Wogwira ntchito kwambiri organic PCB gawo lapansi nthawi zambiri limapangidwa ndi dielectric layer (epoxy resin, glass fiber) ndi kondakitala woyeretsa kwambiri (zojambula zamkuwa). Timawunika magawo ofunikira amtundu wagawo lagawo losindikizidwa, makamaka kuphatikiza kutentha kwa magalasi Tg, CTE yowonjezera kutentha, nthawi yowola komanso kutentha kwa Td ya gawo lapansi, mphamvu zamagetsi, mayamwidwe a PCB, electromigration CAF, ndi zina zambiri.

Nthawi zambiri, zida zam’munsi zamatabwa zosindikizidwa zitha kugawidwa m’magulu awiri: zolimba za gawo lapansi ndi zida zosinthika zapansipansi. Nthawi zambiri, mitundu yofunikira ya zinthu zolimba za gawo lapansi ndi copper clad laminate.

Malinga ndi PCB board reinforcement zida, nthawi zambiri amagawidwa m’mitundu iyi:

1. Phenolic PCB pepala gawo lapansi

Chifukwa mtundu uwu wa bolodi PCB wapangidwa pepala zamkati, matabwa zamkati, etc., nthawi zina amakhala makatoni, V0 bolodi, lawi-retardant bolodi ndi 94HB, etc. nkhani yake yaikulu ndi nkhuni zamkati CHIKWANGWANI pepala, amene ndi mtundu wa PCB opangidwa ndi phenolic resin pressure. mbale.

Mawonekedwe: Osawotcha, amatha kukhomeredwa, mtengo wotsika, mtengo wotsika, kachulukidwe kakang’ono.

2. Gulu la PCB gawo lapansi

Mtundu uwu wa bolodi wa ufa umatchedwanso bolodi la ufa, wokhala ndi matabwa a matabwa a fiber fiber kapena thonje zamkati za fiber fiber monga zinthu zolimbikitsira, ndi nsalu zamagalasi zopangira zinthu zolimbitsa nthawi imodzi. Zida ziwirizi zimapangidwa ndi resin-retardant epoxy resin.

Pali mbali imodzi ya theka lagalasi fiber 22F, CEM-1 ndi mbali ziwiri theka-galasi CHIKWANGWANI CHIKWANGWANI bolodi CEM-3, pakati CEM-1 ndi CEM-3 ndi ambiri kompositi mkuwa clad laminates.

3. Galasi CHIKWANGWANI PCB gawo lapansi

Nthawi zina zimakhalanso epoxy bolodi, galasi CHIKWANGWANI bolodi, FR4, CHIKWANGWANI bolodi, etc. Amagwiritsa ntchito epoxy utomoni monga zomatira ndi galasi CHIKWANGWANI nsalu monga kulimbikitsa zakuthupi.

Mawonekedwe: Kutentha kogwira ntchito ndikokwera, ndipo sikukhudzidwa ndi chilengedwe. Mtundu uwu wa bolodi nthawi zambiri umagwiritsidwa ntchito mu ma PCB a mbali ziwiri.

4. Magawo ena

Kuphatikiza pazitatu zomwe zimawonedwa pafupipafupi pamwambapa, palinso magawo azitsulo ndi ma board a multilayer board (BUM).

Ukadaulo wazinthu zam’munsi ndi kupanga zadutsa zaka makumi asanu ndi limodzi zachitukuko, ndipo zotulutsa zapachaka zafika pa 290 miliyoni masikweya mita. Kukula kumeneku kwayendetsedwa ndi luso komanso chitukuko cha zinthu zamagetsi, ukadaulo wopanga ma semiconductor, ukadaulo woyika pamagetsi, komanso ukadaulo wa board board. Moyendetsedwa ndi.