Ngokwesisekelo sokucutshungulwa okuphelele kwekhwalithi yesiginali, i-EMC, ukwakheka okushisayo, i-DFM, i-DFT, isakhiwo, izidingo zokuphepha, idivayisi ibekwa ebhodini ngokufanele. – the PCB ukwakheka.

Ukuxhunywa kwawo wonke amaphedi wezinto kuzohlangabezana nezidingo zokuklama ezishisayo ngaphandle kwezidingo ezikhethekile. – Izimiso ezijwayelekile ze-PCB eziphumayo.

Kuyabonakala ukuthi ekwakhiweni kwe-PCB, noma ngabe kuyisakhiwo noma umzila, onjiniyela kufanele bacabangele futhi bahlangabezane nezidingo zedizayini eshisayo.

Ukubaluleka kokuklama okushisayo

Amandla kagesi asetshenziswa yimishini kagesi ngesikhathi somsebenzi, njenge-RF power amplifier, i-FPGA chip nemikhiqizo yamandla, aguqulwa kakhulu abe ukushisa kokushisa ngaphandle komsebenzi owusizo. Ukushisa okwenziwe yimishini kagesi kwenza ukushisa kwangaphakathi kukhuphuke ngokushesha. Uma ukushisa kungachithwa ngesikhathi, imishini izoqhubeka nokushisa, futhi izingxenye zizohluleka ngenxa yokushisa ngokweqile, futhi ukuthembeka kwemishini kagesi kuzokwehla. I-SMT inyusa inani lokufakwa kwemishini ye-elekthronikhi, inciphisa indawo yokupholisa esebenzayo, futhi kuthinta kakhulu ukuthembakala kokukhuphuka kwamazinga okushisa kwemishini. Ngakho-ke, kubaluleke kakhulu ukutadisha ukwakheka okushisayo.

Izidingo zokuklama ezishisayo ze-PCB

1) ekuhlelweni kwezinto, ngaphezu kwensimbi ethola ukushisa kuzoba yidivayisi ezwela ukushisa eduze nendawo yokungena, futhi itholakala emandleni amakhulu, inani elikhulu le-calorific lezinto ezikhuphukayo zomgudu womoya, kude ngangokunokwenzeka kude inani lama-calorific wezinto, ukuvikela imiphumela yemisebe, uma ingekho kude nayo, futhi ingasebenzisa ipuleti lokuvikela ukushisa (ishidi lokupholisha insimbi, ubumnyama obuncane ngangokunokwenzeka).

2) Umshini oshisayo futhi ongakwazi ukumelana nokushisa uqobo ubekwa eduze kwesitolo noma ngaphezulu, kepha uma ungakwazi ukumelana nokushisa okuphezulu, kufanele futhi ubekwe eduze kwendawo yokungena, bese uzama ukudiyazela isikhundla ngamanye amadivayisi okushisa kanye nokushisa amadivayisi azwelayo lapho kuphakama umoya.

3) Izakhi zamandla aphezulu kufanele zisatshalaliswe ngangokunokwenzeka ukugwema ukugxila komthombo wokushisa; Izakhi zamasayizi ahlukene zihlelwe ngokulingana ngangokunokwenzeka, ukuze ukumelana nomoya kusatshalaliswe ngokulinganayo futhi ivolumu yomoya isatshalaliswa ngokulinganayo.

I-4) Zama ukuvumelanisa ama-vents namadivayisi anezidingo eziphakeme zokushabalalisa ukushisa.

I-5) Idivayisi ephezulu ibekwe ngemuva kwensiza ephansi, futhi indlela ende ihlelwe eceleni kwesixwayiso ngokumelana nomoya okuncane ukuvimbela ipayipi lomoya ekuvinjelweni.

I-6) Ukucushwa kwe-radiator kufanele kukhuthaze ukusakazwa komoya wokushintshanisa ukushisa kwikhabethe. Lapho uthembele ekudlulisweni kokushisa kwe-convection yemvelo, ukuqondiswa kobude bomphetho wokushiswa kokushisa kufanele kubheke kokuya phansi. Ukushabalalisa ukushisa ngomoya ophoqelelwe kufanele kuthathwe ohlangothini olufanayo nolokuqondisa komoya.

I-7) Ngokuqondiswa kokugeleza komoya, akufanelekile ukuhlela ama-radiator amaningi ebangeni eliseduze le-longitudinal, ngoba irediyetha engenhla izokwehlukanisa ukugeleza komoya, futhi isivinini somoya somoya se-radiator esezansi sizoba sincane kakhulu. Kufanele kumile, noma ukususwa kokushisa kususwe isikhala.

8) Irediyetha nezinye izinto ebhodini lesifunda elifanayo kufanele zibe nebanga elifanele, ngokubalwa kwemisebe eshisayo, ukuze ingabi nokushisa okungafanele.

9) Sebenzisa ukushisa kwe-PCB ukushisa. Uma ukushisa kusatshalaliswa ngendawo enkulu yokubeka ithusi (iwindi lokushisela elivulekile lingacatshangelwa), noma lixhunywe kusendlalelo esicaba sebhodi le-PCB ngokusebenzisa imbobo, futhi lonke ibhodi le-PCB lisetshenziselwa ukushabalalisa ukushisa.