I-high-performance organic rigid PCB i-substrate idla ngokuqulunqwa zombini i-dielectric layer (i-epoxy resin, i-glass fiber) kunye ne-conductor ephezulu (i-foil yobhedu). Sivavanya iiparamitha ezifanelekileyo zomgangatho webhodi yesekethe eprintiweyo, ngakumbi kubandakanywa ubushushu beglasi Tg, i-CTE yokwandisa i-thermal, ixesha lokubola kwe-thermal kunye nobushushu bokubola Td ye-substrate, iipropati zombane, ukufunxa kwamanzi e-PCB, i-electromigration CAF, njl.

Ngokuqhelekileyo, izixhobo ze-substrate zeebhodi eziprintiweyo zinokwahlulwa zibe ngamacandelo amabini: izinto eziqinileyo ze-substrate kunye ne-flexible substrate materials. Ngokuqhelekileyo, iindidi ezibalulekileyo zezinto eziqinileyo ze-substrate yi-copper clad laminate.

Ngokwezixhobo zokuqinisa ibhodi yePCB, yahlulwe ngokubanzi ngokwezi ntlobo zilandelayo:

1. Phenolic PCB iphepha substrate

Ngenxa yokuba olu hlobo lwebhodi ye-PCB yenziwe nge-pulp yephepha, i-pulp yomthi, njl., ngamanye amaxesha iba yikhadibhodi, ibhodi ye-V0, ibhodi ye-flame-retardant kunye ne-94HB, njl. yenziwe ngoxinzelelo lwe-phenolic resin. ipleyiti.

Iimpawu: Ayinamlilo, inokubethelwa ngenqindi, ixabiso eliphantsi, ixabiso eliphantsi, ukuxinana kwesalamane esiphantsi.

2. Inxalenye yePCB ehlanganisiweyo

Olu hlobo lwebhodi yomgubo ikwabizwa ngokuba yibhodi yomgubo, kunye nephepha lefayibha yenkuni okanye iphepha lomqhaphu lefiber yomqhaphu njengemathiriyeli yokuqinisa, kunye nelaphu legilasi yefayibha njengento yokuqinisa umphezulu ngaxeshanye. Ezi zinto zimbini zenziwe nge-epoxy-retardant epoxy resin.

Kukho icala elinye isiqingatha-iglasi ifayibha 22F, CEM-1 kunye kabini-macala isiqingatha-iglasi ifayibha ibhodi CEM-3, phakathi apho CEM-1 kunye CEM-3 zezona zixhaphakileyo isiseko ezidityanisiweyo laminates ubhedu clad.

3. I-Glass fiber PCB substrate

Ngamanye amaxesha iphinda ibe yibhodi ye-epoxy, i-glass fiberboard, i-FR4, i-fiber board, njl. Isebenzisa i-epoxy resin njenge-adhesive kunye ne-glass fiber cloth njengento yokuqinisa.

Iimpawu: Ukushisa okusebenzayo kuphezulu, kwaye akuchaphazeli ngokusingqongileyo. Olu hlobo lwebhodi luhlala lusetyenziswa kwiiPCB ezimacala amabini.

4. Ezinye substrates

Ukongeza kwezi zintathu zibonwa rhoqo ngasentla, kukho ii-substrates zetsimbi kunye ne-build-up multi-layer board (BUM).

Itekhnoloji ye-substrate yezinto kunye nemveliso ziye zadlula kwisiqingatha senkulungwane yophuhliso, kwaye imveliso yonyaka ifikelele kwi-290 yezigidi zeemitha ezikwere. Olu phuhliso luqhutywa kukwenziwa ngokutsha kunye nophuhliso lweemveliso ze-elektroniki, itekhnoloji yokuvelisa i-semiconductor, itekhnoloji yokufakwa kwe-elektroniki, kunye nobuchwepheshe bebhodi yesekethe eprintiweyo. Iqhutywa ngu.