I-Multilayer PCB uma kuqhathaniswa ne-panel eyodwa ye-PCB, ngaphandle kwekhwalithi yangaphakathi, ngaphesheya, siyabona umehluko, lo mehluko ubalulekile ekuqineni nasekusebenzeni kwe-PCB kukho konke ukuphila kwayo. Inzuzo enkulu ye-PCB multilayer: leli bhodi limelana ne-oxidation. Isakhiwo esihlukahlukene, ukuminyana okuphezulu, ubuchwepheshe bokumboza ubuso, ukuqinisekisa ikhwalithi yebhodi lesifunda liphephile, kungakhululeka ngokusetshenziswa. Okulandelayo izici ezibalulekile zokwethenjelwa kwamabhodi we-multilayer aphezulu, okungukuthi, izinzuzo nobubi bamabhodi we-PCB multilayer:

1. The ukushuba zethusi odongeni imbobo PCB multilayer ibhodi ngokuvamile 25 microns;

Izinzuzo: Ukuthembela okuthuthukisiwe, kufaka phakathi ukumelana nokwandiswa kwe-Z-axis.

Okubi: Kepha kunezingozi ezithile: izinkinga zokuthi kungenzeka yehluleke ngaphansi kwezimo zomthwalo, ekusetshenzisweni kwangempela, ngesikhathi sokushaya noma kwe-degassing, ukuxhumana kagesi ngesikhathi somhlangano (ukwahlukaniswa kwangaphakathi kongqimba, ukuqhekeka kodonga lomgodi) noma ngaphansi kwezimo zomthwalo. I-IPC Class2 (ejwayelekile emafemini amaningi) idinga ukuthi amabhodi we-PCB multilayer abe ngaphansi kuka-20% wethusi.

2. Akukho ukulungiswa kwe-welding noma ukulungiswa kwesifunda okuvulekile

Izinzuzo: Ukujikeleza okuphelele kuqinisekisa ukuthembeka nokuphepha, akukho ukulungiswa, akukho bungozi.

Nebubi: PCB multilayer ivulekile uma isevisi ngokungafanele. Noma kulungiswe kahle, kungahle kube nengozi yokwehluleka ngaphansi kwezimo zomthwalo (ukudlidliza, njll.), Okungaholela ekwehlulekeni ekusebenziseni kwangempela.

3. Idlula izidingo zokuhlanzeka zokucaciswa kwe-IPC

Izinzuzo: Thuthukisa ukuhlanzeka kwe-PCB multilayer board kungathuthukisa ukuthembeka.

Izingozi: Insalela esephaneli yezintambo, ukuqongelela i-solder kungabeka engcupheni isihlangu se-solder, izinsalela ze-ionic zingaholela engcupheni yokugqwala nokungcoliswa kwendawo ye-weld, okungaholela ezindabeni zokuthembeka (ama-welds amabi / ukwehluleka kukagesi) kanye ekugcineni kwandisa amathuba okwehluleka kwangempela.

4. Vikela ngokuqinile impilo yesevisi yokwelashwa ngakunye kwendawo

Izinzuzo: Welding, ukwethembeka nokunciphisa ingozi yokungena komswakama

Izingozi: Ukwelashwa ngaphezulu kwamabhodi amadala e-PCB amaningi kungaholela ekushintsheni kwe-metallographic, kungahle kube nezinkinga ze-solder, ngenkathi ukungena kwamanzi kungaholela ezinkingeni ngesikhathi somhlangano kanye / noma ukusetshenziswa kwangempela kokubeka, ukuhlukaniswa kodonga lwangaphakathi nodonga (isifunda esivulekile), njll .

Noma kunqubo yokukhiqiza neyomhlangano noma ekusetshenzisweni kwangempela, ibhodi le-PCB multilayer kumele libe nokusebenza okuthembekile, yiqiniso, lokhu kuhlobene nemishini nobuchwepheshe bezinga lefektri yebhodi le-PCB.