Iyo yepamusoro-inoshanda organic yakaoma PCB substrate inowanzoumbwa nezvose zviri zviviri dielectric layer (epoxy resin, glass fiber) uye high-purity conductor (copper foil). Isu tinoongorora maparamendi akakodzera eakadhindwa wedunhu bhodhi substrate mhando, kunyanya kusanganisira girazi shanduko tembiricha Tg, yekupisa yekuwedzera coefficient CTE, kupisa kwekuora nguva uye decomposition tembiricha Td ye substrate, magetsi zvivakwa, PCB yekunyudza mvura, electromigration CAF, nezvimwe.

Kazhinji, substrate zvinhu zvemabhodhi akadhindwa zvinogona kukamurwa kuita mapoka maviri: rigid substrate zvinhu uye inoshanduka substrate zvinhu. Kazhinji, yakakosha yakasiyana-siyana yakaoma substrate zvinhu ndeye copper clad laminate.

Zvinoenderana nePCB board yekusimbisa zvinhu, inowanzo kupatsanurwa kuva anotevera marudzi:

1. Phenolic PCB bepa substrate

Nokuti rudzi urwu rwePCB bhodhi rinoumbwa nemapuranga emapuranga, huni hwehuni, nezvimwewo, dzimwe nguva rinova makadhibhokisi, V0 bhodhi, bhodhi rinopisa moto uye 94HB, nezvimwewo. Chinhu chayo chikuru imapuranga pulp fiber paper, inova rudzi rwePCB. yakagadzirwa ne phenolic resin pressure. ndiro.

Zvimiro: Hazvipindi moto, zvinogona kubaiwa, mutengo wakaderera, mutengo wakaderera, wakaderera hukama.

2. Composite PCB substrate

Iri rudzi rwehupfu bhodhi rinonziwo bhodhi rehupfu, rine huni pulp fiber bepa kana donje pulp fiber bepa sechinhu chekusimbisa, uye girazi fiber jira sechinhu chinosimbisa pamusoro panguva imwe chete. Zvinhu zviviri izvi zvakagadzirwa nemurazvo-retardant epoxy resin.

Kune imwechete-sided hafu-girazi faibha 22F, CEM-1 uye kaviri-sided hafu-girazi faibha bhodhi CEM-3, pakati payo CEM-1 uye CEM-3 ndiwo anonyanya kuumbwa base copper clad laminates.

3. Girazi fiber PCB substrate

Dzimwe nguva inovawo epoxy board, girazi faibha bhodhi, FR4, faibha bhodhi, etc. Inoshandisa epoxy resin sekunamira uye girazi faibha jira sekusimbisa zvinhu.

Zvimiro: Tembiricha yekushanda yakakwira, uye haina kukanganiswa nenharaunda. Rudzi urwu rwebhodhi runowanzoshandiswa mune mbiri-mativi PCBs.

4. Mamwe ma substrates

Pamusoro peaya matatu anowanzo onekwa pamusoro, kune zvakare simbi substrates uye kuvaka-up akawanda-layer board (BUM).

Substrate zvinhu tekinoroji uye kugadzira zvakapfuura nehafu yezana ramakore rebudiriro, uye kuburitswa kwepagore kwenyika kwasvika 290 miriyoni mativi metres. Iyi budiriro yakafambiswa nekuvandudzwa uye kuvandudzwa kwezvigadzirwa zvemagetsi, tekinoroji yekugadzira semiconductor, tekinoroji yekumisikidza yemagetsi, uye tekinoroji yakadhindwa yebhodhi. Inotyairwa ne.