Qalafsanaanta dabiiciga ah ee waxqabadka sare leh PCB Substrate caadi ahaan waxa uu ka kooban yahay lakabka dielectric (resin epoxy, fiber galaas) iyo kaari daahir sare ah (foil naxaas ah). Waxaan qiimeyneynaa cabbirada habboon ee tayada substrate-ka ee daabacan, oo ay ku jiraan heerkulka kala-guurka galaaska Tg, isku-darka ballaarinta kulaylka CTE, waqtiga kuleylka kulaylka iyo burburka heerkulka Td ee substrate, guryaha korantada, nuugista biyaha PCB, koronto CAF, iwm.

Guud ahaan, alaabta substrate ee looxyada daabacan waxaa loo qaybin karaa laba qaybood: Qalabka substrate-ka adag iyo alaabta substrate dabacsan. Guud ahaan, noocyo kala duwan oo muhiim ah oo ka mid ah qalabka substrate adag waa laminate naxaas ah.

Marka loo eego agabka xoojinta guddiga PCB, guud ahaan waxa loo qaybiyaa noocyada soo socda:

1. phenolic PCB substrate warqad

Sababtoo ah looxa PCB-ga noocaan ah wuxuu ka kooban yahay saxar xaashi ah, saxarka alwaax, iwm, mararka qaarkood wuxuu noqdaa kartoon, looxa V0, looxa ololka celinaya iyo 94HB, iwm. Alaabta ugu muhiimsan waa xaashi saxarka alwaax ah, oo ah nooc PCB ah. lagu sameeyay cadaadiska resin phenolic. saxan.

Astaamaha: Ma aha dabci, waa la feeray, qiimo jaban, qiimo jaban, cufnaanta qaraabada hoose.

2. Substrate PCB oo isku dhafan

Noocaan looxa budada ah waxaa sidoo kale loo yaqaannaa looxa budada ah, oo leh xaashida saxarka alwaax ama xaashida saxarka suufka oo ah walxo xoojin ah, iyo maro fiber galaas ah oo ah walxaha xoojinta dusha isku mar. Labada walxood waxay ka samaysan yihiin resin epoxy resin ololaya.

Waxaa jira hal-geesood fiber-glaas ah fiber 22F, CEM-1 iyo laba-geeska ah guddiga fiber fiber-glaas CEM-3, oo ay ku jiraan CEM-1 iyo CEM-3 yihiin ugu caansan ka kooban saldhigga naxaas laminates.

3. Glass fiber substrate PCB

Mararka qaarkood waxay sidoo kale noqotaa looxa epoxy, looxa fiber galaas, FR4, looxa fiber, iwm. Waxay isticmaashaa xabagta epoxy sida koolo iyo maro fiber galaas ah sida walxaha xoojinta.

Astaamaha: Heerkulka shaqadu waa sarreeyaa, mana saameynayso deegaanka. Looxa noocaan ah waxaa badanaa lagu isticmaalaa PCB-yada laba-geesoodka ah.

4. Substrates kale

Marka lagu daro saddexda sare ee sida badan loo arko, waxa kale oo jira biro ka samaysan bir iyo sabuurad-lakabyo badan (BUM).

Tignoolajiyada agabka substrate-ka iyo wax soo saarku waxa ay soo martay horumar nus qarni ah, wax-soo-saarka sannadlaha ah ee dunidu waxa uu gaadhay 290 milyan oo mitir oo laba jibbaaran. Horumarkan waxaa horseeday hal-abuurka iyo horumarinta alaabada elektiroonigga ah, tignoolajiyada wax-soo-saarka semiconductor, tignoolajiyada kor-u-qaadista korantada, iyo tignoolajiyada guddiga wareegtada daabacan. Wadey.