Izizathu eziqhelekileyo zoku PCB ukwaliwa kobhedu

Njengomthengisi wempahla eluhlaza yePCB, bendihlala ndikhalazwa ngabathengi malunga nokuchithwa kwentambo yobhedu embi (ekwabizwa ngokuba kukulahla ubhedu). Kule meko, zonke iifektri ze-PCB kuthiwa ziyingxaki ye-laminate, efuna ukuba iifektri zabo zemveliso zithwale ilahleko ezimbi. Ngokweminyaka yam yokuphathwa kwesikhalazo ngamava, izizathu eziqhelekileyo zokulahlwa kobhedu lwefektri yile ndlela ilandelayo:

Inkqubo yemveliso ye-PCB yemveliso:

1, ngefoyile ye yobhedu ngasekhohlo kakhulu, ngefoyile ye-elektroniki elektroniki esetyenziswa kwimarike ngokubanzi olunye-kabini kwalenza (eyaziwa ngokuba ngefoyile ye-ashing) kunye nesingxobo sobhedu olunye-emacaleni (eyaziwa ngokuba ngefoyile ebomvu), yokulahla ubhedu eqhelekileyo ngokubanzi ngaphezu I-70um ifoyile yobhedu kwalenza, i-foil ebomvu kunye ne-18um engezantsi kwe-ashing foil ngokusisiseko ayinakho ukulahlwa kwebhedu. Xa uyilo lomgca wabathengi lungcono kunelayini etching, ukuba iinkcukacha zefoyile yobhedu zitshintshiwe kwaye iiparameter zokutsala azitshintshwanga, ifoyile yobhedu ihlala kwisisombululo sokuhlala ixesha elide. Ngenxa yokuba i-zinc sisinyithi esisebenzayo, xa ucingo lobhedu kwi-PCB lntywiliselwe kwisisombululo seetching ixesha elide, iya kuthi ngokuqinisekileyo ikhokelele kukhukuliseko lomgca ogqithileyo, okukhokelela kulungelelwaniso lomgca ocolekileyo we-zinc kususwe ngokupheleleyo kwaye kwahlulwe kwizinto ezisisiseko Oko kukuthi, ucingo lobhedu luyawa. Enye imeko kukuba akukho ngxaki nge-ETCHING parameter ye-PCB, kodwa ukurhawulwa kuhlanjwa emva kokudinwa kwaye ukomiswa kukubi, okukhokelela ekubeni ucingo lobhedu lujikelezwe lulwelo olushiyekileyo kwi-SURFACE ye-PCB. Ukuba ayinyangwa ixesha elide, ucingo lobhedu luya kubola kakhulu kwaye ubhedu luya kuphoswa. Ukusebenza ngokubanzi kolu hlobo lweemeko kugxilwe kwimigca emihle, okanye ixesha lemozulu emanzi, yonke i-PCB izakuvela ngokungathandekiyo efanayo, isuse ucingo lobhedu ukuze lubone ujongano lwalo kunye nengca (ekuthiwa bubuso obujiyileyo) umbala utshintshile, ngokungafaniyo umbala oqhelekileyo wefoyile yobhedu, kukubona isiseko sombala wobhedu, imigca eshinyeneyo yamandla e-foil amandla e-peel aqhelekileyo.

2. KWINKQUBO ye-PCB, kwenzeka ukungqubana kwendawo, kwaye ucingo lobhedu lwahlulwe kwizinto ezisisiseko ngamandla angaphandle oomatshini. Lo msebenzi ungafunekiyo umiswe kakuhle okanye ulwalathiso, intambo yobhedu evulekileyo iya kuba nokugqwetha okucacileyo, okanye kwicala elifanayo lophawu / lwempembelelo. Ukukroba ucingo lobhedu kwindawo embi ukubona umphezulu wefoyile wobhedu, uyabona ukuba umbala wobuso befoyile yobhedu uqhelekile, ngekhe kubekhona ukhukuliseko lwecala olubi, kunye namandla e-foil yobhedu aqhelekile.

I-3, uyilo lweesekethe ze-PCB alukho ngqiqweni, kunye noyilo lobhedu olucekeceke lwesekethe ecekeceke kakhulu, luya kubangela nokutshixwa kwesekethe okugqithisileyo kunye nokulahlwa kobhedu.

Izizathu ezibini, iinkqubo zelaminate:

Phantsi kweemeko eziqhelekileyo, okoko nje i-laminate icinezelwe kubushushu obuphezulu ngaphezulu kwe-30min, ifoyile yobhedu kunye nephepha elinyangiweyo zidityaniswe ngokupheleleyo, ke ngoku ukucofa ngokubanzi akuchaphazeli amandla okubopha ifreyim yobhedu kunye zeendawana kwi laminate. Nangona kunjalo, kwinkqubo yokufakwa kwesamente kunye nokufumba, ukuba ungcoliseko lwe-PP okanye ukonakala komphezulu weenwele zefoyile kuya kukhokelela kukungabikho kwamandla okubopha phakathi kwefoyile yobhedu kunye nezinto ezisisiseko emva kokulaminetha, okukhokelela ekubekweni (kuphela iipleyiti ezinkulu) okanye ucingo lobhedu olunqabileyo ukuwa, kodwa akuyi kubakho mandla eefoyile yobhedu ngokungaqhelekanga amandla okuxobuka kufutshane nomgca olinganisiweyo.

Ezintathu, izinto eziluhlaza eziluhlaza:

I-1, i-foil ye-elektroniki ekhankanywe ngentla ye-foil ye-MAO ifoyile yentsimbi okanye ubhedu, ukuhanjiswa kweemveliso ezigqityiweyo, xa imveliso yokufota ye-MAO ingaqhelekanga, okanye i-zinc / ityhubhu yobhedu, ukutyabeka i-dendrite, amandla e-peel ye-foil ye-copper ayonelanga, kubangelwe ngefoyile embi emva kokucinezela iphepha elenziwe nge-elektroniki elenziwe ngombane nge-plug-in, ucingo lobhedu luya kuwa ngenxa yothuka lwangaphandle luya kwenzeka. Olu hlobo lobhedu olubi olususa ucingo lobhedu ukuze lubone umphezulu weenwele zobhedu (oko kukuthi, umphezulu woqhakamshelwano kunye nezinto ezisisiseko) awuzukubonakala ukhukuliseko lwecala, kodwa wonke umphezulu wobhedu lokuxobula amandla uya kuba mbi kakhulu.

2, ukulungelelaniswa kwefoyile yobhedu kunye nentlaka ihlwempuzekile: ukusebenza okukhethekileyo kwe-laminate esetyenzisiweyo ngoku, njengephepha le-HTG, kuba inkqubo ye-resin ayifani, i-arhente yokuphilisa i-resin ye-PN, i-resin ye-molecular chain structure ilula, ukudibanisa isidanga siphantsi xa sinyanga, sinyanzelekile ukuba sisebenzise ipoyile ekhethekileyo yobhedu kunye nomdlalo. Xa imveliso laminate usebenzisa ngefoyile ye yobhedu kunye nenkqubo nentlaka ayihambelani, kukhokelela kwipleyiti yokugquma ngefoyile ye-intsimbi amandla exobukayo akwanelanga, plug-in nayo iya kuvela embi yobhedu exobukayo.