Poari PCB electroplating is to obtain gold through electrolysis, and chemical reduction is to obtain gold through chemical reduction reaction. Simply put, PCB electroplating gold, like other PCB electroplating, requires power and a rectifier. There are many kinds of processes, including cyanide-containing, non-cyanide systems, and non-cyanide systems, such as citric acid type and sulfite type. All non-cyanide systems are used in the PCB industry.

Chemical gold (electroless gold plating) does not need to be energized, it deposits gold on the board through a chemical reaction in the solution.

They have their own advantages and disadvantages. In addition to power-on but not power-on, the PCB board can be made very thick, as long as the time is extended, it is suitable for bonding boards. The chance of PCB manufacturing electro-gold potion being discarded is smaller than that of chemical gold. However, the PCB electrical gold needs to be connected to the whole board, and it is not suitable for particularly thin lines.

Chemical gold is generally very thin (less than 0.2 microns), and the purity of gold is low. The working fluid can only be discarded when used to a certain extent.

One is PCB electroplating to form nickel gold

One is the use of sodium hypophosphite’s own oxidation-reduction reaction to form a nickel layer, and a substitution reaction to form a gold layer (Uemura’s (TSB71 is with self-reduced gold)), which is a chemical method.

Ivy: In addition to the process differences between PCB electroplating and immersion gold, there are the following differences:

PCB electroplating gold layer is thicker and harder, so it is usually used for frequently plugging and inserting sliding parts, such as the gold fingers of switch cards;

Immersion gold is good for mounting due to the flat surface of the pad and is also used for lead-free soldering.