kwekudzivirira mashandiro, kufukidza iyo yese ndiro pamusoro neiyo solder yekudzivirira zvinhu zvinotungamira kuchinjiro hombe mumagetsi emagetsi mu microstrip dhizaini. Generally, solderdam is used as welding resistance layer.

Kana iwe usiri kujairana neidzi nzira, bvunza ane ruzivo dhizaini injinjini akashanda pane microwave wedunhu mabhodhi euto. You can also discuss with them what price range you can afford. Semuenzaniso, zvinowedzera mari kushandisa mhangura-yakatsigirwaCoplanar microstrip dhizaini pane dhizaini dhizaini, uye iwe unogona kukurukura izvi navo kuti uwane zano riri nani. Mainjiniya akanaka anogona kunge asina kujaira kufunga nezve mutengo, asi kuraira kwavo kunogona kubatsira. Ichave iri basa renguva refu kudzidzisa mainjiniya madiki asingazive neRF mhedzisiro uye kushaya ruzivo mukubata neRF mhedzisiro.

Uye zvakare, dzimwe mhinduro dzinogona kutorwa, senge kuvandudza komputa modhi kuti ikwanise kubata maRF mhedzisiro.

Pcb inobatana nemidziyo yekunze

Isu tinogona ikozvino kufunga kuti tagadzirisa ese mamatambudziko manejimendi manejimendi pabhodhi uye nekubatana kwezvinhu zvakasangana. Saka unogadzirisa sei chinongedzo chekuisa / chekuburitsa chinetso kubva kudunhu redunhu kuenda kune iyo tambo inobatanidza mudziyo uri kure? TrompeterElectronics, mugadziri mucoaxial cable technology, iri kushanda padambudziko iri uye yaita kufambira mberi kwakakosha (mufananidzo 3). Also, take a look at the electromagnetic field shown in Figure 4 below. Mune ino kesi, isu tinogadzirisa shanduko kubva ku microstrip kuenda kune coaxial tambo. Mune tambo dzakaunganidzwa, zvidimbu zvepasi zvakapindirana mumhete uye zvakaenzana zvakapatsanurwa. Mune ma microbelts, hwaro hwevhu huri pasi pemutsara unoshanda. Izvi zvinounza mimwe mhedzisiro mhedzisiro inoda kunzwisiswa, kufanotaurwa, uye kutariswa panguva yekugadzira. Ehezve, kusarongeka uku kunogona zvakare kutungamira mukudzokera kumashure uye kunofanirwa kudzikiswa kudzivirira ruzha uye kupindirana kwemasaini.

Iwo manejimendi wedambudziko remukati remhedzisiro harisi dambudziko dhizaini iro rinogona kufuratirwa. Iyo impedance inotangira pamusoro penzvimbo yebhodhi redunhu, inodarika nepakati peiyo solder mubatanidzwa, uye inopera pane iyo coaxial tambo. Nekuti impedance inosiyana ne frequency, iyo yakakwira iyo frequency, iyo yakanyanya kuoma impedance manejimendi iri. The problem of using higher frequencies to transmit signals over broadband appears to be the main design problem.