Kev ua tau zoo ntawm cov organic rigid PCB substrate feem ntau yog tsim los ntawm ob lub dielectric txheej (epoxy resin, iav fiber) thiab ib tug high-purity conductor (tooj liab ntawv ci). Peb ntsuam xyuas qhov tsis zoo ntawm cov ntawv luam tawm Circuit Board substrate zoo, feem ntau suav nrog iav hloov pauv kub Tg, thermal expansion coefficient CTE, thermal decomposition lub sij hawm thiab decomposition kub Td ntawm lub substrate, hluav taws xob khoom, PCB dej nqus, electromigration CAF, thiab lwm yam.

Feem ntau, cov ntaub ntawv substrate rau cov ntawv luam tawm tuaj yeem muab faib ua ob pawg: cov ntaub ntawv tsis sib xws thiab cov ntaub ntawv yooj yim substrate. Feem ntau, ntau yam tseem ceeb ntawm cov khoom siv tsis zoo yog tooj liab clad laminate.

Raws li PCB board reinforcement cov ntaub ntawv, nws yog feem ntau muab faib ua cov nram qab no hom:

1. Phenolic PCB ntawv substrate

Vim tias lub rooj tsavxwm PCB no yog tsim los ntawm cov ntawv sau, ntoo pulp, thiab lwm yam, qee zaum nws dhau los ua duab los qhia, V0 board, nplaim hluav taws kub thiab 94HB, thiab lwm yam. synthesized los ntawm phenolic resin siab. phaj.

Nta: Tsis fireproof, tuaj yeem xuas nrig ntaus, tus nqi qis, tus nqi qis, tsis tshua muaj txheeb ze.

2. Composite PCB substrate

Cov hmoov nplej no tseem hu ua hmoov board, nrog cov ntaub ntawv ntoo fiber ntau lossis paj rwb cov ntaub ntawv fiber ntau raws li cov khoom siv ntxiv, thiab cov ntaub iav fiber ntau raws li cov khoom siv saum npoo av tib lub sijhawm. Ob qho khoom siv yog ua los ntawm cov nplaim hluav taws-retardant epoxy resin.

Muaj ib sab ib nrab iav fiber ntau 22F, CEM-1 thiab ob-sided ib nrab iav fiber board CEM-3, ntawm cov uas CEM-1 thiab CEM-3 yog cov feem ntau composite puag tooj liab clad laminates.

3. iav fiber ntau PCB substrate

Qee lub sij hawm nws kuj dhau los ua epoxy board, iav fiber ntau pawg thawj coj saib, FR4, fiber ntau pawg thawj coj saib, thiab lwm yam. Nws siv epoxy resin li nplaum thiab iav fiber ntau li cov khoom siv ntxiv.

Nta: Kev ua haujlwm kub yog siab, thiab nws tsis cuam tshuam los ntawm ib puag ncig. Hom board no feem ntau siv hauv ob sab PCBs.

4. Lwm cov substrate

Ntxiv rau peb qhov nquag pom saum toj no, kuj tseem muaj cov hlau substrates thiab tsim cov txheej txheem ntau txheej (BUM).

Substrate cov cuab yeej siv tshuab thiab kev tsim khoom tau dhau los ntawm ib nrab xyoo ntawm kev txhim kho, thiab lub ntiaj teb cov khoom tsim tawm txhua xyoo tau mus txog 290 lab square meters. Txoj kev loj hlob no tau tsav los ntawm kev tsim kho tshiab thiab kev tsim cov khoom siv hluav taws xob, semiconductor manufacturing technology, electronic mounting technology, thiab printed circuit board technology. Tsav los ntawm.