Ekuklanyeni kwe PCB, Abangani abaningi abazi ngokwanele mayelana nezendlalelo ze-PCB, ikakhulukazi i-novice, indima yesendlalelo ngasinye ayicaci. Ngalesi sikhathi, ake sibheke ibhodi yokudweba ye-AlTIumDesigner, yini umehluko wesendlalelo ngasinye.

1. Isendlalelo sesiginali

Isendlalelo sesiginali sihlukaniswe nge-TopLayer (i-TopLayer) ne-BottomLayer (i-BottomLayer), enokuxhumana ngogesi futhi okungabeka izingxenye nezintambo.

2. Ungqimba lwemishini

Imishini iyincazelo yokubonakala kwebhodi lonke le-PCB. Ukugcizelelwa kwe- “Mechanical” kusho ukuthi ayinazici zikagesi, ngakho-ke ingasetshenziswa ngokuphepha ukudweba ubujamo, ukudweba ubukhulu beMechanical, ukubeka umbhalo, njalonjalo, ngaphandle kokukhathazeka nganoma yiziphi izinguquko ezintweni zikagesi zebhodi. Kungakhethwa ubukhulu bezingqimba zomshini eziyi-16.

3. Isendlalelo sokuphrinta kwesikrini

Ukunqwabelanisa Okuphezulu Nembondela Engezansi kusetshenziselwa ukuchaza izinhlamvu zokuphrinta zesikrini eziphezulu nesezansi. Yizimpawu zombhalo eziphrintwe Phezulu koqweqwe lokumelana ne-solder, njengegama lengxenye, uphawu lwento, iphini lezinto, nelungelo lobunikazi, ukwenza lula ukuwelda isifunda nokuhlola amaphutha.

4. Tin ungqimba wokunamathisela

Isendlalelo se-solder Namathisela sifaka isendlalelo se-Paste ephezulu kanye nesendlalelo se-Bottom Namathisela, esibhekisela kuphedi yokunamathisela ebusweni esingayibona ngaphandle, okusho ukuthi, ingxenye edinga ukufakwa nge-solder Namathisela ngaphambi kokushisela. Ngakho-ke lolu ungqimba luyasiza futhi ekushiseni komoya okushisayo kwephedi nokwenza insimbi yensimbi.

5. Isendlalelo sokumelana nokushisela

Isendlalelo seSolder sibuye sivame ukubizwa ngokuthi “ukuphuma,” kufaka phakathi i-TopSolder ne-BottomSolder, edlala indima ehlukile kunamathisela i-solder futhi ibhekise kungqimba ukumboza uwoyela oluhlaza. Isendlalelo sine-solder mahhala ukuvimbela isifunda esifushane se-solder eseqile emajoyini aseduze ngesikhathi sokushisela. Isendlalelo sokumelana nesembozo sihlanganisa ucingo lwethusi lwefilimu futhi sivimbele ifilimu yethusi ekuhlanganiseni ngokushesha okukhulu emoyeni, kepha isikhundla sibekelwa eceleni kujoyini le-solder futhi asilimbozi ilunga le-solder.

Ukumbozwa kwethusi okujwayelekile noma ukuhlanganisa izintambo kungoyili ozenzakalelayo wekhava oluhlaza, uma nathi sisetshenziswa ekwelashweni kwesendlalelo se-solder, kuzovimbela uwoyela oluhlaza ukumboza, kuzodalula ithusi.

6. Isendlalelo sokubhola

Isendlalelo se-drill siqukethe i-DrillGride ne-DrillDrawing. Isendlalelo sokubhola sisetshenziselwa ukunikeza ulwazi mayelana nezimbobo zokubhola enqubeni yokukhiqiza ibhodi lesifunda (njengamaphayiphu, adinga ukubhobozwa ngezimbobo).

7, vimbela ungqimba lwezintambo vimbela ungqimba lwentambo (i-KeepOutLayer) olusetshenziselwe ukuchaza umngcele wesendlalelo sezintambo, ngemuva kokuchaza ungqimba lokwenqatshelwa kwentambo, kwinqubo yocingo yesikhathi esizayo, enezici zikagesi azikwazi ukweqa umngcele wesendlalelo sokuvimbela izintambo.

8. Isendlalelo esiningi

Amapayipi nezimbobo ezingena ebhodini lesifunda kudingeka zingene kulo lonke ibhodi lesifunda futhi zisungule ukuxhumana kagesi ngezendlalelo ezihlukile zemidwebo, ngakho-ke uhlelo ngokukhethekile lusetha ungqimba olungabonakali – olunezingqimba eziningi. Ngokuvamile, amaphedi nezimbobo kusethwe ezingqimbeni eziningi, futhi uma lolu ungqimba luvaliwe, amapayipi nezimbobo ngeke kuboniswe.