PCB ibhodi i-electroplating iwukuthola igolide nge-electrolysis, futhi ukunciphisa amakhemikhali kuwukuthola igolide ngokusabela kokunciphisa amakhemikhali. Kalula nje, i-PCB electroplating igolide, njengenye i-PCB electroplating, idinga amandla nesilungisisi. Kunezinhlobo eziningi zezinqubo, ezihlanganisa amasistimu ane-cyanide, ama-non-cyanide, namasistimu angewona ama-cyanide, njengohlobo lwe-citric acid nohlobo lwe-sulfite. Wonke amasistimu angewona ama-cyanide asetshenziswa embonini ye-PCB.

Igolide lamakhemikhali (i-electroless gold plating) alidingi ukunikwa amandla, lifaka igolide ebhodini ngokusabela kwamakhemikhali esixazululweni.

Banezinzuzo zabo siqu kanye nokubi. Ngaphezu kokuvula amandla kodwa hhayi amandla, ibhodi le-PCB lingenziwa libe likhulu kakhulu, inqobo nje uma isikhathi sinwetshiwe, lifanele amabhodi okubopha. Ithuba lokuthi i-PCB yokukhiqiza i-electro-gold potion ilahlwe mancane kunalelo legolide lamakhemikhali. Nokho, igolide likagesi le-PCB lidinga ukuxhunywa kulo lonke ibhodi, futhi alifanele imigqa emincane kakhulu.

Igolide lamakhemikhali ngokuvamile lincane kakhulu (lingaphansi kwama-microns angu-0.2), futhi ubumsulwa begolide buphansi. Uketshezi olusebenzayo lungalahlwa kuphela uma lusetshenziswe ngezinga elithile.

Enye i-PCB electroplating ukwenza igolide le-nickel

Enye iwukusetshenziswa kwe-sodium hypophosphite’s own oxidation-reduction reaction ukuze kwakhe ungqimba lwe-nickel, kanye nokusabela esikhundleni sokwenza ungqimba lwegolide (I-Uemura’s (TSB71 inegolide elizinciphisile)), okuyindlela yamakhemikhali.

I-Ivy: Ngaphezu komehluko wenqubo phakathi kwe-PCB electroplating negolide lokucwiliswa, kunomehluko olandelayo:

I-PCB electroplating ungqimba lwegolide lushubile futhi luqinile, ngakho-ke ngokuvamile lusetshenziselwa ukuxhuma nokufaka izingxenye ezishelelayo, njengeminwe yegolide yamakhadi okushintsha;

Igolide lokucwiliswa lilungele ukugxunyekwa ngenxa yendawo eyisicaba yephedi futhi liphinde lisetshenziswe ekuhlanganiseni okunganomthofu.