PCB iimfuno non-electrolytic nickel ukutyabeka

I-electroless nickel coating kufuneka ifezekise imisebenzi emininzi:

Indawo yediphozithi yegolide

Eyona njongo yesekethe kukwenza unxibelelwano phakathi kwePCB kunye namacandelo anamandla aphezulu omzimba kunye neempawu ezilungileyo zombane. Ukuba kukho nayiphi na i-oxide okanye ungcoliseko kumphezulu we-PCB, olu xhulumaniso luthengisiweyo aluzukwenzeka ngokuguquguquka okubuthathaka kwanamhlanje.

Igolide ngokwemvelo ibeka i-nickel kwaye ayiyi ku-oxidize ngexesha lokugcinwa kwexesha elide. Nangona kunjalo, igolide ayigqithisi kwi-nickel ene-oxidized, ngoko ke i-nickel kufuneka ihlale ihlambulukile phakathi kwebhafu ye-nickel kunye nokuchithwa kwegolide. Ngale ndlela, imfuno yokuqala ye-nickel kukuhlala ikhululekile kwi-oxidation ixesha elide ukuvumela ukuna kwegolide. Icandelo liye laphuhlisa ibhafu yokucwiliswa kweekhemikhali ukuvumela i-6-10% umxholo we-phosphorus kwimvula ye-nickel. Lo mxholo we-phosphorus kwi-electroless nickel coating ithathwa njengebhalansi ecokisekileyo yolawulo lokuhlambela, i-oxide, kunye neempawu zombane kunye nezomzimba.

lukhuni

I-non-electrolytic nickel surface coating surface isetyenziswa kwizicelo ezininzi ezifuna amandla omzimba, njengeebheringi zokuhambisa iimoto. Iimfuno ze-PCB zingqongqo kakhulu kunezi zicelo, kodwa kukudibanisa ucingo

(I-Wire-bonding), i-touch pad touch points, i-plug-in connector (i-edge-connetor) kunye nokugcinwa kokulungiswa, iqondo elithile lobunzima lisabalulekile. Ukudibanisa ucingo kufuna ubulukhuni be-nickel. Ukuba i-lead ikhubaza idiphozithi, ilahleko ye-friction ingenzeka, enceda ukukhokela “kunyibilike” kwi-substrate. Umfanekiso we-SEM ubonisa ukuba akukho kungena kumphezulu we-nickel flat / igolide okanye i-nickel / palladium (Pd) / igolide.

Iimpawu zombane

Ngenxa yokulula kwayo, ubhedu yintsimbi ekhethiweyo yokubunjwa kweesekethe. I-conductivity yobhedu iphezulu phantse yonke isinyithi. Igolide nayo ine-conductivity elungileyo yombane kwaye ilukhetho olugqibeleleyo lwentsimbi engaphandle, kuba ii-electron zivame ukuhamba kumphezulu wendlela ye-conductive (inzuzo “yobuso”).

Ubhedu 1.7 µΩcm Igolide 2.4 µΩcm Nickel 7.4 µΩcm Electroless nickel plating 55~90 µΩcm Nangona iimpawu zombane zeebhodi ezininzi zokuvelisa azichatshazelwa ngumaleko we-nickel, i-nickel inokuchaphazela iimpawu zombane zeempawu ze-high-frequency signals. Ilahleko yesiginali ye-microwave PCB inokodlula ubume bomyili. Esi siganeko silingana nobukhulu be-nickel-isiphaluka kufuneka sidlule kwi-nickel ukufikelela kumalungu e-solder. Kwizicelo ezininzi, isignali yombane inokubuyiselwa ngaphakathi kwinkcazo yoyilo ngokucacisa ukuba idiphozithi yenickel ingaphantsi kwe-2.5 µm.

Ukumelana noqhakamshelwano

Ukuchasana noqhagamshelwano kuyahluka kwi-solderability ngenxa yokuba i-nickel / surface yegolide ihlala ingabonakaliyo kubomi bemveliso yokugqibela. I-Nickel / igolide kufuneka igcine ukuhanjiswa kombane kuqhagamshelwano lwangaphandle emva kokubonakaliswa kwexesha elide lokusingqongileyo. Incwadi ka-Antler ka-1970 ichaza iimfuno zoqhagamshelwano lwe-nickel / umphezulu wegolide ngokwemiqathango yobuninzi. Iindawo ezahlukeneyo zokusetyenziswa kokuphela ziyafundwa: 3″ 65 ° C, ubushushu obuqhelekileyo obuqhelekileyo kwiinkqubo zombane ezisebenza kubushushu begumbi, njengeekhompyuter; 125°C, iqondo lobushushu apho iziqhagamshelo jikelele kufuneka zisebenze, ngokufuthi zicaciswa kwizicelo zomkhosi; 200 °C, obu bushushu buya busiba bubaluleke ngakumbi kwisixhobo sokubhabha.”

Kwimimandla yobushushu obuphantsi, akukho mqobo we-nickel ofunekayo. Njengoko izinga lokushisa linyuka, inani le-nickel elifunekayo ukukhusela ukudluliselwa kwe-nickel / igolide.

I-Nickel barrier layer Uqhagamshelwano olwanelisayo ku-65°C Uqhagamshelwano olwanelisayo kwi-125°C Uqhagamshelwano olwanelisayo kwi-200°C 0.0 µm 100% 40% 0% 0.5 µm 100% 90% 5 µm% 2.0% 100% 100% 10% 4.0% 100% % 100%