Iyo PCB aluminium substrate ndiyo yatinowanzo kudaidza kuti aluminium-yakavakirwa circuit board, inonzi aluminium substrate, inova simbi-based copper clad laminate ine yakanaka yekupisa conductivity, magetsi ekudzivirira zvinhu uye mechanical processing properties. Panguva ino, yakajairika PCB aluminium substrate zvinhu ndeyesimbi-based copper clad laminate (kunyanya aluminium-yakavakirwa uye mhangura-yakavakirwa, uye chikamu chidiki simbi-yakavakirwa).

Metal aluminum-based copper clad laminate imhando yeplate-shaped material yakagadzirwa neelectronic fiberglass cloth kana zvimwe zvakasimbiswa zvakaiswa neresin, singulation resin, etc. se insulating adhesive layer, rimwe kana mativi ese akafukidzwa nefoiri yemhangura uye inopisa yakadzvanywa. . , Inonyanya kushandiswa kugadzira uye kugadzira pcb aruminiyamu substrates, iyo inowanzoshandiswa mumaterevhizheni, redhiyo, makombiyuta, makombiyuta, nharembozha, LED chiedza uye zvimwe zvigadzirwa.

Zvakanakira pcb aruminiyamu substrate

1. Kupisa kwekupisa kunonyanya kunaka kudarika chimiro cheFR-4.

2. Dielectric inoshandiswa inowanzoita 5 kusvika ku10 nguva yekupisa kwekushisa kwegirazi repoxy epoxy uye 1/10 yehupamhi.

3. Indekisi yekupisa kupisa inoshanda kupfuura tsika dzakaomarara PCB.

4. Unogona kushandisa huremu hwemhangura hwakaderera pane hwakaratidzwa muIPC yakakurudzirwa chati.

Sezvo iyo substrate zvinhu mukugadzirwa kwePCB aluminium substrates, simbi aluminium-based copper clad laminates inonyanya kushandiswa kubatanidza, conduction, insulation uye kutsigira PCB aluminium substrates, uye ine simba rakakura pakumhanya kwekutapurirana, kurasikirwa kwesimba uye hunhu hunhu. yechiratidzo mumutsara. Kupindira. The kuita, kunaka, processability mukugadzirwa, kugadzirwa pamwero, kugadzira mutengo uye kwenguva refu kuvimbika uye kugadzikana pcb aruminiyamu substrates zvinonyanya akatemerwa simbi aruminiyamu-based copper clad laminates.