The interconnect of ibhodi yesifunda ephrintiwe Uhlelo lufaka ibhodi le-chip-to-circuit, ukuxhumana ngaphakathi kwe-PCB nokuxhumana phakathi kwe-PCB namadivayisi angaphandle. In RF design, the electromagnetic characteristics at the interconnect point is one of the main problems faced by engineering design. This paper introduces various techniques of the above three types of interconnect design, including device installation methods, isolation of wiring and measures to reduce lead inductance.

Kunezimpawu zokuthi amabhodi wesifunda aphrintiwe aklanywa ngemvamisa ekhulayo. As data rates continue to increase, the bandwidth required for data transmission also pushes the signal frequency ceiling to 1GHz or higher. This high frequency signal technology, although far beyond the millimeter wave technology (30GHz), does involve RF and low-end microwave technology.

Izindlela zokwakhiwa kobunjiniyela be-RF kumele zikwazi ukusingatha imiphumela enamandla yensimu ye-electromagnetic evame ukwenziwa kumaza aphezulu. Lezi zinkambu zikagesi zingadala amasignali kolayini besiginali abaseduze noma olayini be-PCB, kubangele i-crosstalk engathandeki (ukuphazamiseka nomsindo ophelele) nokulimaza ukusebenza kohlelo. Backloss is mainly caused by impedance mismatch, which has the same effect on the signal as additive noise and interference.

High return loss has two negative effects: 1. The signal reflected back to the signal source will increase the noise of the system, making it more difficult for the receiver to distinguish noise from signal; 2. 2. Noma isiphi isinali esiboniswayo empeleni sizolulaza ikhwalithi yesignali ngoba ukuma kwesiginali yokufaka kuyashintsha.

Yize izinhlelo zedijithali zibekezelela amaphutha kakhulu ngoba zibhekana kuphela nezimpawu ezi-1 nezingu-0, ama-harmoniki akhiqizwa lapho i-pulse ikhuphuka ngejubane eliphezulu ibanga ukuthi isignali ibe buthakathaka kumaza aphezulu. Yize ukulungiswa kwephutha lokuya phambili kungasusa eminye yemiphumela emibi, ingxenye ye-bandwidth yesistimu isetshenziselwa ukudlulisa idatha engafuneki, okuholela ekwehleni kokusebenza. Isixazululo esingcono ukuthi sibe nemiphumela ye-RF esiza kunokunciphisa ubuqotho besiginali. Kunconywa ukuthi ukulahlekelwa okuphelele kokubuyisa kumvamisa ophakeme kakhulu wohlelo lwedijithali (imvamisa iphuzu ledatha elibi) kube -25dB, okulingana ne-VSWR ka-1.1.

Ukwakhiwa kwe-PCB kuhlose ukuba kuncane, kusheshe futhi kungabizi kakhulu. Kwi-RFPCB, amasiginali wejubane ngesinye isikhathi anciphisa ukusebenza kancane kwemiklamo ye-PCB. Njengamanje, indlela eyinhloko yokuxazulula inkinga ye-crosseration ukwenza ukuphathwa kokuxhumeka komhlaba, ukwenza izikhala phakathi kwezintambo nokunciphisa ukungeniswa kokuhola. Indlela esemqoka yokwehlisa ukulahleka kokubuyisa ukufana kwe-impedance. Le ndlela ifaka ukuphathwa okusebenzayo kwezinto zokwambathisa kanye nokuhlukaniswa kolayini besiginali osebenzayo nolayini bomhlaba, ikakhulukazi phakathi kwesimo sentambo yesiginali nomhlabathi.

Ngoba ukuxhumana kuyisixhumanisi esibuthakathaka kunketango yesekethe, ekwakhiweni kwe-RF, amandla kagesi ephoyinti lokuxhuma yinkinga enkulu ebhekene nokwakhiwa kobunjiniyela, iphoyinti ngalinye lokuxhuma kufanele liphenywe futhi kuxazululwe izinkinga ezikhona. Ukuxhumeka kwebhodi lesifunda kufaka ukuxhumana kwebhodi le-chip-to-circuit, ukuxhumana kwe-PCB nokuxhuma kokufaka / kokukhipha kwesiginali phakathi kwe-PCB namadivayisi angaphandle.

Ukuxhumeka phakathi kwebhodi le-chip nebhodi le-PCB

Ukuthi lesi sixazululo siyasebenza noma cha, bekucacele kwababekhona ukuthi ubuchwepheshe bokuklama be-IC buhamba phambili kakhulu kobuchwepheshe bokwakha be-PCB bezicelo ze-hf.

Ukuxhumana kwe-PCB

Amasu nezindlela zokwakhiwa kwe-hf PCB zimi kanje:

1. I-Angle engu-45 ° kufanele isetshenziselwe ikhoneni lomugqa wokudlulisa ukunciphisa ukulahlekelwa okubuyayo (ISITHOMBE 1);

2 ukwahlukanisa okungaguquguquki ngokuya ngezinga lebhodi lesifunda eliqinile elilawulwa ngokuqinile. Le ndlela inenzuzo ekuphathweni okusebenzayo kwensimu ye-electromagnetic phakathi kokuvikela izinto nentambo eseduze.

3.Izincazelo zomklamo we-PCB wokunemba okuphezulu kufanele kuthuthukiswe. Cabanga ukucacisa iphutha lobubanzi bomugqa eliphelele lama- +/- 0.0007 amayintshi, ukuphatha izingxenye ezingaphansi nezinqamulelayo zezimo zewiring nokucacisa izimo zensimbi esehlangothini lodonga. Overall management of wiring (wire) geometry and coating surfaces is important to address skin effects related to microwave frequencies and to implement these specifications.

4. Kukhona ukuthambeka kokuthinta kumikhondo evelayo. Gwema ukusebenzisa izinto ezinemikhombandlela. Ezingxenyeni zemvamisa ephezulu, kungcono ukusebenzisa izinto ezibekwe ngaphezulu.

5. Ukuze uthole isignali ngezimbobo, gwema ukusebenzisa inqubo ye-PTH kupuleti elibucayi, ngoba le nqubo ingadala ukuhola kokungena emgodini. Lead inductance can affect layers 4 to 19 if a through-hole in a 20-ply board is used to connect layers 1 to 3.

6. Nikeza izingqimba zomhlaba eziningi. Moulded holes are used to connect these grounding layers to prevent 3d electromagnetic fields from affecting the circuit board.

7. Ukukhetha i-non-electrolysis nickel plating noma inqubo yokucwiliswa kwegolide, ungasebenzisi indlela ye-HASL plating. Le ndawo ene-electroplated inikeza umphumela wesikhumba ongcono wemisinga yamaza aphezulu (Umfanekiso 2). In addition, this highly weldable coating requires fewer leads, helping to reduce environmental pollution.

8. Solder resistance layer can prevent solder paste from flowing. Kodwa-ke, ngenxa yokungaqiniseki kobukhulu nokusebenza okungaziwa kwe-insulation, ukumboza yonke indawo yepuleti ngezinto zokumelana ne-solder kuzoholela ekuguqukeni okukhulu kwamandla kagesi ku-microstrip design. Generally, solderdam is used as welding resistance layer.

Uma ungazazi lezi zindlela, thintana nonjiniyela wokuklama onolwazi osebenze kumabhodi wesifunda ama-microwave ezempi. You can also discuss with them what price range you can afford. Isibonelo, kuyonga kakhulu ukusebenzisa idizayini enesipele seCoplanar microstrip kunokwakhiwa komugqa owudonsayo, futhi ungaxoxa ngalokhu nabo ukuthola izeluleko ezingcono. Onjiniyela abahle kungenzeka abakujwayele ukucabanga ngezindleko, kepha izeluleko zabo zingasiza kakhulu. Kuzoba ngumsebenzi wesikhathi eside ukuqeqesha onjiniyela abasha abangajwayele imiphumela ye-RF nokuntula ulwazi ekubhekaneni nemiphumela ye-RF.

Ngaphezu kwalokho, ezinye izixazululo zingasetshenziswa, njengokuthuthukisa imodeli yekhompyutha ukuze ikwazi ukusingatha imiphumela ye-RF.

Ukuxhuma kwe-PCB namadivayisi angaphandle

Manje sesingacabanga ukuthi sizixazulule zonke izinkinga zokuphathwa kwesiginali ebhodini nasekuxhumaneni kwezinto ezihlukile. Ngakho-ke uyixazulula kanjani inkinga yokufaka / yokukhipha yesiginali kusuka ebhodini lesifunda kuya ocingweni oluxhuma idivayisi ekude? I-TrompeterElectronics, umqambi wobuchwepheshe bekhebula le-coaxial, isebenza kule nkinga futhi yenza inqubekela phambili ebalulekile (umdwebo 3). Also, take a look at the electromagnetic field shown in Figure 4 below. Kulokhu, silawula ukuguqulwa kusuka ku-microstrip kuya kukhebula le-coaxial. Ezintanjeni ze-coaxial, izingqimba zomhlaba ziphakathi kwamasongo futhi zihlukaniswe ngokulinganayo. Kuma-microbelts, ungqimba lokubeka phansi lungaphansi komugqa osebenzayo. Lokhu kwethula imiphumela ethile yemiphetho edinga ukuqondwa, ukubikezelwa, nokucatshangelwa ngesikhathi sokuklanywa. Vele, lokhu kungahambisani nakho kungaholela ekubuyiseleni emuva futhi kufanele kuncishiswe ukugwema umsindo nokuphazamiseka kwesiginali.

Ukuphathwa kwenkinga yangaphakathi ye-impedance akuyona inkinga yokuklama enganakwa. I-impedance iqala ebusweni bebhodi lesifunda, idlule ngokuhlangana kwe-solder kuya ejoyini, bese iphelela kukhebula le-coaxial. Ngoba i-impedance iyahluka ngokuvama, ukuphakama kwemvamisa, ukuphathwa kwe-impedance kunzima kakhulu. The problem of using higher frequencies to transmit signals over broadband appears to be the main design problem.