Ntawm PCB, npib tsib xee yog siv los ua substrate txheej ntawm precious thiab puag hlau. Nyob rau tib lub sijhawm, rau qee cov ntawv luam tawm ib sab, npib tsib xee kuj tau siv los ua txheej txheej saum npoo. Tom ntej no, kuv mam li qhia rau koj lub Cheebtsam ntawm PCB nickel plating daws

1. Cov ntsev tseem ceeb: nickel sulfamate thiab npib tsib xee sulfate yog cov ntsev tseem ceeb hauv nickel daws, uas tsuas yog muab cov nickel hlau ions xav tau rau nickel plating thiab tseem ua lub luag haujlwm ntawm cov ntsev conductive. Nrog siab nickel ntsev cov ntsiab lus, siab cathode tam sim no ceev yuav siv tau, thiab cov deposition ceev ceev. Nws yog feem ntau siv rau high-speed tuab npib tsib xee plating. Tsawg nickel ntsev cov ntsiab lus ua rau qis deposition tus nqi, tab sis lub peev xwm dispersion yog zoo heev, thiab zoo thiab ci crystalline txheej yuav tau.

2. Buffer: boric acid yog siv los ua ib qho tsis los tswj cov pH nqi ntawm nickel plating tov nyob rau hauv ib tug tej yam ntau yam. Boric acid tsis tsuas yog muaj kev ua haujlwm ntawm pH tsis, tab sis kuj tuaj yeem txhim kho cathodic polarization, txhawm rau txhim kho kev ua haujlwm ntawm da dej.

3. Anode activator: nickel anode yooj yim rau passivate thaum lub hwj chim rau. Txhawm rau kom ntseeg tau qhov kev sib cais ntawm cov anode, ib qho nyiaj ntawm anode activator yog ntxiv rau cov tshuaj plating.

4. Additive: cov khoom tseem ceeb ntawm cov additive yog tus neeg saib xyuas kev ntxhov siab. Feem ntau siv additives yog naphthalene sulfonic acid, p-toluenesulfonamide, saccharin, thiab lwm yam.

5. Tus neeg sawv cev ntub dej: txhawm rau txo lossis tiv thaiv cov cim ntawm cov pinholes, ib qho me me ntawm cov ntaub ntub dej yuav tsum tau ntxiv rau cov tshuaj plating, xws li sodium dodecyl sulfate, sodium diethylhexyl sulfate, sodium octyl sulfate, thiab lwm yam.