Laupapa PCB electric pinch gold and nickel sink gold difference?

PCB board gold is obtained through electrolysis, and gold is obtained through chemical reduction reaction!

What is the difference between PCB electric gold and sunk nickel gold.

To put it simply, PCB electroplating gold, like other PCB electroplating, needs electricity and rectifier. There are many kinds of its process, including cyanide, non-cyanide system, non-cyanide system and citric acid, sulfite and so on. Used in PCB industry are non – cyanide systems.

Gold-plating (chemical gold-plating) does not require electricity, but deposits gold onto the surface through a chemical reaction in solution.

They have their own advantages and disadvantages. In addition to whether it is powered on or not, PCB board gold can be made very thick. As long as the time is extended, it is suitable for making bonded boards. The chance of waste of PCB electrogold liquid is smaller than that of gold. However, PCB system needs the whole board conduction, and is not suitable for making special fine lines.

Gold mineralization is generally very thin (less than 0.2 micron) and the purity of gold is low. Working fluid can only be discarded to a certain extent.

One is PCB plating to form nickel gold

One is the use of sodium hypophosphite self REDOX reaction to form a nickel layer, the use of replacement reaction to form a gold layer (kamura (TSB71 is with self reducing gold), is a chemical method.

Ivy: In addition to the differences in the process of PCB electroplating and plating, there are the following differences:

PCB electroplated gold layer is thick, high hardness, so it is usually used for frequent plug sliding part, such as switch card gold finger, etc.

It is also used for lead-free welding because of the smooth surface of the pad.