ʻO ka organic rigid kiʻekiʻe PCB ʻO ka substrate ka mea maʻamau i haku ʻia me kahi papa dielectric (epoxy resin, aniani fiber) a me kahi alakaʻi hoʻomaʻemaʻe kiʻekiʻe (copper foil). Ke loiloi nei mākou i nā ʻāpana kūpono o ka maikaʻi o ka substrate papa kaapuni paʻi, ʻoi aku ka nui me ke aniani hoʻololi wela Tg, thermal expansion coefficient CTE, thermal decomposition manawa a me ka decomposition wela Td o ka substrate, nā waiwai uila, PCB wai absorption, electromigration CAF, etc.

ʻO ka maʻamau, hiki ke hoʻokaʻawale ʻia nā mea substrate no nā papa i paʻi ʻia i ʻelua mau ʻāpana: nā mea substrate paʻa a me nā mea substrate maʻalahi. ʻO ka mea maʻamau, ʻo kahi ʻano koʻikoʻi o nā mea substrate paʻa he laminate ʻaʻahu keleawe.

Wahi a nā mea hoʻoikaika o ka papa PCB, ua māhele ʻia i nā ʻano aʻe:

1. Phenolic PCB pepa substrate

No ka mea, ua haku ʻia kēia ʻano papa PCB me ka pulp pepa, ka pulp lāʻau, a me nā mea ʻē aʻe, i kekahi manawa e lilo ia i ka pepa, V0 papa, flame-retardant papa a me 94HB, etc. ʻO kāna mea nui he lāʻau pulp fiber pepa, he ʻano PCB. synthesized e ke kaomi resin phenolic. pāpaʻi.

Nā hiʻohiʻona: ʻAʻole pale ahi, hiki ke kuʻi, haʻahaʻa ke kumu kūʻai, haʻahaʻa haʻahaʻa, haʻahaʻa haʻahaʻa pili.

2. Papahana PCB hui

Kapa ʻia kēia ʻano papa pauka i ka papa pauka, me ka lāʻau pulp fiber pepa a i ʻole ka pulupulu pulp fiber pepa e like me ka mea hoʻoikaika, a me ka lole aniani e like me ka mea hoʻoikaika kino i ka manawa like. Hana ʻia nā mea ʻelua me ka resin epoxy pale ahi.

Aia kekahi ʻaoʻao hapa aniani fiber 22F, CEM-1 a me ʻelua ʻaoʻao hapalua aniani fiber papa CEM-3, ma waena o ka CEM-1 a me CEM-3 ka mea maʻamau i hoʻopaʻa ʻia i nā laminates keleawe.

3. Ke aniani fiber PCB substrate

I kekahi manawa, lilo ia i papa epoxy, papa aniani aniani, FR4, papa fiber, etc. Hoʻohana ia i ka epoxy resin ma ke ʻano he paʻa a me ka lole aniani i mea hoʻoikaika.

Nā hiʻohiʻona: He kiʻekiʻe ka mahana hana, a ʻaʻole pili i ke kaiapuni. Hoʻohana pinepine ʻia kēia ʻano papa i nā PCB ʻaoʻao ʻelua.

4. Nā mea pani ʻē aʻe

Ma waho aʻe o nā mea ʻekolu i ʻike pinepine ʻia ma luna nei, aia kekahi mau pani metala a me nā papa multi-layer (BUM).

Ua hala ka ʻenehana waiwai substrate a me ka hana ʻana i ka hapalua haneli o ka hoʻomohala ʻana, a ua hōʻea ka puka makahiki o ka honua i 290 miliona mau mika square. Ua alakaʻi ʻia kēia hoʻomohala ʻana e ka hana hou a me ka hoʻomohala ʻana o nā huahana uila, ʻenehana hana semiconductor, ʻenehana hoʻopili uila, a me ka ʻenehana papa kaapuni paʻi. Hoʻokele ʻia e.