Ishicilelwe ibhodi yesekethe (PCB) is the support of circuit components and components in electronic products. It provides the electrical connection between circuit components and components. It is the most basic component of various electronic equipment, and its performance is directly related to the quality of electronic equipment. Ngophuhliso loluntu lolwazi, zonke iintlobo zeemveliso ze-elektroniki zihlala zisebenza kunye, kwaye ukuphazamiseka phakathi kwazo kuya kusiba mandundu ngakumbi. Ke ngoko, ukuhambelana kombane kuba sisitshixo ekusebenzeni kwesiqhelo kwenkqubo ye-elektroniki. Ngokufanayo, nophuhliso lwetekhnoloji yombane, uxinano lwe-PCB iya isiya inyuka. Umgangatho kuyilo PCB kunempembelelo enkulu uphazamiseko kunye anti-uphazamiso ukukwazi wesekethe. Ukongeza kukhetho lwezinto kunye noyilo lwesekethe, intambo ye-PCB elungileyo ikwayinto ebaluleke kakhulu kukuhambelana kwe-electromagnetic yokusebenza ngokukuko kweesekethe zombane.

Since the PCB is an inherent component of the system, enhancing electromagnetic compatibility in the PCB wiring does not incur additional costs to the final product completion. Nangona kunjalo, kuyilo lwebhodi yesekethe eprintiweyo, abayili bemveliso bahlala benikela ingqalelo ekuphuculeni uxinano, ukunciphisa indawo yokuhlala, imveliso elula, okanye ukufuna ubume obuhle, obufanayo, ukungahoyi ifuthe lobume besekethe kungqinelwano lwe-electromagnetic, ukuze indawo enkulu Inani leempawu zemitha esithubeni yokwenza uxinzelelo. Intambo ye-PCB ehlwempuzekileyo inokubangela iingxaki ezingaphezulu kwe-emc kunokuba inokuphelisa. Kwiimeko ezininzi, nokongeza izihluzi kunye nezinto azizisombululi ezi ngxaki. Ekugqibeleni, ibhodi yonke kuye kwafuneka iphinde iphinde iphinde iphinde iphinde iphinde iphinde yenziwe. Ke ngoko, ukuphuhlisa imikhwa ye-wiring ye-PCB yeyona ndlela ineendleko zokuqala.

Inye into ekufuneka uyiqaphele kukuba akukho mithetho ingqongqo ye-wiring ye-PCB kwaye akukho mithetho ikhethekileyo egubungela zonke iintambo ze-PCB. Uninzi lweentambo ze-PCB zilinganiselwe ngokobungakanani bebhodi yesekethe kunye nenani lezinto eziboshwe ngobhedu. Ezinye iindlela zokwenza iintambo ezinokusetyenziswa kwisekethe enye kodwa hayi kwenye zixhomekeke kumava enjineli. Kukho, nangona kunjalo, eminye imigaqo ngokubanzi, eza kuxoxwa ngezantsi.

Kumgangatho woyilo olungileyo. I-PCB enexabiso eliphantsi kufuneka ilandele le migaqo ngokubanzi:

2. Ubeko lwezinto kwiPCB

Okokuqala, kufuneka kuthathelwe ingqalelo ubungakanani bePCB kukhulu kakhulu. Xa ubungakanani bePCB bukhulu kakhulu, umgca oprintiweyo mde, ukunyuka kokunyusa, amandla okulwa nengxolo ayancipha, kwaye iindleko ziyanda. Incinci kakhulu, ukusasazeka kobushushu akulunganga, kwaye imigca ekufutshane inokuthi iphazamiseke. Emva kokumisela ubungakanani bePCB. Emva koko khangela izinto ezikhethekileyo. Okokugqibela, ngokwiyunithi esebenzayo yesekethe, onke amacandelo esekethe abekiwe.

A digital circuit in an electronic device. Isekethe ye-Analog kunye neesekethe zamandla ezobume beempawu kunye neempawu zentambo zahlukile, zivelisa uphazamiseko kunye neendlela zokucinezela zokuphazamisa zahlukile. Also high frequency. Ngenxa yokuhamba rhoqo, uphazamiseko lwesekethe esezantsi kunye nendlela yokucinezela ukuphazamiseka yahlukile. Ke kulwakhiwo lwecandelo, isekethe yedijithali kufuneka ibenjalo. The analog circuit and the power supply circuit are placed separately to separate the high frequency circuit from the low frequency circuit. Ukuba kukho iimeko, kufuneka zibekelwe bucala okanye zenziwe ibhodi yesekethe ngokwahlukeneyo. Ukongeza, uyilo kufuneka luhlawule ngokukodwa ukuqiniswa. Weak signal device distribution and signal transmission direction.

In printed board layout high speed. Isantya esiphakathi kunye nesantya esiphantsi se-logic circuits, izinto kufuneka zicwangciswe ngendlela eboniswe kumzobo 1-1.

Njengakwezinye iisekethe ezinengqondo, izinto kufuneka zibekwe kufutshane kangangoko kunokwenzeka ukuze kufezekiswe isiphumo sokulwa nengxolo. The position of components on the PRINTED circuit board should take full account of emi. Omnye wemigaqo kukugcina isikhokelo phakathi kwezinto zifutshane kangangoko. Ngokwendlela ebekiweyo, icandelo lesiginali ye-analog, isantya esiphezulu senxalenye yesekethe yedijithali, kunye nenxalenye yomthombo wengxolo (njengokuhambisa, ukutshintshela okuphezulu ngoku, njl. -②.

Clock generator. Crystal oscillator and CPU clock input are prone to noise, to be closer to each other. Noisy devices. Isiphaluka esisezantsi ngoku. Imijikelezo emikhulu yangoku kufuneka igcinwe ikude kude neesekethe ezinengqondo. Kubalulekile ukwenza ibhodi yesekethe eyahlukileyo ukuba kunokwenzeka.

2.1 The following principles shall be observed when determining the location of special components: (1) Shorten the connection between high-frequency components as far as possible, and try to reduce their distribution parameters and electromagnetic interference between each other. Izinto eziphazanyiswa ngokulula akufuneki zisondele kakhulu komnye komnye, kwaye igalelo kunye nezinto ezikhutshwayo kufuneka zibe kude kangangoko kunokwenzeka.

(2) Kunokubakho umahluko omkhulu phakathi kwezinto ezithile okanye iingcingo, ke umgama phakathi kwazo kufuneka unyuswe ukunqanda ngengozi isekethe emfutshane ebangelwe kukukhutshwa. Izinto ezinamandla ombane aphezulu kufuneka zibekwe kwiindawo ezinokuthi zingafikeleleki lula ngesandla ngexesha lokulungisa.

(3) Izinto ezinobunzima obungaphezulu kwe-15g. Kuya kufuneka idityaniswe kwaye idityaniswe. Ezi zinkulu kwaye zinzima. Izinto ezinexabiso eliphezulu le-calorific akufuneki zifakwe kwibhodi eprintiweyo, kodwa kwi-chassis yomatshini uphela, kwaye ingxaki yokuchithwa kobushushu kufuneka ithathelwe ingqalelo. Izinto ze-Thermal kufuneka zigcinwe kude nezinto zokufudumeza.

(4) ye potentiometer. Coil inductor Adjustable. Isiguquli esiguqukayo. Ubeko lwezinto ezinokuhlengahlengiswa ezinje ngemicroswitch kufuneka ziqwalasele iimfuno zokwakheka komatshini uphela. Ukuba uhlengahlengiso kumatshini, kufuneka lubekwe kwibhodi eprintiweyo ngasentla ngokulula ukulungisa indawo; Ukuba umatshini uhlengahlengisiwe ngaphandle, isikhundla saso kufuneka silungelelaniswe nendawo yeqhina lokulungisa kwiphaneli yesisu.

(5) Indawo ekuhlalwa kuyo ngumngxuma wokubekwa kunye nokulungiswa kwebrakethi yebhodi eprintiweyo kufuneka kubekelwe bucala.

2.2 Ubeko lwawo onke amacandelo esekethe ngokwezixhobo zokusebenza zesekethe ziya kuthobela le migaqo ilandelayo:

(1) Hlela indawo nganye yokusebenza kwesekethe ngokuhambelana nenkqubo yesekethe, ukuze ubeko lulungele ukuhamba kwesiginali kwaye isiginali igcina icala elifanayo kangangoko kunokwenzeka.

(2) Kwizinto ezingundoqo zesekethe nganye esebenzayo njengeziko, lijikeleze ukwenza ubeko. Izixhobo kufuneka zifane. Icocekile. Ukucwangciswa okubumbeneyo kwi-PCB ukunciphisa kunye nokunciphisa isikhokelo kunye nokunxibelelana phakathi kwezinto. (3) Kwiisekethe ezisebenza kumaza aphakamileyo, iiparameter ezisasazwayo phakathi kwezinto kufuneka ziqwalaselwe. Kwiisekethe ngokubanzi, izinto kufuneka zicwangciswe ngokuhambelana kangangoko kunokwenzeka. Ngale ndlela, ayisiyontle kuphela, kwaye kulula ukuyifaka i-welding, ekulula ukuyenza kwimveliso yobunzima.

(4) Izinto ezifumaneka kumda webhodi yesekethe, ngokubanzi ingekho ngaphantsi kwe-2mm ukusuka kumda webhodi yesekethe. Eyona milo ilungileyo yebhodi yesekethe luxande. Ubude kububanzi bomyinge 3: 2 okanye 4: 3. Ubungakanani bebhodi yesekethe bukhulu kune-200x150mm. Ukuqwalaselwa kufuneka kunikwe amandla oomatshini bebhodi yesekethe.

2.3 Iimfuno zobeko ngokubanzi zamacandelo e-PCB:

Izinto zesekethe kunye neendlela zomqondiso kufuneka zibekiwe ukunciphisa ukudityaniswa kweempawu ezingafunekiyo:

(1) Ijelo lesiginali se-elektroniki elisezantsi akufuneki likufutshane nejelo lomqondiso wenqanaba eliphezulu kunye nelayini yamandla ngaphandle kokucoca, kubandakanya isekethe enokuvelisa inkqubo edlulayo.

(2) Yahlula amanqanaba asezantsi kwinqanaba le-analog kwisekethe yedijithali ukunqanda isekethe ye-analog. Isekethe yedijithali kunye nelogo eqhelekileyo yonikezelo lwamandla zivelisa ukuhlangana kwe-impedance eqhelekileyo.

(3) phezulu. Kwi. Isantya esiphantsi seengcinga zokujikeleza sisebenzisa iindawo ezahlukeneyo kwiPCB.

(4) Ubude bomgca wesiginali kufuneka bucuthwe xa kulungelelaniswa isekethe

(5) Qinisekisa phakathi kwamacwecwe akufuphi. Phakathi kweendlela ezikufutshane zebhodi enye. Musa ukuba neentambo zesiginali ngokude ngokugqithileyo phakathi kweentambo ezikufutshane kwindawo enye.

(6) Isixhobo sokungenelela se-Electromagnetic (EMI) kufuneka sikufutshane nomthombo we-EMI kwaye sibekwe kwibhodi enye yesekethe.

(7) Isiguquli seDC / DC. Izinto zokutshintsha kunye nezilungisi kufuneka zibekwe kufutshane nesiguquli kangangoko ukunciphisa ubude beengcingo zazo

(8) Beka i-elementi elawula umbane kunye ne-filter capacitor ngokusondeleyo kwi-diode yokulungisa.

(9) Ibhodi eprintiweyo yahlulwe ngokuhamba rhoqo kunye neempawu zokutshintsha zangoku, kwaye into yengxolo kunye nento engekho yengxolo kufuneka ibe kude.

(10) Iintambo zombane ezibuthathaka kwingxolo akufuneki zihambelane nomtya okhoyo okhoyo ngoku, okhawulezayo okhawulezayo.