የታተመ የወረዳ ሰሌዳ (ፒሲቢ) በሁሉም ዓይነት የኤሌክትሮኒክስ መሣሪያዎች ውስጥ ይገኛሉ። If there are electronic components in a piece of equipment, they are also embedded in various sizes of PCB. In addition to fixing various small parts, the main function of the PCB is to provide electrical connections between the components. As electronic equipment becomes more and more complex, more and more parts are needed, and the wiring and parts on the PCB become more and more dense. አንድ መደበኛ ፒሲቢ እንደዚህ ያለ ነገር ይመስላል። Bare Board (without parts on it) is also often referred to as “Printed Wiring Board (PWB).

The substrate of the board itself is made of a material that is insulated and resistant to bending. The small line material that can be seen on the surface is copper foil. Originally, the copper foil is covered on the whole board, and the middle part is etched away in the manufacturing process, and the remaining part becomes a network of small lines. These lines are called conductors or conductors and are used to provide electrical connections to parts on the PCB.

To secure parts to the PCB, we solder their pins directly to the wiring. በመሠረታዊ ፒሲቢ ላይ ክፍሎቹ በአንደኛው ወገን ላይ ያተኮሩ ሲሆን ሽቦዎቹ በሌላኛው ላይ ያተኮሩ ናቸው። So we need to make holes in the board so that the pins can go through the board to the other side, so the pins of the parts are welded to the other side. Because of this, the front and back sides of a PCB are called Component Side and Solder Side respectively.

በ PCB ላይ ከተመረቱ በኋላ ሊወገዱ ወይም መልሰው ሊያስገቡ የሚችሉ ክፍሎች ካሉ ፣ ሶኬት ክፍሎቹን ለመጫን ያገለግላል። Because the socket is directly welded to the board, the parts can be arbitrarily disassembled. A ZIF (Zero InserTIon Force) plug allows parts to be inserted and removed easily. The lever next to the socket can hold the parts in place after you insert them.

To connect two PCBS to each other, an edge connector is commonly used. የወርቅ ጣቱ በእውነቱ የ PCB ሽቦ አካል የሆኑ በርከት ያሉ የመዳብ ንጣፎችን ይ containsል። በተለምዶ ፣ ለማገናኘት ፣ በሌላ ፒሲቢ ላይ በተገቢው ማስገቢያ (በተለምዶ ማስፋፊያ ማስገቢያ ተብሎ የሚጠራው) በአንድ ፒሲቢ ላይ የወርቅ ጣቱን እናስገባለን። In computers, display cards, sound cards, and similar interface cards are connected to the motherboard by means of a gold finger.

በፒሲቢ ላይ ያለው አረንጓዴ ወይም ቡናማ ቀለም የሽያጭ ጭምብል ቀለም ነው። This layer is an insulating shield that protects the copper wire and prevents parts from being welded to the wrong place. ሌላ የሐር ማያ ገጽ በተሸጠው የመቋቋም ንብርብር ላይ ይታተማል። It is usually printed with words and symbols (mostly white) to indicate the position of the parts on the board. Screen printing surface is also known as icon surface

አፈ ታሪክ)።

ነጠላ-ጎን ሰሌዳዎች

እንደጠቀስነው ፣ በመሠረታዊ ፒሲቢ ላይ ፣ ክፍሎቹ በአንድ ወገን ላይ ያተኮሩ ሲሆን ሽቦዎቹ በሌላኛው ላይ ያተኮሩ ናቸው። Because the wire appears on only one side, we call this TYPE of PCB single-sided. ነጠላ ፓነሎች በወረዳው ንድፍ ላይ ብዙ ጥብቅ ገደቦች ስለነበሯቸው (አንድ ወገን ብቻ ስለነበረ ሽቦው መሻገር አይችልም እና የተለየ መንገድ መውሰድ ነበረበት) ፣ ቀደምት ወረዳዎች ብቻ እንደዚህ ያሉትን ሰሌዳዎች ይጠቀሙ ነበር።

ባለ ሁለት ጎን ሰሌዳዎች

የወረዳ ሰሌዳው በሁለቱም በኩል ሽቦ አለው። But in order to use both wires, there must be proper electrical connections between the two sides. በወረዳዎች መካከል ያለው ይህ “ድልድይ” የመመሪያ ቀዳዳ (ቪአይኤ) ይባላል። የመመሪያ ቀዳዳዎች በፒሲቢ ውስጥ የተሞሉ ወይም በሁለቱም በኩል ከሽቦዎች ጋር ሊገናኙ በሚችሉ በብረት የተሸፈኑ ትናንሽ ቀዳዳዎች ናቸው። Because a dual panel has twice the area of a single panel, and because the wiring can be interlaced (it can be wound around to the other side), it is better for more complex circuits than a single panel.

Multi-layer Boards

ሽቦ ሊሠራበት የሚችልበትን ቦታ ለመጨመር ፣ የበለጠ ነጠላ-ወይም ባለ ሁለት ጎን የሽቦ ሰሌዳዎች ጥቅም ላይ ይውላሉ። ባለብዙ ረድፍ ሰሌዳ ብዙ ድርብ ፓነሎችን ይጠቀማል ፣ እና በእያንዳንዱ ፓነል መካከል የማጣበቂያ ንብርብር ይቀመጣል እና ተጣብቋል (ተጭኗል)። The number of layers of the board represents several independent wiring layers, usually an even number of layers, including the outermost two layers. Most motherboards are built with four to eight layers, but it is technically possible to build up to 100 layers of PCBS. አብዛኛዎቹ ትልልቅ ኮምፒተሮች በጣም ጥቂት የእናትቦርድ ንብርብሮችን ይጠቀማሉ ፣ ግን እነሱ በመደበኛ ኮምፒተሮች ስብስቦች ሊተኩ ስለሚችሉ ከጥቅም ውጭ ሆነዋል። Because the layers in a PCB are so tightly integrated, it’s not always easy to see the actual number, but if you look closely at the motherboard, you might be able to.

The guide hole (VIA) we just mentioned, if applied to a double panel, must be through the entire board

But in a multilayer, if you only want to connect some of the lines, the guide holes may waste some of the line space in the other layers. Buried vias and Blind vias avoid this problem because they only penetrate a few layers. Blind holes connect several layers of internal PCBS to surface PCBS without penetrating the entire board. Buried holes are only connected to the internal PCB, so light is not visible from the surface.

In a multilayer PCB, the entire layer is directly connected to the ground wire and the power supply. So we classify the layers as Signal, Power or Ground. If the parts on the PCB require different power supplies, they usually have more than two power and wire layers.

የማሸጊያ ክፍል ቴክኖሎጂ

በሆል ቴክኖሎጂ በኩል

The technique of placing parts on one side of the board and welding the pins to the other side is called “Through Hole Technology (THT)” encapsulation. This part takes up a lot of space and one hole is drilled for each pin. ስለዚህ መገጣጠሚያዎቻቸው በእውነቱ በሁለቱም በኩል ቦታን ይይዛሉ ፣ እና የሽያጭ መገጣጠሚያዎች በአንፃራዊ ሁኔታ ትልቅ ናቸው። በሌላ በኩል ፣ የ THT ክፍሎች ከፒሲቢ ጋር በተሻለ የተገናኙት ከ Surface Mounted Technology (SMT) ክፍሎች ነው ፣ እኛ በኋላ እንነጋገራለን። Sockets like wired sockets and similar interfaces need to be pressure-tolerant, so they are usually THT packages.

Surface Mounted Technology

For Surface Mounted Technology (SMT) parts, the pin is welded on the same side with the parts. This technique does not drill holes in the PCB for each pin.

የወለል ተለጣፊ ክፍሎች በሁለቱም ጎኖች እንኳን ሊጣበቁ ይችላሉ።

SMT ከ THT ያነሱ ክፍሎችም አሉት። Compared to PCB with THT parts, PCB with SMT technology is much denser. SMT package parts are also less expensive than THT’s. So it’s no surprise that most of today’s PCBS are SMT.

Because the solder joints and pins of parts are very small, it is very difficult to weld them manually. However, given that current assembly is fully automated, this problem will only occur when repairing parts.

The design process

በፒ.ሲ.ቢ ንድፍ ውስጥ ፣ ከመደበኛ ሽቦ በፊት በእውነቱ በጣም ረጅም ደረጃዎች አሉ። ዋናው የዲዛይን ሂደት የሚከተለው ነው-

The system specifications

First of all, the system specifications of the electronic equipment should be planned. It covers system functionality, cost constraints, size, operation and so on.

System function block diagram

ቀጣዩ ደረጃ የስርዓቱን ተግባራዊ የማገጃ ንድፍ መፍጠር ነው። በካሬዎች መካከል ያለው ግንኙነትም ምልክት መደረግ አለበት።

Divide the system into several PCBS

Dividing the system into several PCBS not only reduces the size, but also gives the system the ability to upgrade and swap parts. The system function block diagram provides the basis for our segmentation. Computers, for example, can be divided into motherboards, display cards, sound cards, floppy disk drives, power supplies, and so on.

ጥቅም ላይ የሚውለውን የማሸጊያ ዘዴ እና የእያንዳንዱ ፒሲቢ መጠን ይወስኑ

Once the technology and the number of circuits used for each PCB has been determined, the next step is to determine the size of the board. If the design is too large, then packaging technology will have to change, or re-split the action. ቴክኖሎጂውን በሚመርጡበት ጊዜ የወረዳ ዲያግራም ጥራት እና ፍጥነት እንዲሁ ግምት ውስጥ መግባት አለበት።

Draw schematic circuit diagrams of all PCB’s

The details of the interconnections between the parts should be shown in the sketch. በሁሉም ስርዓቶች ውስጥ ፒሲቢ መገለጽ አለበት ፣ እና አብዛኛዎቹ በአሁኑ ጊዜ CAD (በኮምፒተር የታገዘ ዲዛይን) ይጠቀማሉ። Here is an example of a CircuitMakerTM design.

የፒ.ሲ.ቢ የወረዳ መርሃግብር ንድፍ

Preliminary design of simulation operation

To ensure that the designed circuit diagram works, it must first be simulated using computer software. Such software can read blueprints and show how the circuit works in many ways. This is much more efficient than actually making a sample PCB and then measuring it manually.

Place the parts on the PCB

The way parts are placed depends on how they are connected to each other. በጣም በተቀላጠፈ መንገድ ከመንገዱ ጋር መገናኘት አለባቸው። Efficient wiring means the shortest possible wiring and fewer layers (which also reduces the number of guide holes), but we’ll come back to this in actual wiring. Here is what the bus looks like on a PCB. Placement is important in order for each part to have perfect wiring.

Test wiring possibilities with correct operation at high speed

አንዳንድ የዛሬ የኮምፒተር ሶፍትዌሮች የእያንዳንዱ አካል አቀማመጥ በትክክል መገናኘቱን ይፈትሹ ወይም በከፍተኛ ፍጥነት በትክክል መሥራት ይችሉ እንደሆነ ይፈትሹ። ይህ እርምጃ ክፍሎችን ማደራጀት ይባላል ፣ ግን ወደዚህ ብዙም አንሄድም። በወረዳ ዲዛይን ላይ ችግር ካለ ፣ ወረዳው በመስኩ ወደ ውጭ ከመላኩ በፊት ክፍሎች እንዲሁ እንደገና ሊስተካከሉ ይችላሉ።

በፒሲቢ ላይ የወረዳ ላክ

The connections in the sketch will now look like wiring in the field. በእጅ የሚደረጉ ለውጦች ቢያስፈልጉም ይህ እርምጃ ብዙውን ጊዜ ሙሉ በሙሉ በራስ -ሰር ይሠራል። Below is the wire template for 2 laminates. ቀይ እና ሰማያዊ መስመሮች የፒሲቢ ክፍሎችን ንብርብር እና የብየዳውን ንብርብር በቅደም ተከተል ይወክላሉ። The white text and squares represent the markings on the screen printing surface. ቀዩ ነጥቦቹ እና ክበቦቹ ቁፋሮ እና መመሪያ ቀዳዳዎችን ይወክላሉ። በስተቀኝ በኩል በፒሲቢው የመገጣጠሚያ ገጽ ላይ የወርቅ ጣቱን ማየት እንችላለን። The final composition of this PCB is often referred to as the working Artwork.

Each design must conform to a set of rules, such as minimum reserved gaps between lines, minimum line widths, and other similar practical limitations. እነዚህ መመዘኛዎች እንደ ወረዳው ፍጥነት ፣ የሚተላለፈው የምልክት ጥንካሬ ፣ የወረዳውን የኃይል ፍጆታ እና ጫጫታ እና የቁሳቁስና የማምረቻ መሳሪያዎችን ጥራት ይለያያሉ። If the strength of the current increases, the thickness of the wire must also increase. In order to reduce PCB costs, while reducing the number of layers, it is also necessary to pay attention to whether these regulations are still met. ከ 2 በላይ ንብርብሮች የሚያስፈልጉ ከሆነ የኃይል ንብርብር እና የመሬቱ ንብርብር ብዙውን ጊዜ በምልክት ንብርብር ላይ ያለውን የማስተላለፊያ ምልክት እንዳይጎዳ ለመከላከል ያገለግላሉ ፣ እና እንደ የምልክት ንብርብር ጋሻ ሆኖ ሊያገለግል ይችላል።

Wire after circuit test

In order to be sure that the line is working properly behind the wire, it must pass the final test. ይህ ሙከራ እንዲሁ ትክክል ያልሆኑ ግንኙነቶችን ይፈትሻል ፣ እና ሁሉም ግንኙነቶች የእቅድ ንድፉን ይከተላሉ።

ማቋቋም እና ፋይል ማድረግ

PCBS ን ለመንደፍ በአሁኑ ጊዜ ብዙ የ CAD መሣሪያዎች ስላሉ ፣ አምራቾች ሰሌዳዎችን ከማምረትዎ በፊት መስፈርቶቹን የሚያሟላ መገለጫ ሊኖራቸው ይገባል። There are several standard specifications, but the most common is the Gerber Files specification. A set of Gerber files includes a plan of each signal, power and ground layer, a plan of the solder resistance layer and the screen printing surface, and specified files of drilling and displacing.

Electromagnetic compatibility problem

ለኤምሲ መመዘኛዎች የተነደፉ የኤሌክትሮኒክስ መሣሪያዎች የኤሌክትሮማግኔቲክ ኃይል የማመንጨት እና በአቅራቢያ ባሉ መሣሪያዎች ላይ ጣልቃ የመግባት ዕድላቸው ከፍተኛ ነው። EMC በኤሌክትሮማግኔቲክ ጣልቃ ገብነት (EMI) ፣ በኤሌክትሮማግኔቲክ መስክ (EMF) እና በሬዲዮ ድግግሞሽ ጣልቃ ገብነት (RFI) ላይ ከፍተኛ ገደቦችን ያስገድዳል። ይህ ደንብ የመሣሪያውን እና ሌሎች በአቅራቢያ ያሉ መገልገያዎችን መደበኛ አሠራር ማረጋገጥ ይችላል። EMC ሊበታተን ወይም ከአንድ መሣሪያ ወደ ሌላ ሊተላለፍ በሚችል የኃይል መጠን ላይ ጥብቅ ገደቦችን ያስገድዳል ፣ እናም ለውጭ EMF ፣ EMI ፣ RFI ፣ ወዘተ ተጋላጭነትን ለመቀነስ የተነደፈ ነው። In other words, the purpose of this regulation is to prevent electromagnetic energy from entering or emanating from the device. This is a very difficult problem to solve, and is usually solved by using power and grounding layers, or putting PCBS into metal boxes. The power and ground layers protect the signal layer from interference, and the metal box works equally well. We won’t go too far into these issues.

The maximum speed of the circuit depends on EMC compliance. የውስጥ EMI ፣ እንደ የአሁኑ በአስተዳዳሪዎች መካከል ያለው ኪሳራ ፣ ድግግሞሽ ሲጨምር ይጨምራል። በሁለቱ መካከል ያለው የአሁኑ ልዩነት በጣም ትልቅ ከሆነ በመካከላቸው ያለውን ርቀት ማራዘምዎን ያረጋግጡ። This also tells us how to avoid high voltage and minimize the current consumption of the circuit. በገመድ ውስጥ የመዘግየት መጠን እንዲሁ አስፈላጊ ነው ፣ ስለዚህ ርዝመቱ አጭር ፣ የተሻለ ይሆናል። ስለዚህ ጥሩ ሽቦ ያለው ትንሽ ፒሲቢ ከትልቁ ፒሲቢ በተሻለ በከፍተኛ ፍጥነት ይሠራል።