Kuyilo lwe PCB, Abahlobo abaninzi abazi ngokwaneleyo malunga nokuma kwi-PCB, ngakumbi i-novice, indima yoluhlu ngalunye ayicacanga. Ngeli xesha, makhe sijonge kwibhodi yokuzoba ye-AlTIumDesigner, yintoni umahluko kulwahlulo ngalunye.

1. Umaleko wophawu

Uluhlu lwesiginali luhlukaniswe kwi-TopLayer (i-TopLayer) kunye ne-BottomLayer (i-BottomLayer), enonxibelelwano lombane kwaye inokubeka izinto kunye neentambo.

2. Umaleko woomatshini

Oomatshini yinkcazo yenkangeleko yebhodi yonke yePCB. Ugxininiso kwi “Mechanical” luthetha ukuba alunazinto zombane, ke linokusetyenziselwa ngokukhuselekileyo ukuzoba iimilo, ukuzoba ubungakanani boMatshini, ukubeka isicatshulwa, njalo njalo, ngaphandle kokukhathazeka malunga naluphi na utshintsho kwiipropathi zombane zebhodi. Ubuninzi beendlela ezili-16 ezinokukhethwa.

3. Uluhlu lokuprinta kwescreen

Ukugqume ngaphezulu kunye nokuGqumeka ezantsi zisetyenziselwa ukucacisa abalinganiswa bokushicilela abaphezulu kunye nabasezantsi. Ziisimboli zombhalo eziprintwe kumphezulu wesingxobo sokumelana nesoder, njengegama lecandelo, isimboli yecandelo, ipini yecandelo, kunye nelungelo lokushicilela, ukulungiselela ukuwelda kwesekethe kunye nokujonga impazamo.

4. Uluhlu lwe-Tin unamathele

Uluhlu lwe-solder Cola luquka umaleko oPhezulu oPhezulu kunye noLuhlu lwePaseji esezantsi, ebhekisa kumgangatho wokuncamathisela umphezulu esinokuthi siwubone ngaphandle, oko kukuthi, indawo efuna ukugqunywa nge-solder Cola ngaphambi kwentsimbi. Ke olu luhlu lukwaluncedo ekulinganiseni komoya oshushu wephedi kunye nokwenza iwelding yentsimbi.

5. Umaleko wokumelana neWelding

Umaleko weSolder uhlala ubizwa ngokuba yi “Window-out”, kubandakanya iTopSolder kunye neBoutSolder, edlala indima eyahlukileyo kwi-solder paste kwaye ibhekise kumaleko wokugubungela ioyile eluhlaza. Uluhlu luthengisiwe simahla ukukhusela isekethe emfutshane ye-solder egqithisileyo kumalungu akufutshane ngexesha lokudibanisa. Umaleko wokumelana ne-solder ugubungela ucingo lwefilimu lobhedu kwaye uthintele ifilimu yobhedu kwi-oxidizing ngokukhawuleza okukhulu emoyeni, kodwa isikhundla sibekelwe ecaleni kwindibaniselwano ye-solder kwaye asiyigubungeli indibaniselwano ye-solder.

Ukutyabeka ubhedu okuqhelekileyo okanye iintambo kukugubungela i-oyile eluhlaza eluhlaza, ukuba ngokufanayo kunyango lwe-solder, luya kuthintela ioyile eluhlaza ukuyigubungela, iya kutyhila ubhedu.

6. Ukubumba umaleko

Uluhlu lwe drill luquka i-DrillGride kunye ne-DrillDrawing. Uluhlu lokombiwa lusetyenziselwa ukunika ulwazi malunga nemingxunya yokugrumba kwinkqubo yokuvelisa ibhodi yesekethe (ezinje ngeepads, ekufuneka zigqobhozwe ngemingxunya).

7, ukuthintela umaleko wiring ukuthintela umaleko wiring (i-KeepOutLayer) esetyenziselwa ukuchaza umda wesingxobo se-wiring, emva kokuchaza uthintelo lomaleko we-wiring, kwinkqubo ye-wiring yexesha elizayo, ngeempawu zombane azinakugqitha umda wothintelo lomaleko we-wiring.

8. Uluhlu oluninzi

Iipads kunye nemingxunya yokungena kwibhodi yesekethe kufuneka ingene kwibhodi yesekethe iphela kwaye iseke unxibelelwano lombane ngeendlela ezahlukeneyo zemizobo, ke le nkqubo imisela ngokukodwa umaleko ongaqondakaliyo. Ngokubanzi, iipads kunye nemingxunya isetiwe kumaleko amaninzi, kwaye ukuba olu luhlu luvaliwe, iipads kunye nemingxunya azizukuboniswa.