Thepa e phahameng ea ts’ebetso ea organic e thata PCB substrate hangata e entsoe ka lera la dielectric (epoxy resin, fiber ea khalase) le mokhanni oa bohloeki bo phahameng (foil ea koporo). Re lekola likarolo tse amehang tsa boleng ba substrate ea boto e hatisitsoeng, haholo-holo ho kenyelletsa mocheso oa phetoho ea khalase Tg, coefficient ea katoloso ea mocheso CTE, nako ea ho bola le mocheso oa ho bola Td ea substrate, thepa ea motlakase, ho monya metsi a PCB, electromigration CAF, jj.

Ka kakaretso, lisebelisoa tsa substrate bakeng sa mapolanka a hatisitsoeng li ka aroloa ka mekhahlelo e ‘meli: lisebelisoa tse thata tsa substrate le lisebelisoa tse feto-fetohang tsa substrate. Ka kakaretso, mofuta oa bohlokoa oa lisebelisoa tse thata tsa substrate ke laminate ea koporo.

Ho latela lisebelisoa tsa matlafatso tsa boto ea PCB, hangata e arotsoe ka mefuta e latelang:

1. Phenolic PCB pampiri substrate

Hobane mofuta ona oa boto ea PCB e entsoe ka makhasi a pampiri, makhasi a lehong, joalo-joalo, ka linako tse ling e fetoha khateboto, boto ea V0, boto e thibelang mollo le 94HB, joalo-joalo. e entsoeng ka khatello ea phenolic resin. poleiti.

Likarolo: Ha e chese mollo, e ka thunngoa, e theko e tlase, theko e tlase, boima bo tlase bo amanang.

2. Composite PCB substrate

Mofuta ona oa boto ea phofo e boetse e bitsoa “powder board”, e nang le pampiri ea makhasi a lehong kapa pampiri ea fiber ea k’hothone e le thepa e matlafatsang, le lesela la khalase e le lisebelisoa tse matlafatsang ka nako e le ‘ngoe. Lisebelisoa tsena tse peli li entsoe ka resin ea epoxy e thibelang mollo.

Ho na le lehlakore le le leng halofo ea khalase ea fiber 22F, CEM-1 le mahlakore a mabeli a halofo ea khalase ea fiberboard CEM-3, eo har’a eona CEM-1 le CEM-3 e leng li-laminates tse entsoeng ka koporo tse nang le likarolo tse ngata.

3. Khalase fiber PCB substrate

Ka linako tse ling e boetse e fetoha boto ea epoxy, khalase ea fiber board, FR4, fiber board, joalo-joalo E sebelisa resin ea epoxy e le sekhomaretsi le lesela la khalase e le lisebelisoa tse matlafatsang.

Likarolo: Mocheso o sebetsang o phahame, ‘me ha o amehe ke tikoloho. Mofuta ona oa boto hangata o sebelisoa ho li-PCB tse nang le mahlakore a mabeli.

4. Li-substrates tse ling

Ho phaella ho tse tharo tse atisang ho bonoa ka holimo, ho boetse ho na le li-substrates tsa tšepe le liboto tsa li-multi-layer board (BUM).

Theknoloji le tlhahiso ea thepa ea substrate li fetile halofo ea lekholo la nts’etsopele, ‘me tlhahiso ea selemo le selemo ea lefats’e e fihlile ho lisekoere-mithara tse limilione tse 290. Tsoelopele ena e tsamaisitsoe ke boqapi le nts’etsopele ea lihlahisoa tsa elektroniki, theknoloji ea tlhahiso ea semiconductor, theknoloji ea ho kenya lisebelisoa tsa elektroniki, le theknoloji ea boto ea potoloho e hatisitsoeng. E tsamaisoa ke.