PCB nā koi no ka uhi nickel non-electrolytic

Pono e hoʻokō ka uhi nickel electroless i kekahi mau hana:

ili waiho gula

ʻO ka pahuhopu hope loa o ke kaapuni, ʻo ia ke hana i kahi pilina ma waena o ka PCB a me nā ʻāpana me ka ikaika kino kiʻekiʻe a me nā ʻano uila maikaʻi. Inā loaʻa kekahi oxide a i ʻole contamination ma ka ʻili o ka PCB, ʻaʻole e hiki mai kēia pilina soldered me ke kahe nāwaliwali o kēia lā.

Hoʻomaka maoli ke gula ma ka nickel a ʻaʻole e oxidize i ka wā mālama lōʻihi. Eia naʻe, ʻaʻole e kahe ke gula ma ka nickel oxidized, no laila pono e noho maʻemaʻe ka nickel ma waena o ka ʻauʻau nickel a me ka hemo ʻana o ke gula. Ma kēia ala, ʻo ka koi mua o ka nickel e noho kaʻawale i ka oxidation lōʻihi e hiki ai i ka ua o ke gula. Ua hoʻomohala ka ʻāpana i kahi ʻauʻau ʻauʻau kemika e ʻae i ka 6-10% phosphorus maʻiʻo i ka ua o ka nickel. ʻO kēia maʻiʻo phosphorus i loko o ka nickel coating electroless i manaʻo ʻia he kaulike kūpono o ka mālama ʻauʻau, oxide, a me nā waiwai uila a me ke kino.

paakiki

Hoʻohana ʻia ka non-electrolytic nickel coating surface i nā noi he nui e koi ai i ka ikaika kino, e like me nā bearings transmission automotive. ʻOi aku ka liʻiliʻi o nā pono PCB ma mua o kēia mau noi, akā no ka hoʻopaʻa uea

(Wire-bonding), touch pad contact points, plug-in connector (edge-connetor) a me ka hoʻomau ʻana i ka hana, he mea nui ka paʻakikī. Pono ka paakiki nickel no ka hoopaa uwea. Inā hoʻololi ke alakaʻi i ka waihona, hiki ke nalowale i ka friction, kahi e kōkua ai i ke alakaʻi “hoʻoheheʻe” i ka substrate. Hōʻike ke kiʻi SEM ʻaʻohe komo i ka ʻili o ka nickel / gula a i ʻole nickel / palladium (Pd) / gula.

Nā ʻano hiʻona uila

Ma muli o ka maʻalahi o ka hana ʻana, ʻo ke keleawe ka mea i koho ʻia no ka hoʻokumu ʻana i ke kaapuni. ʻOi aku ka maikaʻi o ke keleawe ma mua o kēlā me kēia metala. He maikaʻi ke kalaiwa uila ke gula a ʻo ia ke koho kūpono loa no ka metala o waho, no ka mea, e kahe ana nā electrons ma ka ʻili o kahi ala conductive (“surface” pōmaikaʻi).

Copper 1.7 µΩcm Gula 2.4 µΩcm Nickel 7.4 µΩcm Electroless nickel plating 55~90 µΩcm ʻOiai ʻaʻole i hoʻopilikia ʻia nā hiʻohiʻona uila o ka hapa nui o nā papa hana e ka papa nickel, hiki i ka nickel ke hoʻopili i nā hiʻohiʻona uila o nā hōʻailona kiʻekiʻe. ʻO ka nalowale o ka hōʻailona o ka microwave PCB hiki ke ʻoi aku ma mua o ka kikoʻī o ka mea hoʻolālā. He kūlike kēia ʻano me ka mānoanoa o ka nickel-pono ke kaapuni e hele i loko o ka nickel a hiki i nā hui solder. I nā noi he nui, hiki ke hoʻihoʻi ʻia ka hōʻailona uila i loko o ka kikoʻī hoʻolālā ma ka hōʻike ʻana he emi ka waihona nickel ma mua o 2.5 µm.

Kūpaʻa hoʻopili

He ʻokoʻa ke kūpaʻa pili me ka solderability no ka mea ʻaʻole i kūʻai ʻia ka ʻili nickel/gula i ke ola o ka huahana hope. Pono e mālama ʻo Nickel/gold i ka conductivity uila i ka pilina o waho ma hope o ka ʻike ʻana i ka kaiapuni lōʻihi. Hōʻike ka puke ʻo Antler i ka makahiki 1970 i nā koi pili o ka nickel/gula surfaces ma nā huaʻōlelo quantitative. Hoʻopaʻa ʻia nā kaiapuni hoʻohana hope like ʻole: 3″ 65°C, kahi wela maʻamau maʻamau no nā ʻōnaehana uila e hana ana i ka wela lumi, e like me nā kamepiula; 125 ° C, ka mahana e pono ai nā mea hoʻohui maʻamau e hana, i kuhikuhi pinepine ʻia no nā noi koa; 200 °C, e lilo ana kēia mahana i mea nui no nā lako lele.

No nā kaiapuni haʻahaʻa haʻahaʻa, ʻaʻole koi ʻia kahi pale nickel. Ke piʻi aʻe ka mahana, piʻi ka nui o ka nickel e pale ai i ka hoʻoili nickel/gold.

ʻO ka papa pale nikeli Hoʻopili ʻoluʻolu ma 65°C Hoʻopili ʻoluʻolu ma 125°C Hoʻopili ʻoluʻolu ma 200°C 0.0 µm 100% 40% 0% 0.5 µm 100% 90% 5% 2.0 µm 100% µm 100% 10% 4.0% 100% % 100%