A ’bruidhinn mun duilgheadas duilich a thaobh solar cumhachd suidse, PCB cloth plate problems is not very difficult, but if want to cloth up a refined PCB must be one of the difficulties in switching power supply (PCB design is not good, may cause no matter how to debug parameter debugging cloth out of the situation, so not scaremongering) when reason was the PCB board consideration or a lot of, such as: Coileanadh dealain, slighe pròiseas, riatanasan sàbhailteachd, buaidh EMC, msaa; Am measg nam factaran a bu chòir a bhith a ’beachdachadh, is e dealan an rud as bunaitiche, ach is e EMC an fheadhainn as duilghe a thuigsinn, agus tha cnap-starra mòran phròiseactan na laighe ann an EMC. Na leanas bho 22 stiùireadh gus am bòrd PCB agus EMC a cho-roinn.

1, faodaidh cuairt aibidh a bhith gu socair dealbhadh PCB circuit EMI

Faodar buaidh a ’chuairt gu h-àrd air EMC a shamhlachadh, tha na sìoltachain inntrigidh an seo; Lightning-proof pressure sensitivity; Resistance R102 gus casg a chuir air sruth clisgeadh (le sealaidheachd gus call a lughdachadh); Key error mode X capacitance and Y capacitance with inductor filtering; There are fuses affecting the safety board; Tha gach aon de na h-innealan sin air leth cudromach, agus bu chòir luach a chuir air gnìomh agus gnìomh gach inneal. The EMC severity level should be considered when designing the circuit, such as the number of filters to be set, the number and location of the y-capacitor quantity. The choice of pressure-sensitive size and quantity is closely related to our requirements for EMC. Welcome to discuss the seemingly simple EMI circuit that actually contains profound truths for each component.

2. Circuit agus EMC: (am prìomh topology flyback as eòlaiche, faic dè na prìomh phàirtean den chuairt anns a bheil uidheamachd EMC)

The circled parts in the circuit in the figure above are very important for EMC (note that the green part is not), such as radiation. It is known that electromagnetic field radiation is spatial, but the basic principle is the change of magnetic flux, which involves the effective cross-sectional area of magnetic field, namely the corresponding loop in the circuit. The electric current can produce a magnetic field, which is stable and cannot be converted into an electric field. Ach bidh sruth dealain a tha ag atharrachadh a ’toirt a-mach raon magnetach a tha ag atharrachadh, agus faodaidh raon magnetach caochlaideach raon dealain a thoirt gu buil (gu dearbh, is e seo an co-aontar ainmeil Maxwell agus tha mi a’ cleachdadh cànan sìmplidh), agus faodaidh raon dealain caochlaideach magnetach a thoirt gu buil. achadh. Mar sin dèan cinnteach gun toir thu aire do na h-àiteachan far a bheil stàitean air / dheth, sin aon de na stòran aig an EMC, agus is e seo aon de na stòran aig an EMC. For example, the dotted line loop in the circuit is the opening and closing loop of the switch tube. Not only the switching speed can be adjusted during the design of the circuit, but also the area of the wiring loop of the layout board has an important influence on EMC! Is e an dà lùb eile lùban neo-làthaireachd agus lùban ceartachaidh, tuig an toiseach ro làimh, agus an uairsin bruidhinn!

3. Comann eadar dealbhadh PCB agus EMC

1.PCB loop has a very important influence on EMC, such as flyback main power loop. If it is too large, the radiation will be poor.

2. Filter wiring effect, filter is used to filter out interference, but if PCB wiring is not good, filter may lose the effect it should have.

3. The structure part, the radiator design grounding is not good will affect the grounding of the shielded version;

4. Ma tha am pàirt mothachail ro fhaisg air an stòr eadar-theachd, leithid cuairteachadh EMI agus tiùb suidse, bidh e gu cinnteach a ’leantainn gu droch EMC, agus tha feum air àite aonaranachd soilleir.

5. Uèir lùb lùb RC.

6.Y capacitor grounding and wiring, and the position of Y capacitor is also critical!

I’m going to talk about this, and I’m going to talk about it more, but I’m going to give you a lead.

Here’s a quick example:

Mar a chithear anns a ’bhogsa dotagach san fhigear gu h-àrd, chaidh sreangadh prìne X capacitor a chuir a-steach. Faodaidh tu ionnsachadh mar a nì thu sreangadh prìne capacitor taobh a-muigh (a ’cleachdadh an uèirleadh gnàthach teannachaidh). San dòigh seo, faodaidh buaidh sìoltachaidh X capacitor an stàit as fheàrr a ruighinn.

4. Ullachadh airson dealbhadh PCB: (ma tha thu làn deiseil, faodaidh an dealbhadh a bhith seasmhach ceum air cheum gus an dealbhadh a sheachnadh agus tòiseachadh a-rithist)

There are roughly the following aspects, are their own design process to consider, all the content has nothing to do with other tutorials, are just their own experience summary.

1. Appearance structure size, including positioning hole, air channel flow direction, input and output socket, need to match with the customer system, also need to communicate with the customer assembly problems, height limit and so on.

2. Safety certification, products do what kind of certification, where do the basic insulation creepage distance to leave enough, where do strengthen the insulation to leave enough distance or slot.

3. Packaging design: there is no special period, such as preparation for customized packaging.

4. Taghadh slighe pròiseas: taghadh pannal dùbailte pannal singilte, no bòrd ioma-fhilleadh, a rèir an diagram sgeama agus meud a ’bhùird, cosgais agus measadh coileanta eile.

5. Other special requirements of customers.

The structure and process will be relatively more flexible, safety regulations or relatively fixed part, what certification to do, what safety standards, of course, there are some safety regulations are common in many standards, but there are also some special products such as medical treatment will be more stringent.

For the new entry engineer friends are not dazzled;

Next list some general products general, the following is summarized for IEC60065 specific cloth requirements, for safety needs to keep in mind, encounter specific products will be targeted processing:

1. Tha astar a ’phloc fiùs cuir a-steach nas motha na 3.0mm mar a tha riatanach le riaghailtean sàbhailteachd, agus is e 3.5mm a th’ anns a ’phlàta fhèin (dìreach a’ bruidhinn, is e astar creepage an leaghaidh 3.5mm ro agus 3.0mm às deidh sin).

2. Before and after the rectifier bridge, the safety requirements are 2.0MM, and the plate layout is 2.5MM.

3. After rectification, safety regulations generally do not require, but the distance between high and low voltage is left according to the actual voltage, and 400V high voltage is left above 2.0mm.

4. Feumaidh na riaghailtean sàbhailteachd airson a ’chiad ìre 6.4mm (beàrn dealain), agus bu chòir an astar creepage a bhith 7.6mm. (Thoir fa-near gu bheil seo co-cheangailte ris an fhìor bholtachd cuir a-steach, feumar iomradh a thoirt air a ’chlàr airson àireamhachadh sònraichte, an dàta a chaidh a thoirt seachad airson fiosrachadh a-mhàin, le ùmhlachd don t-suidheachadh fhìor)

5. Cold ground and hot ground are clearly marked for the first stage; Bu chòir comharra L, N, INPUT AC INPUT comharra, comharra rabhaidh fuses agus mar sin air adhart a bhith air a chomharrachadh gu soilleir;

It is reiterated that the actual safety distance is related to the actual input voltage and the working environment, so it is necessary to refer to the table for specific calculation. The data provided is for reference only and shall prevail in the actual situation.

5. Consider other factors for PCB design safety

1. Understand what certification their products do and what product categories they belong to. For example, medical treatment, communication, electricity, TV and so on are different, but there are also many similarities.

2. Ann an riaghailtean sàbhailteachd, tuig feartan insulation an àite dlùth le bòrd PCB, dè an àite a th ’ann an insulation bunaiteach, dè an àite a th’ ann an insulation ath-neartaichte, chan eil astar insulation àbhaisteach eadar-dhealaichte an aon rud. Tha e nas fheàrr sgrùdadh a dhèanamh air inbhean, agus is urrainn dha astar dealain, astar creepage obrachadh a-mach.

3. Focus on the safety devices of the product, such as the relationship between the magnetism of the transformer and the original side;

4. Radiator and surrounding distance problem, radiator insulation is not the same as the ground is not the same, the ground is cold, hot insulation is the same cloth.

5. Special attention should be paid to the distance of insurance, requiring the strictest place. The distance between front and rear of the fuse is consistent.

6. Dàimh eadar comas Y agus sruth aoidionachd agus cuir fios gu sruth.

Agus mar sin air adhart, mìnichidh e gu mionaideach mar a dh ’fhàgas tu an t-astar, mar a nì thu riatanasan sàbhailteachd.

6, Dealbhadh PCB de dhealbhadh solar cumhachd

1. An toiseach tomhais meud PCB agus an àireamh de phàirtean, gus dùmhlachd math a choileanadh, no dùmhail, bidh grànda grànda.

2. Modularize the circuit, take the core devices as the center, and place the key devices first.

3. Tha an inneal an aghaidh suidheachadh dìreach no còmhnard, tha aon dhiubh brèagha, tha am fear eile goireasach le plug-in, faodaidh suidheachaidhean sònraichte beachdachadh air teilt.

4. Take cabling into consideration and arrange the layout in the most reasonable position for subsequent cabling.

5. Lùghdaich an raon lùb cho mòr ‘sa ghabhas rè an dealbhadh. Thèid na ceithir lùban a mhìneachadh gu mionaideach nas fhaide air adhart.

Do the above points, of course, flexible use, more reasonable layout will be born soon.

Is e na leanas a ’chiad PCB maighdean a tharraing mi, o chionn mòran bhliadhnaichean, bha e gu math duilich a chrìochnachadh, is dòcha gu bheil duilgheadas beag sa mheadhan, ach is fhiach an dealbhadh coitcheann ionnsachadh:

In this figure, the power density is still relatively high. The control part of LLC, the auxiliary source part and the BUCK circuit driver (high-power multi-channel output) part are on the small board, which is not taken out. Let’s take a look at the layout characteristics of the main power:

1. Tha crìochnachaidhean cur-a-steach agus toraidh stèidhichte agus cha ghabh an gluasad. Tha am bòrd ceart-cheàrnach.

An seo tha an dealbhadh bho bhonn gu mullach, bho chlì gu deas, agus tha an sgaoileadh teas an urra ris an t-slige.

Tha cuairteachadh 2.EMI fhathast stiùireadh sruthadh soilleir, a tha glè chudromach, air dhòigh eile chan eil e brèagha agus dona airson EMC.

3. The position of large capacitor should consider PFC loop and LLC main power loop as far as possible;

4. The current of the side side is relatively large. In order to run the current and dissipate the heat of the rectifier tube, this layout is adopted. Mar as trice bidh an ìre àrd de chumhachd àrd a ’dol àicheil, agus tha an ìre bun a’ dol deimhinneach.

Each board has its own characteristics, of course, also has its own difficulties, how to reasonably solve the key, we can understand the layout of reasonable selection of meaning?

7. Measadh air eisimpleirean PCB

I think it is a good place to do it. Of course, there will always be defects, which can also be pointed out. It is not easy for a single panel to be so compact, so you can use this board to learn and discuss! Behind will also be for this board to explain learning, we first enjoy.

8. Understanding of the four loops of PCB design :(the basic requirement of PCB layout is the small area of the four loops)

In addition, the absorption loop (RCD absorption, RC absorption of MOS tube and RC absorption of rectifier tube) is also very important, which is also the loop that generates high frequency radiation. If you have any questions about the above figure, you are welcome to discuss them. We are not afraid of any questions.

9. Àite teth dealbhaidh PCB (puing comas fleòdraidh) agus uèir talmhainn:

Cùisean a dh ’fheumas aire:

1. Pay special attention to hot spots (high-frequency switching points), which are high-frequency radiation points. Cable layout has a great impact on EMC.

2. Tha an lùb a chaidh a chruthachadh le àiteachan teth beag agus tha an uèirleadh goirid, agus chan eil an uèirleadh cho tiugh ‘s a ghabhas, ach cho fad‘ s a tha an sruth gu leòr.

3. The ground cable must be grounded at a single point. Prìomh thalamh cumhachd agus talamh comharra air leth, bidh talamh samplachadh a ’dol air leth.

4. Feumaidh talamh an radiator a bhith ceangailte ris a ’phrìomh raon cumhachd.