Uyini umehluko phakathi kwe-PCB kagesi kagesi negolide le-nickel elicwilile?

PCB ibhodi ingcosana kagesi igolide ne-nickel cwila umehluko wegolide?

Igolide lebhodi le-PCB litholakala nge-electrolysis, futhi igolide litholakala ngokuphendula kwamakhemikhali!

Uyini umehluko phakathi kwe-PCB yegolide kagesi kanye ne-nickel yegolide eshonile.

Ukukubeka nje, i-PCB ekhiqiza igolide, njengamanye ama-electroplating e-PCB, idinga ugesi nesilungisi. Kunezinhlobo eziningi zenqubo yayo, kufaka phakathi i-cyanide, non-cyanide system, non-cyanide system kanye ne-citric acid, sulfite nokunye. Isetshenziswa embonini ye-PCB ayizinhlelo ezingezona i-cyanide.

ipcb

Ukufakwa kwegolide (ukufaka igolide ngamakhemikhali) akudingi ugesi, kepha kufaka igolide ebusweni ngokusebenzisa ukusabela kwamakhemikhali kusisombululo.

Zinezinzuzo nezinkinga zazo. Ngaphezu kokuthi ivuliwe noma cha, ibhodi le-PCB legolide lingenziwa libe likhulu kakhulu. Uma nje isikhathi sinwetshiwe, kufanelekile ukwenza amabhodi ahlanganisiwe. Ithuba lokuchithwa kuketshezi olunamandla kagesi lwe-PCB lincane kunalelo legolide. Kodwa-ke, uhlelo lwe-PCB ludinga ukuqhutshwa kwebhodi lonke, futhi alifanele ukwenza imigqa ekhethekile emihle.

Ukumbiwa phansi kwegolide kuvame ukuba mncane kakhulu (ngaphansi kuka-0.2 micron) futhi ubumsulwa begolide buphansi. Uketshezi olusebenzayo lungalahlwa kuphela ngezinga elithile.

Eyokuqala i-PCB Plating yokwakha i-nickel gold

Okunye ukusetshenziswa kwe-sodium hypophosphite self REDOX reaction ukwakha ungqimba lwe-nickel, ukusetshenziswa kokuphindisela okwenziwe ukwakha ungqimba wegolide (i-kamura (i-TSB71 inegolide elizinciphisela yona), yindlela yamakhemikhali.

Ivy: Ngaphezu komehluko wenqubo ye-PCB electroplating and plating, kunomehluko olandelayo:

Isendlalelo segolide se-electroplated se-PCB siwugqinsi, ukuqina okuphezulu, ngakho-ke kuvame ukusetshenziselwa ipulaki elishibilikayo eliyingxenye, njengokushintshwa kwekhadi legolide, njll.

Ibuye isetshenziselwe ukuwelda okungenawo umthofu ngenxa yendawo ebushelelezi yephedi.