Mkpụrụ aluminom PCB bụ ihe anyị na-akpọkarị aluminom dabere sekit, na-ezo aka dị ka aluminom mkpụrụ, nke bụ ọla kọpa clad laminate dị mma nke nwere ezigbo okpomọkụ, ihe mkpuchi ọkụ eletrik na nhazi nhazi. N’oge a, ihe PCB aluminom nkịtị a na-ahụkarị bụ ọla kọpa clad laminate (nke dabere na aluminom na ọla kọpa, na obere akụkụ bụ nke sitere na ígwè).

Metal aluminum dabeere ọla kọpa clad laminate bụ ụdị efere ekara ihe mere nke electronic fiberglass ákwà ma ọ bụ ndị ọzọ na-ewusi ihe impregnated na resin, singulation resin, wdg dị ka insulating nrapado oyi akwa, otu ma ọ bụ n’akụkụ abụọ kpuchie na ọla kọpa foil na-ekpo ọkụ pịa. . , A na-ejikarị eme ihe maka nhazi na ịmepụta pcb aluminum substrates, nke a na-ejikarị na telivishọn, redio, kọmputa, kọmputa, nkwukọrịta mkpanaka, ọkụ ọkụ na ngwaahịa ndị ọzọ.

Uru nke pcb aluminum substrate

1. Mgbasa ọkụ na-ekpo ọkụ dị mma karịa usoro FR-4 ọkọlọtọ.

2. The dielectric eji na-emekarị 5 ka 10 ugboro thermal conductivity nke omenala epoxy iko na 1/10 nke ọkpụrụkpụ.

3. The okpomọkụ nyefe index bụ irè karịa omenala isiike PCB.

4. Ị nwere ike iji ọla kọpa dị ala karịa nke egosiri na eserese IPC kwadoro.

Dị ka mkpụrụ ihe na mmepụta nke PCB aluminum substrates, metal aluminum dabeere ọla kọpa clad laminates bụ tumadi eji maka njikọ, conduction, mkpuchi na nkwado maka PCB aluminum substrates, na-enwe nnukwu mmetụta na nnyefe ọsọ, ike ọnwụ na àgwà impedance. nke mgbaàmà na akara. Ntinye aka. The arụmọrụ, àgwà, processability na mmepụta, n’ichepụta larịị, n’ichepụta ego na ogologo oge ntụkwasị obi na nkwụsi ike nke pcb aluminum substrates bụ isi kpebisiri ike site metal aluminum dabeere ọla kọpa clad laminates.