Kuxelwe ukuba i-TSMC iphumelele inani elikhulu lee-odolo zenkqubo ye-3nm kwi-Intel. I-Intel iya kusebenzisa itekhnoloji entsha ukuphuhlisa isixhobo sayo esilandelayo.
U-Udn ucaphule kwimithombo kwivenkile yonikezelo esithi i-Intel ifumene uninzi lweenkqubo ze-TSMC’s 3nm yenkqubo yokuveliswa kweetshipsi zayo. Ngokwamajelo eendaba, i-TSMC’s 18Bferfer plant kulindeleke ukuba iqale imveliso kwikota yesibini ye-2022 kwaye imveliso ngobuninzi kulindeleke ukuba iqale phakathi ku-2022. Kuqikelelwa ukuba amandla emveliso aya kufikelela kwiziqwenga ezingama-4000 ngo-Meyi 2022 kunye ne-10000 iziqwenga ngenyanga ngexesha lokuveliswa kwemveliso

Kuxelwe ukuba i-Intel iza kusebenzisa i-TSMC 3nm kwiiprosesa zayo zesizukulwana esilandelayo kunye nemveliso yokubonisa. Saqala ukuva amarhe kwasekuqaleni kuka-2021 ukuba i-Intel inokuba ivelisa iichips zabathengi eziqhelekileyo zisebenzisa inkqubo ye-N3 ukuzama ukufezekisa inkqubo efanayo ne-AMD. Kwinyanga ephelileyo, seva enye imithombo yeendaba icaphula uyilo lwe-TSMC ezimbini ze-Intel zokuphumelela.
Kuxelwe ngoku ukuba i-TSB ye-18B Fab ayizukuvelisa zimbini kodwa ubuncinci iimveliso ezi-3nm. Kubandakanya uyilo lwesithathu kumhlaba weseva kunye noyilo olunye kumhlaba wokubonisa. Asiqinisekanga ukuba zeziphi ezi mveliso, kodwa i-Intel ibeke indawo yayo elandelayo ye-granite rapids Xeon CPU njenge “Intel 4” (eyayisakuba yi-7Nm). Iichips ezizayo ze-Intel ziya kwamkela uyilo loyilo lwethayile, zixube kwaye zihambelane neetshipsi ezahlukeneyo, kwaye zinxibelelane nazo ngetekhnoloji yeververos / emib.
Ezinye iichips ezisicaba zinokuveliswa kwi-TSMC, ngelixa ezinye ziya kuveliswa kumzi-mveliso wokugcina ukutya we-Intel. I-chip ye-Intel yeflegi, iPonte Vecchio GPU ye “Intel 4”, iyimveliso ebonisa kakuhle uyilo lweetayile ezininzi. Uyilo luneechips ezincinci ezininzi kwiinkqubo ezahlukeneyo eziveliswa ziifektri ezahlukileyo. I-Intel’s 2023 meteor Lake CPU kulindeleke ukuba yamkele ubumbeko olufanayo lwethayile, kwaye ikhomputha yethayile ine-tapeout kwinkqubo ye “Intel 4”. Kuyenzeka ukuba uxhomekeke kwi-Fab ye-O / O yangaphandle kwaye ubonise iichips.
I-Intel iginye i-3nm yonke amandla e-TSMC, enokuthi ibeke uxinzelelo kubakhuphiswano bayo, ngakumbi i-AMD kunye neapile. Ngenxa yenkqubo yokuthintela i-TSMC, i-AMD, exhomekeke ngokupheleleyo kwi-TSMC ukuvelisa i-7Nm yayo yamva nje, ijongene neengxaki ezinzulu zokubonelela. Oku kunokuba sisicwangciso se-Intel sokuthintela ukuphuculwa kwenkqubo ye-amd ngokubeka phambili iichips zayo ngaphezulu kweTSMC, nangona isabonakala. Kwabo bayiphosayo, i-chipzilla iqinisekisile ukuba iya kukhupha iichips zayo kwezinye iifektri ezirhuqwayo ukuba kukho imfuneko, ke akukho ngcinga malunga noku.