I-PCB ibizwa ngokuba yi ibhodi yesekethe eprintiweyo kwaye sisixhobo esibalulekileyo kushishino lombane. Njengomthwali obalulekileyo wokudibanisa amacandelo, ixhasa uphuhliso lweshishini lombane. Nayiphi na imveliso yombane ayinakwahlulwa kwisicelo seebhodi zesekethe zePCB. Ngomlinganiselo omkhulu nyaka ngamnye, ukusetyenzwa kweemveliso zePCB kukwafumana imarike enkulu yoshishino. Ukusetyenziswa kwe-PCB laser cutting processing technology yinxalenye ebalulekileyo yalo.

Iteknoloji yokusika i-PCB laser

Ukusetyenziswa komatshini wokusika we-laser we-PCB kushishino lwe-PCB yaqala kwangoko, kodwa ibisoloko ipholile kwaye ingasetyenziswa kuphela kumashishini akhethekileyo, njengophando lwezesayensi, ishishini lomkhosi kunye nezinye iinkalo. Esona sizathu siphambili kukusetyenziswa kwangoko kwe-CO2 yokusika i-laser, enempembelelo enkulu ye-thermal kunye nokusebenza okuphantsi. Ngokuphuhliswa kobuchwepheshe be-laser, imithombo yokukhanya ngakumbi nangakumbi isetyenziswa kwishishini le-PCB, njenge-ultraviolet, ukukhanya okuluhlaza, i-fiber optical, i-CO2, njalo njalo. Kwelinye icala, ishishini lePCB liyakhula kwicala lokukhanya, ukubhitya, ukudityaniswa okuphezulu, kunye nokuchaneka okuphezulu. Iinkqubo zesiNtu zineengxaki ezahlukeneyo ezifana ne-burrs, uthuli, uxinzelelo, ukungcangcazela, kunye nokungakwazi ukucubungula amagophe. Ke ngoko, kwintsimi yePCB, iingenelo zesicelo sokusika i-laser kunye netekhnoloji yokwahlulahlula ibhodi ngokuthe ngcembe ziye zabonakala. Iinzuzo zayo kukuba ukusingathwa koqhagamshelwano akunaxinzelelo kwaye akuyi kuphazamisa ibhodi; ayiyi kuvelisa uthuli; imiphetho yokusika igudileyo kwaye icocekile, kwaye ayiyi kuba ne-burrs; Iibhodi zePCB ezinamacandelo zinokusetyenzwa; imizobo engafunekiyo inokuqhubekekiswa. Nangona kunjalo, itekhnoloji ye-laser iseneentsilelo, kwaye ukusebenza kakuhle akunakuthelekiswa nobuchwepheshe bendabuko. Ke ngoko, itekhnoloji yokusika i-laser okwangoku isetyenziswa kuphela kwiinkalo ezifuna ukuchaneka okuphezulu.

PCB laser cutting effect

PCB laser drilling technology

Ukongeza kwi-PCB yokusika i-laser, i-PCB laser drilling iye yaba yeyona ndlela iphambili yokusetyenzwa kweemarike. Nge-CO2 laser okanye i-ultraviolet laser drilling yeebhodi zesekethe ze-PCB, imingxuma eyimfama kunye nemingxuma inokugrunjwa ngesantya esiphezulu. Le ndlela inokusebenza okuphezulu kokusebenza kunye nesiphumo esihle. Kubuhlungu ukuba esi sixhobo silawulwa ngabavelisi bangaphandle ixesha elide. Nangona iyinto encinci yasekhaya, isabelo semarike sisonke sisencinci kakhulu, kwaye iimpumelelo zetekhnoloji ziyafuneka.

Itekhnoloji yokusika iLaser yebhodi ethambileyo nenzima

I-FPCA yokusika ibhodi ethambileyo iqhutywe ngokupheleleyo ngumatshini wokusika we-UV ultraviolet laser kwimarike, kwaye ukuqhubela phambili kophuhliso kuye kwaba kuhle kwiminyaka emibini edlulileyo. Ijongene nokuphuhliswa kokulayishwa ngokuzenzekelayo kunye nokukhulula kunye nokusika amandla aphezulu, kwaye ngokuqhelekileyo isebenzisa i-laser ye-ultraviolet ngaphezu kwe-15W yokucubungula. Umatshini wokusika we-UV we-laser nawo usetyenziswa kwibhodi ethambileyo nenzima.

PCB QR ikhowudi laser ukumakisha

Ukusetyenziswa kokumakishwa kwekhowudi ye-QR ye-PCB kwelinye icala ukomeleza isiphumo sophawu, kwelinye icala, kulungele ukulandeleka komgangatho wemveliso kunye nokulandeleka kolwalathiso lwemarike. Kukulungele ukulawula kwaye kuluncedo ekuphuculeni ukukhuphisana kwemarike yemveliso. Iphuhliswe ngokupheleleyo kwimarike, kwaye kuya kubakho imarike ebanzi kakhulu kwixesha elizayo. Ekusetyenzisweni kwe-PCB yekhowudi ye-laser ekroliweyo ye-laser, umatshini wokumakisha we-UV ultraviolet laser, umatshini wokumakisha we-CO2 we-laser, umatshini wokumakisha we-fiber laser, umatshini wokumakisha we-laser eluhlaza, njl.

PCB QR ikhowudi laser isiphumo sokumakisha

Ukusetyenziswa kobugcisa belaser kushishino lwePCB ikwabandakanya itekhnoloji efana nokukrolwa kwesekethe kunye ne-laser solder ibhola yokutshiza.