Iyini inhloso yokuvezwa kwebhodi lesifunda kunqubo yokukhiqiza ibhodi le-PCB?

Ukuchayeka kwemaski ye-solder kanye nenqubo yokuthuthukiswa ku- PCB ibhodi inqubo yokukhiqiza ibhodi le-PCB elinemaski ye-solder ngemuva kokuphrinta isikrini. Mboza amaphedi ebhodini le-PCB ngefilimu ye-diazo ukuze angakhanyiswa ukukhanya kwe-ultraviolet ngesikhathi senqubo yokuchayeka, futhi ungqimba lokuvikela lokuvikela umthengisi lunamathele ngokuqinile endaweni ye-PCB ngemuva kwemisebe yokukhanya kwe-ultraviolet, futhi amaphedi awavezwa. ekukhanyeni kwe-ultraviolet. Imisebe elula ingadalula amaphedi ethusi ukuze kufakwe umthofu nethini ngesikhathi sokulinganisa komoya oshisayo.

ipcb

Inhloso yokuchayeka kwebhodi lesifunda i-irradiate futhi uvimbele ukukhanya kwe-ultraviolet. Ingxenye yefilimu ebonisa ngale nefilimu eyomile ibhekana ne-optical polymerization reaction, okungukuthi, ngaphansi kwemisebe yokukhanya kwe-ultraviolet, i-photoinitiator imunca amandla okukhanya bese ibola ibe ama-radicals mahhala, futhi ama-free radicals aphinde aqalise ukukhanya. I-polymerized monoma ingena kwi-polymerization kanye nokusabela kokuxhumanisa, futhi yakha isakhiwo se-macromolecular esingancibiliki kusixazululo se-alkali esixutshwe ngemva kokusabela. Ifilimu insundu, ukukhanya kwe-ultraviolet akukwazi ukungena, futhi ifilimu ayikwazi ukwenza i-polymerization ye-optical nefilimu yayo eyomile ehambisanayo. Ukuchayeka ngokuvamile kwenziwa emshinini wokuchayeka wezinhlangothi ezimbili ozenzakalelayo.

Kunezinhlobo ezimbili zokuchayeka: ukuchayeka kwesekethe kanye nokuchayeka kwemaski ye-solder. Umsebenzi uwukwelapha indawo yasendaweni enemisebe ngokusebenzisa imisebe yokukhanya kwe-ultraviolet, bese uyithuthukisa ukuze yakhe iphethini yesifunda noma iphethini yokumelana ne-solder.

Inqubo ye-circuit exposure ukubeka ifilimu e-photosensitive ebhodini le-copper clad, bese uyihlanganisa nephethini yesifunda engalungile futhi uyiveze ngemisebe ye-ultraviolet. Ifilimu ye-photosensitive ekhanyiswe imisebe ye-ultraviolet izobhekana ne-polymerization. Ifilimu yezithombe lapha ingamelana ne-Na2CO3 i-alkali ebuthakathaka ngesikhathi sokuthuthukiswa. Isixazululo siyagezwa, futhi ingxenye engazizwayo izokhukhulwa ngesikhathi sokuthuthukiswa. Ngale ndlela, iphethini yesifunda kwifilimu engalungile idluliselwa ngempumelelo ebhodini lezinsimbi zethusi;

Inqubo yokuchayeka kwe-mask ye-solder iyafana: sebenzisa upende we-photosensitive ebhodini lesifunda, bese uvala izindawo ezidinga ukudayiswa ngesikhathi sokuchayeka, ukuze ama-pads avezwe ngemva kokuthuthukiswa.