Koj yuav xaiv li cas PCB khoom

Cov ntaub ntawv siv los tsim cov ntawv xov xwm hluav taws xob luam tawm (PCBS) suav nrog ib pawg ntawm insulating/dielectric thiab cov khoom siv coj los siv los tsim cov rooj sib tham hauv Circuit Court. Muaj ntau yam khoom siv los ua kom tau raws li qhov ua tau zoo sib txawv thiab kev xav tau nyiaj txiag. Hom khoom siv los ua PCBS yog qhov tseem ceeb hauv kev ua haujlwm thiab ua haujlwm ntawm PCB cov khoom. Xaiv cov khoom siv PCB kom raug yuav tsum nkag siab txog cov khoom siv thiab lawv lub cev lub cev, nrog rau lawv ua raws li qhov xav tau ntawm lub rooj tsavxwm.

Hom ntawv luam tawm Circuit Board

Muaj 4 hom tseem ceeb ntawm PCBS:

L Rigid-khoom, tsis hloov pauv ib leeg-lossis ob tog PCB

Saj zawg zog (Flex)-feem ntau siv thaum PCB tsis tuaj yeem raug kaw hauv ib lub dav hlau lossis hauv txoj haujlwm tsis yog dav hlau

L Rigid-saj zawg zog-yog kev sib xyaw ua ke ntawm PCB nruj thiab hloov pauv tau, qhov twg pawg thawj coj saib tau yooj yim txuas nrog rau pawg thawj coj

L Siab ntau – Cov PCBS no feem ntau yog siv hauv cov ntawv thov uas xav tau tshwj xeeb teeb liab kis ntawm lub hom phiaj thiab tus txais.

Cov khoom siv PCB tau xaiv yuav tsum tau ua kom muaj txiaj ntsig zoo ntawm qhov kev sib tw zaum kawg luam tawm hauv pawg thawj coj saib. Yog li ntawd, nws yog ib qho tseem ceeb uas yuav tau xav txog qhov ua tau zoo thiab ib puag ncig xav tau ntawm cov khoom siv hluav taws xob.

Cov khoom siv los txiav txim siab thaum xaiv cov khoom siv PCB

Plaub Yam Ntxim Saib Ntxim Ua (los ntawm IPC 4101 – Rigid thiab Multilayer PCB Base Materials Specification) Yam khoom ntawm PCB yog qhov tseem ceeb los pab txheeb xyuas qhov ua tau zoo ntawm cov khoom siv hauv paus.

1. CTE – Thermal expansion coefficient yog ntsuas ntsuas ntau npaum li cas cov khoom nthuav tawm thaum ua kom sov. Qhov no tseem ceeb heev ntawm Z-axis. Feem ntau, kev nthuav dav ntau dua li qhov kub hnyiab (Tg). Yog tias CTE ntawm cov khoom tsis txaus lossis siab dhau, qhov tsis ua tiav tuaj yeem tshwm sim thaum sib dhos vim tias cov khoom yuav nthuav dav sai dua Tg.

2. Tg – Qhov hloov pauv kub ntawm vitrification ntawm cov khoom siv yog qhov kub uas cov khoom hloov pauv los ntawm cov iav uas khov iav mus rau cov khoom siv tau yooj yim dua thiab hloov tau yooj yim. Thaum kub siab dua Tg cov ntaub ntawv, qhov nthuav dav nce ntxiv. Nco ntsoov tias cov ntaub ntawv tuaj yeem muaj tib Tg tab sis muaj CTE sib txawv. (CTE qis dua yog qhov xav tau).

3.Td – decomposition kub ntawm laminates. Qhov no yog qhov kub uas cov khoom tawg. Kev ntseeg tau tsis zoo thiab qhov ua tsis raug tuaj yeem tshwm sim vim cov khoom tso tawm mus txog 5% ntawm nws qhov hnyav thawj. PCB nrog kev ntseeg siab dua lossis PCB ua haujlwm nyob rau hauv cov xwm txheej hnyav yuav xav tau TD ntau dua lossis sib npaug li 340 ° C.

4. Lub sij hawm tshem tawm ntawm T260 / T288 – 260 ° C thiab 280 ° C – Kev sib koom ua ke tsis zoo ntawm cov laminates vim cov thermal decomposition (Td) ntawm epoxy resin matrix thaum PCB tuab tau hloov pauv.

Txhawm rau xaiv cov khoom siv laminate zoo tshaj rau koj li PCB, nws yog ib qho tseem ceeb kom paub tias koj xav tias cov khoom yuav coj li cas. Ib lub hom phiaj ntawm kev xaiv cov khoom siv yog txhawm rau ua kom cov cua sov ntawm cov khoom siv laminated zoo nrog cov khoom siv kom txuas rau lub phaj.