PCB design principles and anti-interference measures

PCB is the support of circuit components and components in electronic products. Inopa kubatana kwemagetsi pakati pezvinhu zvematunhu nemidziyo. Nekukurumidza kukura kwetekinoroji yemagetsi, kuwanda kwePGB kuri kuwedzera nekukwira. Iko kugona kwePCB dhizaini yekudzivisa kupindirwa kunoita mutsauko mukuru. Naizvozvo, mune pcb dhizaini. Iwo iwo makuru maitiro ePCB dhizaini anofanira kuteverwa uye izvo zvinodikanwa zvekurwisa-kupindira dhizaini kunofanirwa kusangana.

ipcb

General misimboti pcb dhizaini

Kurongeka kwezvinhu pamwe newaya kwakakosha pakuita kwakakwana kwemaseketi emagetsi. For good design quality. Pcb nemutengo wakaderera unofanirwa kutevera zvinotevera zvirevo zvinotevera:

1. Marongerwo acho

Chekutanga pane zvese, zvakafanira kufunga nezvePCB saizi yakakura kwazvo. Kana saizi pcb yakanyanyisa kukura, mutsetse wakadhindwa wakareba, iyo impedance inowedzera, kugona kurwisa ruzha kunoderera, uye mutengo unowedzera. Zvidiki kwazvo, kupisa kupisa hakuna kunaka, uye mitsara iri padhuze inogona kupindirwa. Mushure mekuona saizi pcb. Wobva watsvaga izvo zvakakosha zvikamu. Chekupedzisira, zvinoenderana neyunoshanda unit redunhu, zvese zvikamu zvedunhu zvakaiswa.

Cherekedza anotevera misimboti kana uchisarudza nzvimbo yezvinhu zvakakosha.

(1) Pfupisa kubatana pakati peye-frequency zvinhu sezvazvinogona, uye edza kudzikamisa yavo yekuparadzira paramita uye yemagetsi kupindira pakati peumwe neumwe. Zvinhu zvinokanganisa zviri nyore hazvifanirwe kunge zviri padhuze nepadhuze, uye zvekuisa uye zvinobuda zvinofanirwa kunge zviri kure sezvinobvira.

(2) Panogona kuve nemusiyano wepamusoro pakati pezvimwe zvinhu kana mawaya, saka daro pakati pawo rinofanira kuwedzerwa kudzivirira tsaona pfupi redunhu rinokonzerwa nekubuda. Midziyo ine yakakwira voltage inofanirwa kuve isingaite sezvinobvira kuiswa munzvimbo dzisingasvikike nyore neruoko panguva yekugadzirisa.

(3) Zvikamu zvine huremu hunopfuura 15g. Inofanira kunge yakasungwa uye yobva yaiswa simbi. Izvo zvakakura uye zvinorema. Izvo zvinhu zvine yakakwira calorific kukosha hazvifanire kuiswa pane yakadhindwa bhodhi, asi pane chassis yemuchina wese, uye dambudziko rekupisa kupisa rinofanira kutariswa. Zvinhu zvinopisa zvinofanirwa kuchengetedzwa kure nezvinodziya.

(4) ye potentiometer. Adjustable inductor coil. Variable capacitor. Kurongeka kwezvinhu zvinogadziriswa zvakaita se microswitch inofanirwa kufunga nezve zvimiro zvemuchina wese. Kana iyo muchina kugadzirisa, inofanirwa kuiswa pane yakadhindwa bhodhi pamusoro zviri nyore kugadzirisa nzvimbo; Kana muchina ukagadziridzwa kunze, chinzvimbo chayo chinofanirwa kuchinjiswa kune chinzvimbo chekugadzirisa pfundo pane chassis pani.

(5) Chinzvimbo chinogarwa nenzvimbo yekumisikidza uye kugadzirisa bracket yeyekudhinda lever inofanira kuiswa parutivi.

Zvinoenderana nechikamu chinoshanda chedunhu. Kurongeka kwezvinhu zvese zvedunhu zvinoenderana nemitemo inotevera:

(1) Ronga chinzvimbo chega chega chinoshanda wedunhu unit zvinoenderana nedanho, kuitira kuti marongero acho ave nyore pakuyerera kwechiratidzo uye chiratidzo chinochengeta iwo iwo iwo madireko kusvika pazvinogona.

(2) Kune epakati zvikamu zveimwe dunhu rinoshanda senzvimbo, kutenderedza kuitisa marongerwo. Zvikamu zvinofanirwa kunge zvakafanana. Uye yakachena. Tightly arranged on the PCB. Deredza uye pfupisa inotungamira uye kubatana pakati pezvinhu.

(3) For circuits working at high frequencies, the distributed parameters between components should be considered. Mune maseketi akajairika, zvikamu zvinofanirwa kurongedzwa zvakafanana sezvinobvira. Nenzira iyi, kwete chete runako. Uye nyore kuungana uye weld.

(4) Components located at the edge of the circuit board, generally not less than 2mm from the edge of the circuit board. Chimiro chakanakisa chebhodhi redunhu itswere. Kureba kusvika paupamhi reshiyo ndi 3:20 na 4: 3. Saizi yebhodhi redunhu yakakura kudarika 200x150mm. Kufungirwa kunofanirwa kupihwa kune iyo michina simba redunhu bhodhi.

2. Wiring

Nheyo dze wiring ndedzinotevera:

(1) Parallel wires at the input and output terminals should be avoided as far as possible. Zvirinani kuwedzera pasi tambo pakati pewaya kudzivirira mhinduro yekubatanidza.

(2) The minimum width of printed wire is mainly determined by the adhesion strength between wire and insulating substrate and the current value flowing through them.

Kana pakukora kwemhangura foil iri 0.05mm uye upamhi i1 ~ 15mm. Yazvino kuburikidza 2A, iyo tembiricha haizove yakakwira kupfuura 3 ℃, saka tambo yakafara ye 1.5mm inogona kusangana nezvinodiwa. For integrated circuits, especially digital circuits, 0.02~0.3mm wire width is usually selected. Ehe, shandisa yakafara tambo sezvaunogona. Kunyanya tambo dzemagetsi netambo dzepasi.

Iko kushomeka kwepakati kwetambo kunonyanya kutemerwa neiyo yekudzivirira kusagadzikana uye kuputsika kwemagetsi pakati pewaya mune yakaipa kesi. Kune macircuit akabatanidzwa, kunyanya maseketi edhijitari, sekureba sekutendera kwacho, nzvimbo yacho inogona kunge diki se5 ~ 8mm.

(3) Yakadhindwa waya yakakotama kazhinji inotora yakatenderera arc, uye kurudyi Angle kana inosanganisirwa Angle mune yakakwira frequency dunhu inokanganisa mashandiro emagetsi. Uye zvakare, edza kudzivirira kushandisa nzvimbo hombe dzemhangura foil, zvikasadaro. When heated for a long time, copper foil expands and falls off easily. Kana nzvimbo hombe dzemhangura foil dzichifanira kushandiswa, zviri nani kushandisa gridhi. Izvi zvinobatsira kubviswa kwemhangura foil uye substrate kubatana pakati pekupisa kunogadzirwa nemhepo isina kugadzikana.

3. Hwendefa rekumonera

Iyo yepakati gomba repadiki rinofanira kuve rakakura zvishoma pane iro rinotungamira dhayamita yedhizaina. Yakakura kwazvo pad iri nyore kugadzira chaiyo yekutenderera. Pad yekunze dhayamita D kazhinji haisi pasi pe (D +1.2) mm, iko D ndiyo inotungamira kuzarura. Kune akakwirisa edhijitari macircuit, iwo mashoma dhayamita yepad inodikanwa (D +1.0) mm.

Pcb uye redunhu Anti-chipingaidzo matanho

Iyo anti-yekukanganisa dhizaini yakadhindwa redunhu bhodhi inowirirana chaizvo kune chaiyo dunhu. Pano panotsanangurwa mashoma mashoma maitiro ekurwisa-kupindira dhizaini yePBB inotsanangurwa.

1. Simba tambo dhizaini

Zvinoenderana nesaizi yeiyo yakadhindwa redunhu bhodhi yazvino, kusvika pazvinogona kuwedzera upamhi hwetambo yemagetsi, kudzikisa kuramba kwechiuno. Panguva imwe. Gadzira tambo yemagetsi. Iko kunongedzwa kwetambo yepasi kunoenderana nekwekufambiswa kwedata kufambisa, iyo inobatsira kuwedzera ruzha kuramba.

2. Roti dhizaini

Nheyo yevhu waya dhizaini ndeiyi:

(1) Dhijitari ivhu rakaparadzaniswa nenzvimbo yeanalogog. Kana paine zvese zvine musoro uye zvine mitsara maseketi pane redunhu bhodhi, chengeta ivo vakaparadzana sezvinobvira. Ivhu repasi-frequency dunhu rinofanira kutora poindi imwechete yakafanana nekumisikidza kure sezvinobvira. Kana iyo chaiyo wiring ichinetsa, chikamu chedunhu chinogona kubatanidzwa mune dzakateedzana uyezve yakafanana grounding. High frequency circuit should use multi-point series grounding, grounding should be short and rent, high frequency elements around as far as possible with a large area of grid foil.

(2) Tambo yekukwirisa inofanira kunge iri gobvu sezvinobvira. Kana iyo yekumisikidza tambo iri refu kwazvo, iyo yekumisikidza ingangochinja pamwe neyazvino, kuitira kuti anti-ruzha kuita kuderedzwa. Iyo waya yekumisikidza saka inofanira kuve yakanyanya kuitira kuti ikwanise kupfuura katatu iyo inobvumidzwa yazvino pane rakadhindwa bhodhi. Kana zvichikwanisika, tambo yekugadzirisa inofanira kunge yakakura kudarika 2 mm kusvika 3mm.

(3) Tambo yepasi inoita chiuno chakavharwa. Most of the printed board composed only of digital circuit can improve the anti-noise ability of the grounding circuit.

3. Kudonhedza capacitor gadziriso

Imwe yemaitiro akajairika muPCB dhizaini ndeyekuisa yakakodzera decoupling capacitors mune yega yega kiyi chikamu cheakadhindwa bhodhi. Iyo yakajairwa yekumisikidza musimboti weiyo decoupling capacitor ndeiyi:

(1) Mugumo wekuisa simba wakabatana ne electrolytic capacitor ye10 ~ 100uF. Kana zvichibvira, zvirinani kubatanidza 100uF kana pamusoro.

(2) musimboti, yega yega Chip chip inofanirwa kuve yakagadzirirwa ne0.01pF ceramic capacitor. Kana iyo yakadhindwa bhodhi nzvimbo isina kukwana, 1 ~ 10pF capacitor inogona kurongedzwa yega yega 4 ~ 8 machipisi.

(3) Iyo anti-ruzha kugona haina simba. Kune zvishandiso zvine simba rakakura shanduko panguva yekudzima, senge RAM.ROM ndangariro zvishandiso, iyo decoupling capacitor inofanirwa kuve yakabatana zvakananga pakati petambo yemagetsi netambo yepasi yechip.

(4) Iyo inotungamira capacitor haigone kureba, kunyanya iyo yepamusoro-frequency yekupfuura capacitor haigone kutungamira. Uye zvakare, mapoinzi maviri anotevera anofanirwa kucherechedzwa:

(1 Kune contactor mubhodhi rakadhindwa. Ataure. Kuburitsa kwakakura kuburitsa kuchagadzirwa kana uchinge uchishandisa mabhatani uye zvimwe zvinhu, uye iro RC redunhu rinoratidzwa mumufananidzo wakanamatira rinofanirwa kushandiswa kutora iko zvino kubuda. Kazhinji, R iri 1 ~ 2K, uye C iri 2.2 ~ 47UF.

Iyo yekuisa impedance ye2CMOS yakanyanya kukwirira uye inonzwisisika, saka magumo asina kushandiswa anofanirwa kuvakwa kana kubatanidzwa kune yakanaka magetsi magetsi.