The interconnect of ibhodi yesekethe eprintiweyo Inkqubo ibandakanya ibhodi ye-chip-to-circuit, uqhagamshelo ngaphakathi kwe-PCB kunye nokunxibelelana phakathi kwe-PCB kunye nezixhobo zangaphandle. In RF design, the electromagnetic characteristics at the interconnect point is one of the main problems faced by engineering design. This paper introduces various techniques of the above three types of interconnect design, including device installation methods, isolation of wiring and measures to reduce lead inductance.

Kukho imiqondiso yokuba iibhodi zesekethe eziprintiweyo ziyilelwe ngokwanda rhoqo. As data rates continue to increase, the bandwidth required for data transmission also pushes the signal frequency ceiling to 1GHz or higher. This high frequency signal technology, although far beyond the millimeter wave technology (30GHz), does involve RF and low-end microwave technology.

Iindlela zokuyila zobunjineli zeRF kufuneka zikwazi ukusingatha iimpembelelo zamandla ombane ezisebenza ngombane eziqhele ukwenziwa kumaza aphezulu. La macandelo ombane anokubangela imiqondiso kwimigca yeempawu ezikufutshane okanye kwimigca yePCB, ebangela ukungathandeki (ukuphazamiseka nengxolo iyonke) kunye nokwenzakala kwenkqubo. Backloss is mainly caused by impedance mismatch, which has the same effect on the signal as additive noise and interference.

High return loss has two negative effects: 1. The signal reflected back to the signal source will increase the noise of the system, making it more difficult for the receiver to distinguish noise from signal; 2. 2. Nawuphi na umqondiso obonakalisiweyo uya kuwuthoba umgangatho wesiginali ngenxa yokuba ubume bemiqondiso yegalelo buyatshintsha.

Nangona iinkqubo zedijithali zinganyamezeli iimpazamo kuba zijongana kuphela nomqondiso we-1 kunye no-0, iiharmonics ezivelisiweyo xa ukubetha kwentliziyo kukhula ngesantya esiphezulu kubangela ukuba umqondiso ube buthathaka kumaza aphezulu. Nangona ukulungiswa kwempazamo phambili kunokususa ezinye zeziphumo ezibi, inxenye yendlela ye-bandwidth isetyenziselwa ukuhambisa idatha engafunekiyo, ekhokelela ekonakaleni kokusebenza. Isisombululo esingcono kukuba sibe neziphumo zeRF ezinceda endaweni yokuphazamisa ukuthembeka komqondiso. Kuyacetyiswa ukuba ilahleko iyonke yokubuya kwelona qondo liphezulu lenkqubo yedijithali (ihlala iyindawo yedatha engalunganga) ibe -25dB, elingana ne-VSWR ka-1.1.

PCB design aims to be smaller, faster and less costly. Kwi-RFPCB, imiqondiso yesantya esiphezulu ngamanye amaxesha inciphisa ukuthathwa kancinci kwe-PCB yoyilo. Okwangoku, eyona ndlela iphambili yokusombulula ingxaki enqamlezileyo kukwenza ulawulo loqhagamshelo lomhlaba, ukwenza isithuba phakathi kweentambo kunye nokunciphisa ukungafakwanga. Eyona ndlela iphambili yokunciphisa ilahleko yokubuyisa kukuhambelana kwe-impedance. Le ndlela ibandakanya ulawulo olusebenzayo lwezixhobo zokugquma kunye nokubekwa ecaleni kwemigca yesiginali esisebenzayo kunye nemigca yomhlaba, ngakumbi phakathi kwesimo somgca womqondiso kunye nomhlaba.

Ngenxa yokuba unxibelelwano lolona buthathaka lubuthathaka kwityathanga lesekethe, kuyilo lweRF, iipropathi zombane zenqaku lokudibana yeyona ngxaki iphambili ejongene noyilo lobunjineli, indawo nganye yokunxibelelana kufuneka iphandwe kwaye kusonjululwe iingxaki ezikhoyo. Ukunxibelelana kwebhodi yesekethe kubandakanya uqhagamshelo lwebhodi yeesekethe, uqhagamshelo lwe-PCB kunye nokunxibelelana kwegalelo / ukuphuma konxibelelwano phakathi kwePCB kunye nezixhobo zangaphandle.

Ukuqhagamshelwa phakathi kwe-chip kunye nebhodi ye-PCB

Nokuba esi sisombululo siyasebenza okanye akunjalo, bekucaca kwabo bezimeleyo ukuba itekhnoloji yoyilo lwe-IC ikude kakhulu kwitekhnoloji yoyilo lwe-PCB yezicelo ze-hf.

Unxibelelwano lwePCB

Ubuchule kunye neendlela zoyilo lwe-hf PCB zezi zilandelayo:

1. I-Angle ye-45 ° kufuneka isetyenziselwe ikona yomgca wokuhambisa ukunciphisa ilahleko yokubuya (UMZEKELO 1);

2 ixabiso yokwambathisa rhoqo ngokwenqanaba lokulawula ngokungqongqo ukusebenza kweebhodi zesekethe. Le ndlela iluncedo kulawulo olusebenzayo lwentsimi ye-electromagnetic phakathi kwezinto zokwambathisa kunye nokufaka iintambo ezikufutshane.

3.Iimpawu zokuyilwa kwe-PCB zokuchaneka kokuchaneka okuphezulu kufuneka ziphuculwe. Cinga ngokukhankanya impazamo yomgca opheleleyo we +/- 0.0007 intshi, ukulawula ngaphantsi kunye nokuwela amacandelo eemilo zentambo kunye nokuchaza iimeko zodonga lwecala elisecaleni. Overall management of wiring (wire) geometry and coating surfaces is important to address skin effects related to microwave frequencies and to implement these specifications.

4. Kukho ukukhutshwa kwempompo kwimikhombandlela ebonakalayo. Gwema ukusebenzisa izinto ezinesikhokelo. Kwimimandla enesantya esiphakamileyo, kungcono ukusebenzisa izinto ezinyusiweyo zomhlaba.

5. Ukwenza uphawu ngemingxunya, kunqande ukusebenzisa inkqubo ye-PTH kwipleyiti ebuthathaka, njengoko le nkqubo inokubangela inductance emngxunyeni. Lead inductance can affect layers 4 to 19 if a through-hole in a 20-ply board is used to connect layers 1 to 3.

6. Bonelela ngemiqolo emininzi yomhlaba. Moulded holes are used to connect these grounding layers to prevent 3d electromagnetic fields from affecting the circuit board.

7. Ukukhetha i-non-electrolysis nickel plating okanye inkqubo yokuntywila yegolide, sukusebenzisa indlela ye-HASL. Lo mhlaba we-electroplated ubonelela ngesiphumo esingcono sesikhumba samaza e-frequency ephezulu (Umzobo 2). In addition, this highly weldable coating requires fewer leads, helping to reduce environmental pollution.

8. Solder resistance layer can prevent solder paste from flowing. Nangona kunjalo, ngenxa yokungaqiniseki kokuqina kunye nokusebenza okungaziwayo kokugquma, ukugubungela yonke ipleyiti ngezinto zokumelana ne-solder kuya kukhokelela kutshintsho olukhulu kumandla ombane kuyilo lwe-microstrip. Generally, solderdam is used as welding resistance layer.

Ukuba awuqhelananga nezi ndlela, nxibelelana neenjineli ezinamava ezisebenze kwiibhodi zesekethe zemicrowave zomkhosi. You can also discuss with them what price range you can afford. Umzekelo, kuqoqosho ngakumbi ukusebenzisa uyilo oluxhaswa yiCoplanar microstrip kunoyilo lomtya, kwaye ungakuxoxa oku kunye nabo ukufumana ingcebiso engcono. Iinjineli ezilungileyo zinokungasetyenziselwa ukucinga ngeendleko, kodwa ingcebiso yazo inokuba luncedo kakhulu. Iya kuba ngumsebenzi wexesha elide ukuqeqesha iinjineli ezincinci ezingazazi iziphumo zeRF kunye nokuswela amava okujongana nefuthe leRF.

Ukongeza, ezinye izisombululo zinokwamkelwa, ezinje ngokuphucula imodeli yekhompyuter ukuze ikwazi ukujongana neziphumo zeRF.

Ukunxibelelana kwePCB kunye nezixhobo zangaphandle

Singacinga ukuba sisombulule zonke iingxaki kulawulo lweempawu ebhodini nakunxibelelaniso lwezinto ezingaqondakaliyo. Ke uyisombulula njani ingxaki yegalelo / yemveliso evela kwibhodi yesekethe ukuya kwintambo edibanisa isixhobo esikude? I-ElectrompeterElectronics, umvelisi kwitekhnoloji ye-coaxial cable, uyasebenza kule ngxaki kwaye wenze inkqubela phambili ebalulekileyo (umzobo 3). Also, take a look at the electromagnetic field shown in Figure 4 below. Kule meko, silawula uguqulo ukusuka kwi-microstrip ukuya kwintambo ye-coaxial. Kwiintambo ze-coaxial, umaleko womhlaba ungqinelana kwiiringi kwaye ngokulinganayo zahlulwe. Kwii-microbelts, umaleko womgangatho ungaphantsi komgca osebenzayo. Oku kwazisa iziphumo ezithile zomphetho ezifuna ukuqondwa, ukuxelwa kwangaphambili, kunye nokuqwalaselwa ngexesha loyilo. Ewe kunjalo, oku kungahambelani kunokukhokelela ekubuyiseleni umva kwaye kufuneka kuncitshiswe ukunqanda ingxolo kunye nokuphazamiseka komqondiso.

Ulawulo lwengxaki yangaphakathi yokungenisa ayisiyongxaki yoyilo enokungahoywa. I-impedance iqala kumphezulu webhodi yesekethe, idlula ngokudibeneyo kwi-joint, kwaye iphele kwikhebula le-coaxial. Ngenxa yokuba i-impedance iyahluka rhoqo, kokukhona iphindaphindeka, eyona nto inzima kulawulo lwe-impedance. The problem of using higher frequencies to transmit signals over broadband appears to be the main design problem.