PCB izidingo ze-non-electrolytic nickel coating

I-electroless nickel coating kufanele ifeze imisebenzi eminingana:

Indawo yediphozi yegolide

Umgomo omkhulu wesekethe uwukwenza ukuxhumana phakathi kwe-PCB nezingxenye ezinamandla angokomzimba aphezulu kanye nezici ezinhle zikagesi. Uma kukhona noma iyiphi i-oxide noma ukungcola endaweni ye-PCB, lokhu kuxhumana okudayisiwe ngeke kwenzeke ngokuguquguquka okubuthakathaka kwanamuhla.

Igolide ngokwemvelo lishona ku-nickel futhi ngeke likhiphe i-oxidize ngesikhathi sokulondoloza isikhathi eside. Nokho, igolide alidli ku-nickel ene-oxidized, ngakho-ke i-nickel kufanele ihlale ihlanzekile phakathi kwe-nickel bath kanye nokuncibilika kwegolide. Ngale ndlela, imfuneko yokuqala ye-nickel ukuhlala ingenayo i-oxidation isikhathi eside ngokwanele ukuvumela ukuna kwegolide. Ingxenye yenze indawo yokugeza yokucwiliswa ngamakhemikhali ukuze ivumele okuqukethwe kwe-phosphorus okungu-6-10% emvuleni ye-nickel. Lokhu okuqukethwe kwe-phosphorus embotsheni ye-nickel engenawo amandla kubhekwa njengebhalansi ngokucophelela yokulawula ukugeza, i-oxide, nezakhiwo zikagesi nezomzimba.

ubulukhuni

I-non-electrolytic nickel coating surface isetshenziswa ezinhlelweni eziningi ezidinga amandla omzimba, njengama-bearings okudlulisela izimoto. Izidingo ze-PCB ziqinile kakhulu kunalezi zinhlelo zokusebenza, kodwa zokuhlanganisa izintambo

(I-wire-bonding), amaphoyinti okuxhumana wephedi yokuthinta, isixhumi se-plug-in (i-edge-conetor) nokusimama kokucubungula, izinga elithile lokuqina lisabalulekile. I-wire bonding idinga ubulukhuni be-nickel. Uma ukuhola kukhubaza idiphozi, ukulahlekelwa ukungqubuzana kungase kwenzeke, okusiza ukuhola “kuncibilike” ku-substrate. Isithombe se-SEM sibonisa ukuthi akukho ukungena okungaphezulu kwe-nickel eyisicaba/igolide noma i-nickel/palladium (Pd)/igolide.

Izici zikagesi

Ngenxa yokuthi kulula ukwenza, ithusi liyinsimbi yokuzikhethela ekubunjweni kwesifunda. I-conductivity yethusi iphakeme cishe yonke insimbi. Igolide libuye libe nokuhamba kahle kukagesi futhi liyisinqumo esiphelele sensimbi engaphandle, ngoba ama-electron avame ukugeleza ebusweni bomzila we-conductive (inzuzo “yobuso”).

I-Copper 1.7 µΩcm Igolide 2.4 µΩcm Nickel 7.4 µΩcm Electroless nickel plating 55~90 µΩcm Nakuba izici zikagesi zamabhodi amaningi okukhiqiza zingathintwa ungqimba lwe-nickel, i-nickel ingathinta izici zikagesi zamasignali amaza aphezulu. Ukulahlekelwa kwesignali ye-microwave PCB kungadlula ukucaciswa komklami. Lesi simo silingana nobukhulu be-nickel-isifunda sidinga ukudlula ku-nickel ukuze sifinyelele amalunga e-solder. Ezinhlelweni eziningi, isignali kagesi ingabuyiselwa ngaphakathi kokucaciswa kwedizayini ngokucacisa ukuthi idiphozi ye-nickel ingaphansi kuka-2.5 µm.

Ukuphikiswa kokuxhumana

Ukumelana nokuxhumana kuhlukile ekuthengiseni ngoba indawo ye-nickel/igolide ihlala ingadalulwanga kuyo yonke impilo yomkhiqizo wokugcina. I-Nickel/igolide kufanele igcine ukuguquguquka kukagesi ekuxhumaneni kwangaphandle ngemva kokuchayeka isikhathi eside kwemvelo. Incwadi ka-Antler ka-1970 iveza izidingo zokuxhumana zezindawo ze-nickel/zegolide ngokwemibandela yobuningi. Izindawo ezihlukene zokusetshenziswa kokugcina ziyafundwa: 3″ 65°C, izinga lokushisa eliphakeme elivamile lamasistimu kagesi asebenza ekamelweni lokushisa, njengamakhompyutha; 125°C, izinga lokushisa okufanele izixhumi ezivamile zisebenze kulo, ngokuvamile elicaciswe ukusetshenziswa kwezempi; 200 °C, izinga lokushisa liya ngokuya libaluleke kakhulu emishinini yendiza.”

Ezimweni zokushisa eziphansi, asikho isivimbelo se-nickel esidingekayo. Njengoba izinga lokushisa likhuphuka, inani le-nickel elidingekayo ukuvimbela ukudluliswa kwe-nickel/igolide liyakhuphuka.

Isendlalelo sokuvimbela i-nickel Ukuxhumana okwanelisayo ku-65°C Ukuthintana okwanelisayo ku-125°C Ukuthintana okwanelisayo ku-200°C 0.0 µm 100% 40% 0% 0.5 µm 100% 90% 5% 2.0 µm% 100% 100% 10% 4.0% 100% 100% 60% % XNUMX%