Ukusebenza okuphezulu kwe-organic rigid PCB i-substrate ngokuvamile yakhiwe kokubili ungqimba lwe-dielectric (i-epoxy resin, i-glass fiber) kanye nomqhubi we-high-purity (i-foil yethusi). Sihlola amapharamitha afanelekile wekhwalithi ye-substrate yebhodi lesifunda ephrintiwe, ikakhulukazi okuhlanganisa izinga lokushisa lengilazi Tg, i-CTE yokwandisa okushisayo, isikhathi sokubola okushisayo kanye nezinga lokushisa lokubola Td le-substrate, izakhiwo zikagesi, ukumuncwa kwamanzi kwe-PCB, i-electromigration CAF, njll.

Ngokuvamile, izinto ze-substrate zamabhodi aphrintiwe zingahlukaniswa zibe izigaba ezimbili: izinto eziqinile ze-substrate kanye nezinto eziguquguqukayo ze-substrate. Ngokuvamile, izinhlobonhlobo ezibalulekile zezinto eziqinile ze-substrate i-copper clad laminate.

Ngokusho kwezinto zokuqinisa ibhodi le-PCB, ngokuvamile ihlukaniswe ngezinhlobo ezilandelayo:

1. Phenolic PCB paper substrate

Ngenxa yokuthi lolu hlobo lwebhodi le-PCB lakhiwe nge-pulp yephepha, i-wood pulp, njll., ngezinye izikhathi liba amakhadibhodi, ibhodi le-V0, ibhodi elivimbela ilangabi kanye ne-94HB, njll. Impahla yayo eyinhloko yiphepha le-wood pulp fiber, okuwuhlobo lwe-PCB. ihlanganiswe nengcindezi ye-phenolic resin. ipuleti.

Izici: Akunamlilo, kungashaywa, izindleko eziphansi, intengo ephansi, ukuminyana okuphansi kwesihlobo.

2. Inhlanganisela ye-PCB substrate

Lolu hlobo lwebhodi lempushana lubizwa nangokuthi i-powder board, enephepha le-wood pulp fiber noma iphepha le-cotton pulp fiber njengento yokuqinisa, kanye nendwangu ye-glass fiber njengento yokuqinisa phezulu ngesikhathi esifanayo. Lezi zinto ezimbili zenziwe nge-epoxy resin evimbela ilangabi.

Kukhona i-fiberboard ye-glass-glass ehlangothini eyodwa engu-22F, i-CEM-1 kanye nebhodi le-fiber yengilazi enezinhlangothi ezimbili ze-CEM-3, phakathi kwayo i-CEM-1 ne-CEM-3 okuyizinto ezivame kakhulu eziyinhlanganisela ze-copper clad laminates.

3. I-Glass fiber PCB substrate

Kwesinye isikhathi ibuye ibe yibhodi le-epoxy, i-glass fibre board, i-FR4, i-fiber board, njll. Isebenzisa i-epoxy resin njenge-adhesive kanye nendwangu ye-fiber yengilazi njengento eqinisayo.

Izici: Izinga lokushisa lokusebenza liphezulu, futhi alithintwa imvelo. Lolu hlobo lwebhodi luvame ukusetshenziswa kuma-PCB anezinhlangothi ezimbili.

4. Amanye ama-substrates

Ngaphezu kwalokhu okuthathu okuvame ukubonwa ngenhla, kukhona nama-substrates ensimbi kanye namabhodi anezingqimba eziningi ezakhayo (BUM).

Ubuchwepheshe be-substrate kanye nokukhiqizwa sekudlule ikhulunyaka lentuthuko, futhi umphumela wonyaka womhlaba usufinyelele kumamitha-skwele ayizigidi ezingama-290. Le ntuthuko iqhutshwa ukusungulwa nokuthuthukiswa kwemikhiqizo ye-elekthronikhi, ubuchwepheshe bokukhiqiza i-semiconductor, ubuchwepheshe bokufaka i-electronic, kanye nobuchwepheshe bebhodi lesekethe eliphrintiwe. Ishayelwa.