ʻO ka PCB alumini substrate ka mea a mākou e kapa pinepine ai i ka alumini papa ʻapuni, i kapa ʻia ʻo ka substrate aluminika, ʻo ia ka laminate i hoʻopaʻa ʻia me ke keleawe me ka conductivity thermal maikaʻi, nā waiwai insulation uila a me nā mea hana mīkini. I kēia manawa, ʻo ka mea maʻamau PCB alumini substrate mea metala keleawe aahu laminate (ʻoi loa ka alumini a me ke keleawe, a ʻo kahi hapa liʻiliʻi he hao).

ʻO ka laminate metala keleawe i hoʻopaʻa ʻia i ka alumini he ʻano mea i hana ʻia me ka lole fiberglass uila a i ʻole nā ​​​​mea hoʻoikaika ʻē aʻe i hoʻopili ʻia me ka resin, singulation resin, a me nā mea ʻē aʻe ma ke ʻano he insulating adhesive layer, hoʻokahi a ʻelua ʻaoʻao i uhi ʻia me ka foil keleawe a kaomi wela. . , Hoʻohana nui ʻia no ka hana ʻana a me ka hana ʻana i nā substrate alumini pcb, i hoʻohana pinepine ʻia i nā televise, radios, computers, computers, mobile communications, LED lighting a me nā huahana ʻē aʻe.

Nā pōmaikaʻi o ka pcb alumini substrate

1. ʻOi aku ka maikaʻi o ka hoʻoheheʻe ʻana o ka wela ma mua o ka hoʻolālā FR-4 maʻamau.

2. ʻO ka dielectric i hoʻohana ʻia he 5 a 10 mau manawa i ka conductivity thermal o ke aniani epoxy kahiko a me ka 1/10 o ka mānoanoa.

3. ʻOi aku ka maikaʻi o ka helu hoʻoili wela ma mua o ka PCB paʻa kahiko.

4. Hiki iā ʻoe ke hoʻohana i nā kaupaona keleawe haʻahaʻa ma mua o nā mea i hōʻike ʻia ma ka pakuhi IPC i ʻōlelo ʻia.

E like me ka mea substrate i ka hana ʻana i nā PCB alumini substrates, hoʻohana nui ʻia nā laminates copper clad metala alumini no ka pilina, conduction, insulation a me ke kākoʻo no nā PCB alumini substrates, a he hopena nui i ka wikiwiki o ka hoʻouna ʻana, ka nalowale o ka ikehu a me ka impedance hiʻohiʻona. o ka hoailona ma ka laina. Keakea. ʻO ka hana, ka maikaʻi, ke kaʻina hana i ka hana, ka pae hana, ke kumukūʻai hana a me ka hilinaʻi lōʻihi a me ka paʻa o nā substrates alumini pcb e hoʻoholo ʻia e nā laminates copper clad copper copper.