A cikin zane na PCB, abokai da yawa ba su da isasshen sani game da yadudduka a cikin PCB, musamman ma masu fara’a, rawar kowane ɗigon ba ta da tabbas. A wannan karon, bari mu kalli allon zane na AlTIumDesigner, menene bambance -bambancen kowane Layer.

1. Layer sigina

An raba layin siginar zuwa TopLayer (TopLayer) da BottomLayer (BottomLayer), waɗanda ke da haɗin lantarki kuma suna iya sanya abubuwan haɗin gwiwa da igiyoyi.

2. Layer na inji

Mechanical shine ma’anar bayyanar dukkan allon PCB. Mahimmancin “Mechanical” na nufin cewa ba shi da kaddarorin lantarki, don haka ana iya amfani da shi cikin aminci don zana siffofi, zana girman Injin, sanya rubutu, da sauransu, ba tare da damuwa game da kowane canje -canje ga kaddarorin lantarki na hukumar ba. Ana iya zaɓar matsakaicin yadudduka na inji guda 16.

3. Layer bugu na allo

Ana amfani da Top Overlay da Bottom Overlay don ayyana haruffan ɗab’in allo na Sama da Ƙasa. Waɗannan su ne alamun rubutu da aka buga a saman Layer juriya na solder, kamar sunan ɓangaren, alamar kayan aiki, fil ɗin ɓangaren, da haƙƙin mallaka, don sauƙaƙe walda kewaye da bincika kuskure.

4. Layer manna kwano

Layer Manna mai haɗawa ya haɗa da Manyan Manyan Manna da Ƙasan Manna na Ƙasa, wanda ke nufin saman Manna kushin da za mu iya gani a waje, wato, ɓangaren da ke buƙatar a rufe shi da Allo mai ƙyalli kafin walda. Don haka wannan Layer ɗin ma yana da fa’ida a cikin matakin iska mai zafi na kushin da kuma yin raga na ƙarfe.

5. Welding juriya Layer

Hakanan ana kiran lakabin solder a matsayin “taga-fita,” gami da TopSolder da BottomSolder, waɗanda ke wasa sabanin rawar zuwa manna mai siyarwa kuma suna komawa zuwa Layer don rufe koren mai. Layer ɗin yana da siyarwa kyauta don hana ɗan gajeren zagaye na mai siyarwa mai yawa a wuraren haɗin gwiwa yayin walda. Layer juriya na mai siyarwa yana rufe waya fim ɗin tagulla kuma yana hana fim ɗin tagulla yin oksidzing da sauri a cikin iska, amma an keɓe matsayin a haɗin gwiwa kuma baya rufe haɗin gwiwa.

Rufin jan ƙarfe na al’ada ko wayoyi shine madaidaicin murfin koren mai, idan muka yi daidai a cikin jiyya mai siyarwa, zai hana koren mai ya rufe, zai fallasa jan ƙarfe.

6. Layer hakowa

Layer rawar soja ya ƙunshi DrillGride da DrillDrawing. Ana amfani da layin murƙushe don ba da bayani game da ramukan ramuka a cikin tsarin kera katako (kamar pads, waɗanda ke buƙatar ramuka ta cikin ramuka).

7, ya hana lasisin wayoyi ya hana layin wiring (KeepOutLayer) da aka yi amfani da shi don ayyana iyakar layin wayoyi, bayan ya bayyana matakin hana wayoyi, a cikin tsarin wayoyin nan gaba, tare da halayen wutar lantarki ba za su iya wuce iyakokin da aka hana hana wayoyin ba.

8. Multi-Layer

Fale-falen buraka da ramukan ratsawa a kan allon da’irar suna buƙatar shiga cikin dukkan da’ira da kafa haɗin lantarki tare da yadudduka masu hoto daban-daban, don haka tsarin musamman ya kafa madaidaiciyar madaidaiciya-ɗimbin yawa. Gabaɗaya, an saita pads da ramuka akan yadudduka da yawa, kuma idan an rufe wannan Layer, ba za a nuna gammaye da ramuka ba.