Co je to Multilayer PCB board? What are the characteristics of multilayer PCB?

The biggest difference between PCB multilayer and single and double panels is the addition of an internal power layer and ground layer. The power supply and ground network are routed mainly at the power layer. Each substrate layer on a PCB multilayer has conductive metal on both sides, and special adhesives are used to hold the boards together, and insulation is present between each board. However, PCB multilayer wiring is mainly based on top and bottom layers, supplemented by intermediate wiring layers.

Therefore, the design method of multi-layer PCB board is basically the same as that of double panel. The key is how to optimize the wiring of the internal electrical layer, so that the wiring of the circuit board is more reasonable. Multifunctional development of the inevitable product, large capacity and small volume.

With the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and very large scale integrated circuits, multi-layer PCB is rapidly developing towards the direction of high density, high precision and high level of digitalization. Thin line, small hole penetration and blind hole technology (such as buried hole and high plate thickness aperture ratio) can meet the market needs. PCB multilayer PCB is widely used in electronic product manufacturing due to its flexible design, stable and reliable electrical performance and excellent economic performance.

Especially with the extensive and in-depth application of large-scale and very large scale integrated circuits, multi-layer PCB is developing towards the direction of high density, high precision and high level digitalization. Thin line, small hole penetration and blind hole technology (such as buried hole and high plate thickness aperture ratio) can meet the market needs. PCB multilayer PCB is widely used in electronic product manufacturing due to its flexible design, stable and reliable electrical performance and excellent economic performance. Especially with the extensive and in-depth application of large-scale and very large scale integrated circuits, multi-layer PCB is developing towards the direction of high density, high precision and high level digitalization.

Thin line, small hole penetration and blind hole technology (such as buried hole and high plate thickness aperture ratio) can meet the market needs. PCB multilayer PCB is widely used in electronic product manufacturing due to its flexible design, stable and reliable electrical performance and excellent economic performance. Blind hole technology and high plate thickness aperture ratio can meet the market demand.

PCB multilayer PCB is widely used in electronic product manufacturing due to its flexible design, stable and reliable electrical performance and excellent economic performance. Blind hole technology, high plate thickness aperture ratio and other blind technology can meet the market demand. PCB multilayer PCB is widely used in electronic product manufacturing due to its flexible design, stable and reliable electrical performance and excellent economic performance.