Ngokuya ngobuchwepheshe besimanje, umhlaba ukhula ngesivinini esikhulu, futhi ithonya lawo lingavela kalula empilweni yethu yansuku zonke. Indlela esiphila ngayo ishintshe kakhulu futhi le ntuthuko yezobuchwepheshe iholele kumadivayisi amaningi athuthukile ebesingacabangi ngawo eminyakeni eyishumi edlule. Ingqikithi yalawa madivayisi ingubunjiniyela kagesi, nengqikithi ibhodi yesifunda ephrintiwe (I-PCB).

I-PCB imvamisa iluhlaza okotshani futhi ingumzimba oqinile onezinto ezahlukahlukene ezisebenza ngogesi kuyo. Lezi zingxenye zifakwa ku-PCB ngenqubo ebizwa ngokuthi “inhlangano ye-PCB” noma i-PCBA. I-PCB iqukethe i-substrate eyenziwe nge-fiberglass, izingqimba zethusi ezakha umkhondo, izimbobo ezakha ingxenye, nezendlalelo ezingaba ngaphakathi nangaphandle. E-RayPCB, singahlinzeka kuze kube yizendlalelo ezifika ku-1-36 zama-PROTOTYPES anezendlalelo eziningi kanye nezendlalelo ze-1-10 zamaqoqo amaningi we-PCB wokukhiqizwa kwevolumu. Kuma-PCBS anezinhlangothi ezimbili futhi emaceleni amabili, ungqimba lwangaphandle lukhona kepha alukho ungqimba lwangaphakathi.

The substrate and components are insulated with solder film and held together with epoxy resin.Imaski yokushisela ingaba luhlaza okotshani, okuluhlaza okwesibhakabhaka noma okubomvu, njengoba kujwayelekile kwimibala ye-PCB. Imaski yokushisela izovumela isakhi ukuthi sigweme ukujikeleza okufishane kuthrekhi noma ezinye izinto.

Iminonjana yethusi isetshenziselwa ukudlulisa amasiginali we-elekthronikhi ukusuka kwelinye iphuzu kuya kwelinye kwi-PCB. Lezi zimpawu zingaba yizimpawu ezisheshayo zedijithali noma amasiginali we-analog ahlukile. Lezi zintambo zingenziwa zibe namandla ukuze zinikeze amandla / amandla okuphakelwa kwamandla kagesi.

In most PCBS that provide high voltage or current, there is a separate grounding plane. Izingxenye ezisezingeni eliphezulu zixhunywe endizeni yangaphakathi ye-GND noma ungqimba wesiginali wangaphakathi nge- “Vias”.

Izingxenye zihlanganisiwe ku-PCB ukunika amandla i-PCB ukuthi isebenze njengoba yakhelwe. Into ebaluleke kakhulu ukusebenza kwe-PCB. Noma ama-resistor amancane we-SMT engabekwanga kahle, noma noma amathrekhi amancane enqunyiwe kwi-PCB, i-PCB kungenzeka ingasebenzi. Therefore, it is important to assemble components in a proper way. I-PCB lapho kuhlanganiswa izingxenye kubizwa nge-PCBA noma i-PCB yomhlangano.

Ngokuya ngemininingwane echazwe yikhasimende noma umsebenzisi, umsebenzi we-PCB ungahle ube yinkimbinkimbi noma ube lula. Usayizi we-PCB nawo uyahluka ngokuya ngezidingo.

The PCB assembly process has both automatic and manual processes, which we will discuss.

Isendlalelo se-PCB nokuklanywa

Njengoba kushiwo ngenhla, kunezingqimba zesiginali eziningi phakathi kwezendlalelo ezingaphandle. Manje sizoxoxa ngezinhlobo zezendlalelo zangaphandle nemisebenzi.

Qonda inqubo yenhlangano yebhodi le-PCB futhi uzwe ubuhle obuluhlaza be-PCBD

1 – Substrate: Leli yipuleti eliqinile elenziwe ngezinto ze-FR-4 lapho izingxenye “zigcwaliswa” noma zishiselwe. Lokhu kunikeza ukuqina kwe-PCB.

Isendlalelo se-2- yethusi: Ucwecwe lwethusi oluncane lusetshenziswa phezulu nangaphansi kwe-PCB ukwenza umkhondo wethusi ophezulu naphansi.

3- imaski yokushisela: Isetshenziswa ezingqimbeni eziphezulu nezingezansi ze-PCB. This is used to create non-conducting areas of the PCB and insulate the copper traces from each other to protect against short circuits. Isifonyo sokushisela siphinde sigweme ukuwelda izingxenye ezingafuneki futhi siqinisekise ukuthi i-solder ingena endaweni yokushisela, njengemigodi namapads. Lezi zimbobo zixhuma ingxenye ye-THT ne-PCB ngenkathi i-PAD isetshenziselwa ukubamba ingxenye ye-SMT.

4- Isikrini: Amalebula amhlophe esiwabona ku-PCBS ngamakhodi wezinto, njenge-R1, C1 noma enye incazelo kuma-PCBS noma ama-logo enkampani, wonke enziwe ngezendlalelo zesikrini. Isendlalelo sesikrini sinikeza imininingwane ebalulekile nge-PCB.

Kunezinhlobo ezi-3 ze-PCBS ngokuya ngezigaba ze-substrate

1- Rigid PCB:

Ama-PCB iningi lamadivayisi e-PCB esiwabona ezinhlotsheni ezahlukahlukene zama-PCB. Lawa angama-PCBS aqinile, aqinile futhi aqinile, anobukhulu obuhlukile. Izinto ezisemqoka yi-fiberglass noma i- “FR4” elula. I-FR4 imele i- “flame retarder-4”. Izici zokuzicisha ze-FR-4 zikwenza kube lusizo ekusetshenzisweni kwamadivayisi kagesi amaningi asebenza kanzima. I-FR-4 inezingqimba ezincanyana ze-foil foil ezinhlangothini zombili, ezaziwa nangokuthi i-laminates egqoke ithusi. I-Fr-4 laminates egqoke ithusi isetshenziswa kakhulu kuma-amplifiers kagesi, ekushintsheni izinto zamandla emodi, abashayeli bezimoto ze-servo, njll. Ngakolunye uhlangothi, enye i-PCB substrate eqinile evame ukusetshenziselwa izinto zasendlini nemikhiqizo ye-IT ibizwa nge-PCB phenolic PCB. Ziyakhanya, ukuminyana okuphansi, zishibhile futhi kulula ukuzibhakela. Izibali, amakhibhodi namagundane ngezinye zezinto ezisetshenziswayo.

I-2- I-PCB eguqukayo:

Yenziwe ngezinto ezisezingeni eliphansi njengeKapton, i-PCBS eguquguqukayo ingamelana namazinga okushisa aphakeme kakhulu ngenkathi ubukhulu bayo bungamasentimitha angu-0.005. Ingagobeka kalula futhi isetshenziswe kuzixhumi ze-elektroniki ezigqokekayo, ama-LCD monitors noma ama-laptops, amakhibhodi namakhamera, njll.

3-metal core PCB:

Ngaphezu kwalokho, enye i-PCB substrate ingasetshenziswa njenge-aluminium, esebenza kahle kakhulu ekupholiseni.Lezi zinhlobo ze-PCBS zingasetshenziselwa izinhlelo zokusebenza ezidinga izinto ezishisayo njengama-leds aphezulu wamandla, ama-laser diode, njll.

Installation technology type:

I-SMT: I-SMT imele “ubuchwepheshe be-surface mount”. Izingxenye ze-SMT zincane kakhulu ngosayizi futhi ziza ngamaphakeji ahlukahlukene anjenge-0402,0603 1608 yama-resistors nama-capacitors. Ngokufanayo, kuma-ics wesekethe ahlanganisiwe, sine-SOIC, TSSOP, QFP ne-BGA.

Umhlangano weSMT unzima kakhulu ezandleni zomuntu futhi ungaba inqubo yokucubungula isikhathi, ngakho-ke wenziwa ngokuyinhloko ngamarobhothi okuzenzela nawokubekwa.

I-THT: I-THT imele ubuchwepheshe bembobo. Izinto ezinemikhondo nezintambo, ezinjenge-resistors, ama-capacitors, ama-inductors, ama-PDIP ics, ama-transformer, ama-transistors, i-IGBT, i-MOSFET, njll.

Izingxenye kufanele zifakwe ohlangothini olulodwa lwe-PCB entweni eyodwa bese zidonswa ngumlenze ngakolunye uhlangothi, usike umlenze futhi ushiselwe. Umhlangano we-THT uvame ukwenziwa ngokushisela ngesandla futhi kulula.

Izimfuneko zenqubo yomhlangano:

Ngaphambi kwangempela kokuqamba kwe-PCB nenqubo yokuhlangana kwe-PCB, umenzi uhlola i-PCB ukuthola noma ikuphi ukukhubazeka noma amaphutha ku-PCB angadala ukwehluleka. Le nqubo ibizwa ngokuthi inqubo ye-Manufacturing design (DFM). Abakhiqizi kumele benze lezi zinyathelo eziyisisekelo ze-DFM ukuqinisekisa i-PCB engenaphutha.

Ukucatshangelwa kwesakhiwo se-Component: Izimbobo ezingena phakathi kufanele zihlolwe ngezinto ezinobumbano. Like electrolytic capacitors must be checked polarity, diode anode and cathode polarity check, SMT tantalum capacitor polarity check. Isiqondisi se-IC notch / ikhanda kufanele sihlolwe.

Into edinga usinki wokushisa kufanele ibe nesikhala esanele sokwamukela ezinye izakhi ukuze usinki wokushisa ungathinti.

Isikhala esingu-2-Hole nesikhala:

Isikhala phakathi kwezimbobo naphakathi kwemigodi nemikhondo kufanele sihlolwe. Pad futhi ngokusebenzisa imbobo ngeke ukugqagqana.

I-3- I-Brazing pad, ubukhulu, ububanzi bomugqa kuzobhekwa.

Ngokwenza ukuhlolwa kwe-DFM, abakhiqizi banganciphisa kalula izindleko zokukhiqiza ngokunciphisa inani lamaphaneli wezinto ezilahliwe. Lokhu kuzosiza ekuqondiseni okusheshayo ngokugwema ukwehluleka kwezinga le-DFM. At RayPCB, we provide DFM and DFT inspection in circuit assembly and prototyping. KwaRayPCB, sisebenzisa imishini ye-OEM yobuchwepheshe ukuhlinzeka ngezinsizakalo ze-PCB OEM, ukugoqa amagagasi, ukuhlolwa kwekhadi le-PCB nomhlangano weSMT.

Inqubo yesinyathelo ngesinyathelo yenqubo ye-PCB Assembly (PCBA):

Isinyathelo 1: Sebenzisa ukunamathisela kwe-solder usebenzisa ithempulethi

First, we apply solder paste to the area of the PCB that fits the component. This is done by applying solder paste to the stainless steel template. Isifanekiso ne-PCB kubanjwa ndawonye ngomshini wokulungisa, futhi okunamathiselwe kwe-solder kusetshenziswa ngokulinganayo kukho konke ukuvuleka ebhodini ngokusebenzisa okufaka isicelo. Faka isicelo se-solder ngokulinganayo nesicelo. Ngakho-ke, unamathisela i-solder efanele kufanele isetshenziswe kofaka isicelo. Lapho umfakisicelo esusiwe, ukunamathisela kuzohlala endaweni oyifunayo ye-PCB. Okunamathiselwe okumpunga okunamathiselwe okungu-96.5% okwenziwe ngothini, okuqukethe u-3% wesiliva no-0.5% wethusi, kuholele mahhala. Ngemuva kokushisa ku-Isinyathelo 3, i-solder paste izoncibilika futhi yakhe isibopho esiqinile.

Isinyathelo 2: Ukubekwa okuzenzakalelayo kwezinto:

Isinyathelo sesibili se-PCBA ukubeka ngokuzenzakalela izingxenye ze-SMT ku-PCB. Lokhu kwenziwa ngokusebenzisa i-pick and place robot. Ezingeni lokuklama, umklami udala ifayela futhi alinikeze irobhothi elizenzakalelayo. Leli fayela linezixhumanisi ezenziwe ngaphambilini ze-X, Y zento ngayinye esetshenziswe ku-PCB futhi likhomba indawo yazo zonke izingxenye. Ngokusebenzisa lolu lwazi, irobhothi lidinga kuphela ukubeka kahle i-SMD ebhodini. Irobhothi lokukhetha nokubeka lizothatha izinto ezisuka kufenisha yalo bese lizibeka ngokunembile kunamathisela i-solder.

Ngaphambi kokufika kwemishini yokuthwebula eyirobhothi neyokubekwa, ochwepheshe babekhetha izinto besebenzisa udlawana bazibeke kwi-PCB ngokubhekisisa indawo futhi bagweme noma ikuphi ukuxhawulana. This results in high levels of fatigue and poor vision for technicians, and leads to a slow PCB assembly process for SMT parts. Ngakho-ke amandla wephutha aphezulu.

Njengoba ubuchwepheshe bukhula, amarobhothi azenzekelayo athatha futhi abeke izingxenye anciphisa umthwalo wochwepheshe, okuvumela ukufakwa kwezinto ngokushesha nangokunembile. Lawa marobhothi angasebenza u-24/7 ngaphandle kokukhathala.

Isinyathelo 3: Ukugeleza kwe-Reflow

Isinyathelo sesithathu ngemuva kokusetha izakhi nokufaka okunamathiselwe kwe-solder yi-reflux welding. Ukugeleza kwe-Reflow kuyinqubo yokubeka i-PCB kwibhande lokuhambisa elinezinto ezithile. The conveyor then moves the PCB and components into a large oven, which produces a temperature of 250 o C. Izinga lokushisa lanele ukuncibilikisa i-solder. I-solder encibilikile bese ibamba ingxenye ku-PCB bese iyakha ijoyini. Ngemuva kokwelashwa kokushisa okuphezulu, i-PCB ingena epholile. Lawa makhaza aqinisa amalunga we-solder ngendlela elawulwayo. Lokhu kuzokwenza ukuxhumana okuhlala njalo phakathi kwengxenye ye-SMT ne-PCB. Endabeni ye-PCB emaceleni amabili, njengoba kuchaziwe ngenhla, uhlangothi lwe-PCB olunezinto ezimbalwa noma ezincane luzophathwa kuqala kusuka ezinyathelweni 1 kuye ku-3, bese kolunye uhlangothi.

Qonda inqubo yenhlangano yebhodi le-PCB futhi uzwe ubuhle obuluhlaza be-PCBD

Isinyathelo 4: Ukuhlolwa kwekhwalithi nokuhlolwa

Ngemuva kokufaka kabusha i-soldering, kungenzeka ukuthi izingxenye zenziwe kabi ngenxa yokunyakaza okuthile okungalungile kuthileyi le-PCB, okungaholela ekuxhumaneni kwesifunda okufushane noma okuvulekile. These defects need to be identified, and this identification process is called inspection. Ukuhlolwa kungaba ngesandla futhi kuzenzakalelayo.

A. Isheke elenziwa ngesandla:

Because the PCB has small SMT components, visual inspection of the board for any misalignment or malfunction can cause technician fatigue and eye strain. Ngakho-ke, le ndlela ayinakwenzeka ngamabhodi we-SMT asengaphambili ngenxa yemiphumela engalungile. Kodwa-ke, le ndlela inokwenzeka ngamacwecwe anezinto ze-THT nobukhulu bezinto eziphansi.

B. Ukuthola okubonakalayo:

Le ndlela iyenzeka ngobuningi be-PCBS. Le ndlela isebenzisa imishini ezenzakalelayo enamandla amakhulu namakhamera wokulungiswa okuphezulu afakwe ezinhlangothini ezahlukahlukene ukubuka amalunga we-solder kuzo zonke izinkomba. Ngokuya ngekhwalithi yokuhlanganiswa kwe-solder, ukukhanya kuzokhombisa ukuhlangana kwe-solder ngezindlela ezihlukile. Lo mshini wokuhlola othomathikhi (i-AOI) uyashesha kakhulu futhi ungacubungula inani elikhulu le-PCBS ngesikhathi esifushane kakhulu.

Ukuhlolwa kwe-CX-ray:

Umshini we-X-ray uvumela ochwepheshe ukuthi baskene i-PCB ukuze babone ukukhubazeka kwangaphakathi. Le akuyona indlela ejwayelekile yokuhlola futhi isetshenziselwa kuphela ama-PCBS ayinkimbinkimbi futhi athuthukile. Uma ingasetshenziswanga kahle, lezi zindlela zokuhlola zingaholela ekusetshenzisweni kabusha noma ekuphelelwe isikhathi kwe-PCB. Ukuhlolwa kudinga ukwenziwa njalo ukugwema ukubambezeleka, izindleko zabasebenzi nezinto ezibonakalayo.

Isinyathelo 5: Ukulungiswa kwengxenye ye-THT nokushisela

Izingxenye ezihamba ngembobo zivamile kumabhodi amaningi e-PCB. These components are also called plated through holes (PTH). Ukuhola kwalezi zingxenye kuzodlula emigodini ye-PCB. Lezi zimbobo zixhunywe kwezinye izimbobo nangemigodi ngemikhondo yethusi. Lapho lezi zinto ze-THT zifakwa futhi zifakwa kule mibobo, zixhunywe ngogesi kwezinye izimbobo ku-PCB efanayo nesekethe elenzelwe. Lawa ma-PCBS angaqukatha ezinye izingxenye ze-THT kanye nezakhi eziningi ze-SMD, ngakho-ke indlela yokushisela echazwe ngenhla ayizifanele izingxenye ze-THT uma kwenzeka kunezingxenye ze-SMT njengokufakwa kabusha kwe-welding. Ngakho-ke izinhlobo ezimbili eziyinhloko zezingxenye ze-THT ezihlanganisiwe noma ezihlanganisiwe

A. Welding Manual:

Izindlela zokushisela ngesandla zivamile futhi zivame ukudinga isikhathi esithe xaxa kunokusetha okuzenzakalelayo kwe-SMT. Uchwepheshe ujwayele ukunikezwa ukufaka into eyodwa ngasikhathi bese edlulisela ibhodi kwabanye ochwepheshe abafaka enye into ebhodini elifanayo. Ngakho-ke, ibhodi lesifunda lizohanjiswa lizungeze umugqa womhlangano ukuthola ingxenye ye-PTH ukuthi igcwalise kulo. Lokhu kwenza inqubo ibe yinde, futhi izinkampani eziningi zokuklama ze-PCB nezokukhiqiza zigweme ukusebenzisa izinto ze-PTH kumiklamo yazo yesekethe. Kepha ingxenye ye-PTH ihlala iyinto eyintandokazi futhi esetshenziswa kakhulu iningi labakhi besifunda.

B. I-Wave soldering:

Uhlobo oluzenzakalelayo lokushisela okwenziwa ngesandla yi-wave welding. Ngale ndlela, uma isakhi se-PTH sesibekiwe ku-PCB, i-PCB ibekwa ebhande lokuhambisa bese ihanjiswa kuhhavini elizinikele. Lapha, amagagasi e-solder ancibilikile afafaza ku-substrate ye-PCB lapho okuholayo kwengxenye kukhona. Lokhu kuzoshisela zonke izikhonkwane ngokushesha. Kodwa-ke, le ndlela isebenza nge-PCBS emaceleni kuphela hhayi nge-PCBS emaceleni amabili, njengoba i-solder encibilikile kolunye uhlangothi lwe-PCB ingalimaza izingxenye kolunye. Emva kwalokhu, hambisa i-PCB ukuze ihlolwe okokugcina.

Isinyathelo 6: Ukuhlolwa kokugcina nokuhlolwa kokusebenza

I-PCB manje isilungele ukuhlolwa nokuhlolwa. This is a functional test in which electrical signals and power are given to the PCB at the specified pins and the output is checked at the specified test point or output connector. Lokhu kuhlolwa kudinga izinsimbi ezivamile zaselebhu ezifana nama-oscilloscopes, ama-multimeter edijithali, nama-generator okusebenza

Lokhu kuhlolwa kusetshenziselwa ukuhlola izici ezisebenzayo nezikagesi ze-PCB futhi kuqinisekiswe amandla wamanje, amandla kagesi, i-analog nesiginali yedijithali nokwakhiwa kwesifunda okuchazwe kuzidingo ze-PCB

Uma noma yimiphi imingcele ye-PCB ibonisa imiphumela engamukeleki, i-PCB izolahlwa noma isulwe ngokuya ngezinqubo ezijwayelekile zenkampani. Isigaba sokuhlola sibalulekile ngoba sinquma impumelelo noma ukwehluleka kwayo yonke inqubo ye-PCBA.

Isinyathelo 7: Ukuhlanza kokugcina, ukuqeda nokuthumela:

Manje njengoba i-PCB ihlolwe kuzo zonke izici futhi yamenyezelwa njengejwayelekile, sekuyisikhathi sokuhlanza ukugeleza okungafuneki okusalayo, ukungcola komunwe kanye namafutha. Amathuluzi wokuhlanza umfutho ophakeme ngensimbi engagqwali esebenzisa amanzi ahlanzekile anele ukuhlanza zonke izinhlobo zokungcola. Amanzi akhiqizwayo awalimazi isekethe le-PCB. Ngemuva kokuwasha, yomisa i-PCB ngomoya ocindezelweyo. I-PCB yokugcina manje isilungele ukupakishwa nokuthunyelwa.