The interconnect of bolodi losindikizidwa Dongosolo limaphatikizapo bolodi ya chip-to-dera, kulumikizana mkati mwa PCB ndi kulumikizana pakati pa PCB ndi zida zakunja. In RF design, the electromagnetic characteristics at the interconnect point is one of the main problems faced by engineering design. This paper introduces various techniques of the above three types of interconnect design, including device installation methods, isolation of wiring and measures to reduce lead inductance.

Pali zikwangwani zosonyeza kuti matabwa osindikizidwa amapangidwa pafupipafupi. As data rates continue to increase, the bandwidth required for data transmission also pushes the signal frequency ceiling to 1GHz or higher. This high frequency signal technology, although far beyond the millimeter wave technology (30GHz), does involve RF and low-end microwave technology.

Njira zopangira ukadaulo wa RF ziyenera kuthana ndi zovuta zamagetsi zamagetsi zomwe zimapangidwa pama frequency apamwamba. Magawo amagetsi amagetsiwa amatha kuyambitsa zikwangwani pamizere yoyandikana nayo kapena mizere ya PCB, zomwe zimayambitsa crosstalk (kusokoneza ndi phokoso lathunthu) ndikuwononga magwiridwe antchito. Backloss is mainly caused by impedance mismatch, which has the same effect on the signal as additive noise and interference.

High return loss has two negative effects: 1. The signal reflected back to the signal source will increase the noise of the system, making it more difficult for the receiver to distinguish noise from signal; 2. 2. Chizindikiro chilichonse chomwe chikuwonetsedwa chimachepetsa mtundu wa chizindikirocho chifukwa mawonekedwe a chizindikiro cholowera amasintha.

Ngakhale makina amama digito amakhala ololera kwambiri chifukwa amangogwira ndi ma 1 ndi 0, ma harmoniki omwe amapangidwa pomwe kuthamanga kukukwera kwambiri kumapangitsa kuti chizindikirocho chikhale chofooka pama frequency apamwamba. Ngakhale kukonza zolakwika kutsogolo kumatha kuthana ndi zovuta zina, gawo lina la magwiridwe antchito limagwiritsidwa ntchito pofalitsa zosowa, zomwe zimapangitsa kuwonongeka kwa magwiridwe antchito. Yankho labwinoko ndikukhala ndi zotsatira za RF zomwe zimathandiza m’malo mochotsa kukhulupirika pazizindikiro. Ndikulimbikitsidwa kuti kubweza konsekonse pafupipafupi kwambiri kwama digito (nthawi zambiri malo osavomerezeka) akhale -25dB, wofanana ndi VSWR wa 1.1.

PCB design aims to be smaller, faster and less costly. Kwa RFPCB, zizindikilo zothamanga kwambiri nthawi zina zimachepetsa kuchepa kwamapangidwe a PCB. Pakadali pano, njira yayikulu yothanirana ndi vuto lakugawika ndikuchita kasamalidwe ka nthaka, kuyala pakati pa zingwe ndikuchepetsa kutsogolera. Njira yayikulu yochepetsera kubweza ndikufananira kwa impedance. Njirayi imaphatikizapo kuyendetsa bwino zinthu zotchingira ndikudzipatula kwa mizere yolumikizira ndi mizere yapansi, makamaka pakati pa mzere wazizindikiro ndi nthaka.

Chifukwa kulumikizana ndi cholumikizira chofooka kwambiri munyanjayi, mu kapangidwe ka RF, mawonekedwe amagetsi am’magawo olumikizirana ndiye vuto lalikulu lomwe likukumana ndi kapangidwe ka uinjiniya, gawo lililonse lolumikizirana liyenera kufufuzidwa ndikuthetsa mavuto omwe alipo kale. Kulumikizana kwa bolodi la dera kumaphatikizira kulumikizana kwa board-to-dera, kulumikizana kwa PCB ndi kulumikizana kwa kulowetsa / kulumikizana kwa siginecha pakati pa PCB ndi zida zakunja.

Kulumikizana pakati pa chip ndi bolodi la PCB

Kaya yankho ili likugwira ntchito kapena ayi, zinali zowonekeratu kwa omwe anali pamsonkhanowu kuti ukadaulo wopanga wa IC ukutsogola kwambiri kwa ukadaulo wa PCB wopangira hf.

Kuyanjana kwa PCB

Maluso ndi njira zopangira hf PCB ndi izi:

1. Angle ya 45 ° iyenera kugwiritsidwa ntchito pakona yolumikizira kuti ichepetse kubwerera (CHITSANZO 1);

2 kutchinjiriza mtengo wokhazikika molingana ndi mulingo wa bolodi loyang’anira bwino lomwe limayendetsa bwino. Njirayi ndiyothandiza pakuwongolera bwino maginito amagetsi pakati pazotetezera ndi zingwe zoyandikana nazo.

3. PCB kapangidwe specifications kwa mwatsatanetsatane mkulu mwatsatanetsatane ayenera bwino. Ganizirani kutanthauzira zolakwika zonse zazitali za +/- 0.0007 mainchesi, kuyang’anira magawo odula ndi owoloka ndikuwonetsetsa zokutira zammbali zazingwe. Overall management of wiring (wire) geometry and coating surfaces is important to address skin effects related to microwave frequencies and to implement these specifications.

4. Pali kutengeka kwapompopompopompo potuluka. Pewani kugwiritsa ntchito zigawo ndizotsogolera. M’malo okhala pafupipafupi, ndibwino kugwiritsa ntchito zinthu zokhala pamwamba.

5. Kuti mumveke kudzera m’mabowo, pewani kugwiritsa ntchito njira ya PTH pa mbale yovuta, chifukwa njirayi imatha kuyambitsa kutulutsa pobowola. Lead inductance can affect layers 4 to 19 if a through-hole in a 20-ply board is used to connect layers 1 to 3.

6. Perekani nthaka yambiri. Moulded holes are used to connect these grounding layers to prevent 3d electromagnetic fields from affecting the circuit board.

7. Kusankha ma plating osagwiritsa ntchito electrolysis kapena kumiza golide, musagwiritse ntchito njira ya HASL. Malo opangira magetsiwa amapereka khungu labwino pamafupipafupi (Chithunzi 2). In addition, this highly weldable coating requires fewer leads, helping to reduce environmental pollution.

8. Solder resistance layer can prevent solder paste from flowing. Komabe, chifukwa chakusatsimikizika kwa makulidwe ndi magwiridwe antchito osadziwika, kutsekera gawo lonse la mbale ndi zotsekemera za solder kudzatsogolera kusintha kwakukulu kwamagetsi amagetsi mu kapangidwe ka microstrip. Generally, solderdam is used as welding resistance layer.

Ngati simukudziwa bwino njirazi, funsani katswiri wodziwa zamagetsi yemwe wagwirapo ntchito yama board a microwave azankhondo. You can also discuss with them what price range you can afford. Mwachitsanzo, ndizosowa ndalama kwambiri kugwiritsa ntchito chopangira ma microprip chopangidwa ndi mkuwa kuposa chojambula pamizere, ndipo mutha kukambirana izi kuti mupeze upangiri wabwino. Akatswiri abwino sangazolowere kulingalira za mtengo, koma upangiri wawo ukhoza kukhala wothandiza kwambiri. Idzakhala ntchito yayitali kuphunzitsa mainjiniya achichepere omwe sadziwa zotsatira za RF ndipo alibe chidziwitso chothana ndi zovuta za RF.

Kuphatikiza apo, mayankho ena atha kutengedwa, monga kukonza makompyuta kuti athe kuthana ndi zotsatira za RF.

PCB yolumikizana ndi zida zakunja

Tsopano titha kuganiza kuti tathetsa mavuto onse oyang’anira ma siginolo pa bolodi komanso kulumikizana kwa zinthu zophatikizika. Ndiye mumathetsa bwanji vuto lolowetsa / kutulutsa kuchokera ku board board kupita pa waya yolumikiza chida chakutali? TrompeterElectronics, wopanga ukadaulo wa coaxial cable, akugwira ntchitoyi ndipo wapita patsogolo kwambiri (chithunzi 3). Also, take a look at the electromagnetic field shown in Figure 4 below. Poterepa, timatha kusintha kuchokera pa microstrip kupita pa chingwe cha coaxial. Mu zingwe za coaxial, zigawo zapansi zimaphatikizana m’makona komanso mofanana. Mu ma microbelts, wosanjikiza pansi ndi mzere wogwira. Izi zimabweretsa zovuta zina zakumapeto zomwe zimayenera kumvedwa, kunenedweratu, ndikuganiziridwa panthawi yakapangidwe. Zachidziwikire, kusayanjananso kumeneku kumatha kubweretsanso kubwerera m’mbuyo ndipo kuyenera kuchepetsedwa kupewa phokoso ndi kusokonekera kwa siginecha.

Kuwongolera kwa vuto lamkati lamkati si vuto lakapangidwe lomwe linganyalanyazidwe. Mpweyawo umayambira pamwamba pa bolodi la dera, umadutsa olumikizirana ndi solder, ndipo umathera pa chingwe cha coaxial. Chifukwa impedance imasiyanasiyana pafupipafupi, ikachulukirachulukira, zovuta kwambiri pakuwongolera ma impedance. The problem of using higher frequencies to transmit signals over broadband appears to be the main design problem.