The interconnect of boto ea potoloho e hatisitsoeng Sisteme e kenyelletsa boto ea chip-to-circuit, khokahano kahare ho PCB le khokahano lipakeng tsa PCB le lisebelisoa tsa kantle. In RF design, the electromagnetic characteristics at the interconnect point is one of the main problems faced by engineering design. This paper introduces various techniques of the above three types of interconnect design, including device installation methods, isolation of wiring and measures to reduce lead inductance.

Ho na le matšoao a hore liboto tsa potoloho tse hatisitsoeng li ntse li etsoa ka makhetlo a ntseng a eketseha. As data rates continue to increase, the bandwidth required for data transmission also pushes the signal frequency ceiling to 1GHz or higher. This high frequency signal technology, although far beyond the millimeter wave technology (30GHz), does involve RF and low-end microwave technology.

Mekhoa ea boenjiniere ea RF e tlameha ho sebetsana le litlamorao tse matla tsa motlakase oa motlakase tse atisang ho hlahisoa maemong a holimo. Masimo ana a motlakase a ka baka lipontšo melaong e haufi ea li-signal kapa mela ea PCB, a baka crosstalk e sa rateheng (tšitiso le lerata le felletseng) le ts’ebetso e mpe ea sistimi. Backloss is mainly caused by impedance mismatch, which has the same effect on the signal as additive noise and interference.

High return loss has two negative effects: 1. The signal reflected back to the signal source will increase the noise of the system, making it more difficult for the receiver to distinguish noise from signal; 2. 2. Letšoao lefe kapa lefe le bonts’itsoeng le tla nyenyefatsa boleng ba lets’oao hobane sebopeho sa lets’oao la ho kenya se fetoha.

Le ha litsamaiso tsa dijithale li mamella liphoso haholo hobane li sebetsana feela le matšoao a 1 le 0, li-harmoniki tse hlahisoang ha pulse e ntse e phahama ka lebelo le phahameng e baka hore lets’oao le fokotsehe maemong a phahameng. Le ha khalemelo ea liphoso tse ka pele e ka felisa tse ling tsa litlamorao tse mpe, karolo ea bandwidth ea sistimi e sebelisetsoa ho fetisa tlhaiso-leseling e sa hlokahaleng, e hlahisang tšenyeho ea ts’ebetso. Tharollo e betere ke ho ba le litlamorao tsa RF tse thusang ho fapana le ho theola seriti. Ho kgothaletswa hore tahlehelo eohle ea ho khutla maemong a phahameng ka ho fetesisa a sistimi ea dijithale (hangata ntlha e fosahetseng ea data) e be -25dB, e lekanang le VSWR ea 1.1.

PCB design aims to be smaller, faster and less costly. For RFPCB, high-speed signals sometimes limit the miniaturization of PCB designs. Hajoale, mokhoa o ka sehloohong oa ho rarolla bothata ba ho tlola ke ho tsamaisa taolo ea khokahano ea mobu, ho etsa sebaka lipakeng tsa wiring le ho fokotsa ho kenella ha lead. Mokhoa o ka sehloohong oa ho fokotsa tahlehelo ea ho khutla ke ho ts’oana ha impedance. Mokhoa ona o kenyelletsa taolo e sebetsang ea lisebelisoa tsa ho koala le ho itšehla thajana ha mela e sebetsang ea leqhubu le mela ea fatše, haholoholo lipakeng tsa boemo ba mola oa lets’oao le mobu.

Hobane khokahano ke sehokelo se fokolang ka ho fetesisa ketaneng ea potoloho, ho moralo oa RF, thepa ea motlakase ea sebaka sa khokahano ke bothata bo boholo bo shebaneng le moralo oa boenjineri, ntlha e ngoe le e ngoe ea khokahano e lokela ho batlisisoa ebe ho rarolloa mathata a teng. Khokahano ea boto ea potoloho e kenyelletsa khokahano ea boto ea pot-to-circuit, khokahano ea PCB le khokahano ea ho kenya / ho hlahisa lipontšo lipakeng tsa PCB le lisebelisoa tsa kantle.

I.Kopanyo pakeng tsa chip le board ea PCB

Hore na tharollo ena ea sebetsa kapa che, ho ne ho hlakile ho ba tlileng kopanong hore theknoloji ea meralo ea IC e hole haholo le theknoloji ea moralo oa PCB bakeng sa lits’ebetso tsa hf.

Khokahano ea PCB

Mekhoa le mekhoa ea moralo oa hf PCB ke tse latelang:

1. Ho lokela ho sebelisoa Angle ea 45 ° bakeng sa sekhutlo sa mohala oa phetisetso ho fokotsa tahlehelo ea ho khutla (SEAKI 1);

2 boleng ba boleng bo sa feleng ho latela boemo ba boto ea potoloho e laoloang ka thata e sebetsang hantle. Mokhoa ona o na le molemo bakeng sa taolo e sebetsang ea tšimo ea motlakase pakeng tsa lisebelisoa tse sirelletsang le likhoele tse haufi.

3. PCB moralo tobileng bakeng sa phahameng sebetsa ka ho nepahetseng mananose lokela ho ntlafatsoa. Nahana ka ho hlakisa phoso e felletseng ea bophara ba lisenthimithara tse +/- 0.0007, ho laola likarolo tse katiloeng ka tlase le tse fapaneng tsa libopeho tsa wiring le ho hlakisa maemo a mabota a lehlakoreng la wiring. Overall management of wiring (wire) geometry and coating surfaces is important to address skin effects related to microwave frequencies and to implement these specifications.

4. Ho na le phallo ea pompong litselaneng tse hlahelletseng. Qoba ho sebelisa likarolo tse nang le lead. Bakeng sa libaka tse nang le maqhubu a phahameng, ho molemo ho sebelisa likarolo tse holim’a metsi.

5. Bakeng sa lets’oao ka masoba, qoba ho sebelisa ts’ebetso ea PTH poleiting e hlokolosi, hobane ts’ebetso ena e ka baka tšusumetso e lebisang ho lesoba. Lead inductance can affect layers 4 to 19 if a through-hole in a 20-ply board is used to connect layers 1 to 3.

6. Fana ka likarolo tse ngata tsa mobu. Moulded holes are used to connect these grounding layers to prevent 3d electromagnetic fields from affecting the circuit board.

7. Ho khetha lilakane tse sa sebeliseng electrolysis kapa ho qoelisoa ka khauta, u se ke ua sebelisa mokhoa oa ho roala HASL. This electroplated surface provides a better skin effect for high-frequency currents (Figure 2). In addition, this highly weldable coating requires fewer leads, helping to reduce environmental pollution.

8. Solder resistance layer can prevent solder paste from flowing. Leha ho le joalo, ka lebaka la ho se ts’oanehe ha botenya le ts’ebetso e sa tsejoeng ea ho koala, ho koahela bokaholimo bohle ba poleiti ka thepa ea ho hanyetsa solder ho tla lebisa phetohong e kholo ho matla a motlakase ho moralo oa microstrip. Generally, solderdam is used as welding resistance layer.

Haeba o sa tloaelane le mekhoa ena, ikopanye le moenjiniere oa boqapi ea nang le boiphihlelo ea sebelitseng libotong tsa potoloho ea microwave bakeng sa sesole. You can also discuss with them what price range you can afford. Mohlala, ho na le chelete e ngata ho sebelisa moralo oa koporo o tšehelitsoeng ka koporo ho feta moralo oa marang-rang, ‘me u ka buisana ka sena le bona ho fumana likeletso tse betere. Baenjiniere ba hantle ba kanna ba se tloaetse ho nahana ka litšenyehelo, empa likeletso tsa bona li ka ba thusa haholo. E tla ba mosebetsi oa nako e telele ho koetlisa baenjiniere ba bacha ba sa tsebeng litlamorao tsa RF le ho hloka boiphihlelo ba ho sebetsana le litlamorao tsa RF.

Ntle le moo, ho ka amoheloa tharollo tse ling, joalo ka ho ntlafatsa mofuta oa likhomphutha ho khona ho sebetsana le litlamorao tsa RF.

PCB e hokahana le lisebelisoa tsa kantle

Joale re ka nahana hore re rarollotse mathata ohle a taolo ea matšoao ho board le likhokahanong tsa likarolo tse arohaneng. Joale o rarolla bothata ba ho kenya / ho hlahisa ponts’o ho tloha boto ea potoloho ho ea terateng e hokahanyang sesebelisoa se hole. TrompeterElectronics, moqapi oa theknoloji ea cable ea coaxial, o sebetsana le bothata bona mme o entse tsoelo-pele ea bohlokoa (setšoantšo sa 3). Also, take a look at the electromagnetic field shown in Figure 4 below. Maemong ana, re laola phetoho ho tloha microstrip ho ea ho cable ea coaxial. Ka likhoele tsa coaxial, likarolo tsa mobu li hokahantsoe ka mehele ebile li arotsoe ka mokhoa o ts’oanang. Ka li-microbelts, lera la fatše le ka tlase ho mola o sebetsang. Sena se hlahisa litlamorao tse itseng tse hlokang ho utloisisoa, ho boleloa esale pele, le ho nahanoa ka nako ea moralo. Ehlile, ho se ts’oane hantle hona ho ka lebisa ho ts’enyeho hape ‘me ho tlameha ho fokotsoa ho qoba lerata le tšitiso ea lets’oao.

Tsamaiso ea bothata ba impedance ea kahare ha se bothata ba moralo bo ka hlokomolohuoang. The impedance starts at the surface of the circuit board, passes through a solder joint to the joint, and ends at the coaxial cable. Hobane impedance e fapana ka makhetlo, ha maqhubu a phahama, taolo ea impedance e thata le ho feta. The problem of using higher frequencies to transmit signals over broadband appears to be the main design problem.