PCB yinkxaso yamacandelo esekethe namacandelo kwiimveliso ze-elektroniki. Inika unxibelelwano lombane phakathi kwezinto zesekethe kunye nezixhobo. Ngophuhliso olukhawulezayo lwetekhnoloji yombane, uxinano lwe-PGB iya isonyuka ngokunyuka. Ukukwazi uyilo PCB ukumelana uphazamiseko kwenza umahluko omkhulu. Ke ngoko, kuyilo lwePCB. Imigaqo ngokubanzi yoyilo lwe-PCB kufuneka ilandelwe kwaye iimfuno zoyilo lokuchasana kufuneka kufezekiswe.

Imigaqo ngokubanzi yoyilo PCB

Ubume beekhomponenti kunye neengcingo kubalulekile ekusebenzeni ngokuchanekileyo kweesekethe zombane. Kumgangatho woyilo olungileyo. I-PCB enexabiso eliphantsi kufuneka ilandele le migaqo ngokubanzi:

1. Uyilo

Okokuqala, kufuneka kuthathelwe ingqalelo ubungakanani bePCB kukhulu kakhulu. Xa ubungakanani bePCB bukhulu kakhulu, umgca oprintiweyo mde, ukunyuka kokunyusa, amandla okulwa nengxolo ayancipha, kwaye iindleko ziyanda. Incinci kakhulu, ukusasazeka kobushushu akulunganga, kwaye imigca ekufutshane inokuthi iphazamiseke. Emva kokumisela ubungakanani bePCB. Emva koko khangela izinto ezikhethekileyo. Okokugqibela, ngokwiyunithi esebenzayo yesekethe, onke amacandelo esekethe abekiwe.

Qaphela le migaqo ilandelayo xa umisela indawo yezinto ezizodwa:

(1) Mfutshane kunxibelelwano phakathi kwezinto ezinamaza aphakamileyo kangangoko kunokwenzeka, kwaye uzame ukunciphisa iiparameter zokuhambisa kunye nokuphazamiseka kombane phakathi komnye nomnye. Izinto eziphazanyiswa ngokulula akufuneki zisondele kakhulu komnye komnye, kwaye igalelo kunye nezinto ezikhutshwayo kufuneka zibe kude kangangoko kunokwenzeka.

(2) Kunokubakho umahluko omkhulu phakathi kwezinto ezithile okanye iingcingo, ke umgama phakathi kwazo kufuneka unyuswe ukunqanda ngengozi isekethe emfutshane ebangelwe kukukhutshwa. Izinto ezinamandla ombane aphezulu kufuneka zibekwe kwiindawo ezinokuthi zingafikeleleki lula ngesandla ngexesha lokulungisa.

(3) Izinto ezinobunzima obungaphezulu kwe-15g. Kuya kufuneka idityaniswe kwaye idityaniswe. Ezi zinkulu kwaye zinzima. Izinto ezinexabiso eliphezulu le-calorific akufuneki zifakwe kwibhodi eprintiweyo, kodwa kwi-chassis yomatshini uphela, kwaye ingxaki yokuchithwa kobushushu kufuneka ithathelwe ingqalelo. Izinto ze-Thermal kufuneka zigcinwe kude nezinto zokufudumeza.

(4) ye potentiometer. Coil inductor Adjustable. Isiguquli esiguqukayo. Ubeko lwezinto ezinokuhlengahlengiswa ezinje ngemicroswitch kufuneka ziqwalasele iimfuno zokwakheka komatshini uphela. Ukuba uhlengahlengiso kumatshini, kufuneka lubekwe kwibhodi eprintiweyo ngasentla ngokulula ukulungisa indawo; Ukuba umatshini uhlengahlengisiwe ngaphandle, isikhundla saso kufuneka silungelelaniswe nendawo yeqhina lokulungisa kwiphaneli yesisu.

(5) Indawo ekuhlalwa kuyo ngumngxuma wokubekwa kunye nokulungiswa kwesibambiso sokushicilela kufuneka sibekelwe bucala.

Ngokwicandelo lomsebenzi wesekethe. Ubeko lwawo onke amacandelo esekethe luya kuthobela le migaqo ilandelayo:

(1) Hlela indawo nganye yokusebenza kwesekethe ngokuhambelana nenkqubo yesekethe, ukuze ubeko lulungele ukuhamba kwesiginali kwaye isiginali igcina icala elifanayo kangangoko kunokwenzeka.

(2) Kwizinto ezingundoqo zesekethe nganye esebenzayo njengeziko, lijikeleze ukwenza ubeko. Izixhobo kufuneka zifane. Icocekile. Imiswe kakuhle kwi-PCB. Nciphisa kwaye unciphise isikhokelo kunye nonxibelelwano phakathi kwamacandelo.

(3) Kwiisekethe ezisebenza kumaza aphakamileyo, iiparameter ezisasazwayo phakathi kwezinto kufuneka ziqwalaselwe. Kwiisekethe ngokubanzi, izinto kufuneka zicwangciswe ngokuhambelana kangangoko kunokwenzeka. Ngale ndlela, ayisiyontle kuphela. Kwaye kulula ukuhlangana kunye ne-weld.

(4) Izinto ezifumaneka kumda webhodi yesekethe, ngokubanzi ingekho ngaphantsi kwe-2mm ukusuka kumda webhodi yesekethe. Eyona milo ilungileyo yebhodi yesekethe luxande. Ubude kububanzi bobubanzi ngu-3: 20 no-4: 3. Ubungakanani bebhodi yesekethe bukhulu kune-200x150mm. Ukuqwalaselwa kufuneka kunikwe amandla oomatshini bebhodi yesekethe.

2. Iingcingo

Imigaqo ye-wiring imi ngolu hlobo lulandelayo:

(1) Iingcingo ezifanayo kwiindawo zokufaka kunye nakwiziphumo kufuneka zithintelwe kangangoko kunokwenzeka. Kungcono ukongeza ucingo lomhlaba phakathi kweentambo ukunqanda ukudibana kwengxelo.

(2) Ububanzi obuncinci bocingo olushicilelweyo buxhomekeke ikakhulu kumandla okubambelela phakathi kocingo kunye ne-insstrate substrate kunye nexabiso langoku elihamba kuzo.

Xa ubukhulu befoyile yobhedu bungu-0.05mm kwaye ububanzi buyi-1 ~ 15mm. Okwangoku ngokudlula kwi-2A, iqondo lobushushu alizukuba ngaphezulu kwe-3 ℃, ke ububanzi bocingo lwe-1.5mm bunokuhlangabezana neemfuno. Kwiisekethe ezihlanganisiweyo, ngakumbi iisekethe zedijithali, i-0.02 ~ 0.3mm ububanzi bocingo luhlala lukhethiwe. Ewe kunjalo, sebenzisa umgca obanzi kangangoko unakho. Ngokukodwa iintambo zamandla kunye neentambo zomhlaba.

Ubuncinci bezithuba zeengcingo buxhomekeke ikakhulu kukungqinwa kokugquma kunye noqhekeko lwamandla ombane phakathi kweentambo kwimeko ezimbi. Kwiisekethi ezihlanganisiweyo, ngakumbi iisekethe zedijithali, ukuba nje inkqubo ivumela, isithuba sinokuba sincinci njenge-5 ~ 8mm.

(3) Ishicilelwe ngocingo olushicilelweyo ngokubanzi ithatha iarc ejikelezayo, kunye neAngle elungileyo okanye iAngle ebandakanyiweyo kwisekethe ephezulu iya kuchaphazela ukusebenza kombane. Ukongeza, zama ukunqanda ukusebenzisa iindawo ezinkulu zephepha lobhedu, kungenjalo. Xa kushushu ixesha elide, ifoyile yobhedu iyanda kwaye iwa ngokulula. Xa kufuneka kusetyenziswe iindawo ezinkulu zefoyile yobhedu, kungcono ukusebenzisa iigridi. Oku kuluncedo ekususweni kwefoyile yobhedu kunye ne-substrate bonding phakathi kobushushu obuveliswe yigesi eguqukayo.

3. Ipleyiti yokuwelda

Umngxunya osembindini wephedi kufuneka ubemkhulu kancinane kune-lead lead yedivayisi. Iphedi enkulu kakhulu kulula ukwenza iwelding ebonakalayo. Ububanzi bePad engaphandle D ubukhulu bayo abukho ngaphantsi kwe (D +1.2) mm, apho D yindawo evulekileyo yokukhokela. Ukujikeleza kweesekethe zedijithali ezixineneyo, ubuncinci bepali enqwenelekayo (D +1.0) mm.

PCB kunye neesekethe amanyathelo anti-uphazamiseko

Uyilo oluchasene nokuphazamiseka kwibhodi yesekethe eprintiweyo isondele kakhulu kwisekethe ethile. Nazi iindlela ezimbalwa ezichaziweyo zoyilo lokuchasana ne-PCB ezichaziweyo.

1. Uyilo lwentambo yamandla

Ngokobungakanani bebhodi yesekethe eprintiweyo yangoku, kangangoko kunokwenzeka ukwandisa ububanzi belayini yamandla, ukunciphisa ukuxhathisa kweluphu. Ngaxeshanye. Yenza intambo yombane. Isalathiso socingo lomhlaba luyahambelana nolwalathiso lwedatha, enceda ekunyuseni ingxolo.

2. Uyilo oluninzi

Umgaqo woyilo lwentambo yomhlaba zezi:

(1) Umhlaba wedijithali wahlulwe kumhlaba we-analog. Ukuba kukho zombini logic kunye nokujikeleza komjikelo kwibhodi yesekethe, zigcine zahlulwe kangangoko kunokwenzeka. Umhlaba wesekethe esezantsi-frequency kufuneka wamkele inqaku elinye lokumisa emhlabeni ngokusemandleni. Xa ii-wiring zoqobo zinzima, inxenye yesekethe inokudityaniswa kuthotho kwaye emva koko ukungqinelana okufanayo. Isiphaluka sokuhamba rhoqo kufuneka sisebenzise uthotho lwamanqaku amaninzi, isiseko kufuneka sibe sifutshane kunye nerenti, izinto ezihamba rhoqo ezijikeleze kangangoko kunokwenzeka kunye nommandla omkhulu wefoyile yegridi.

(2) Ucingo olusezantsi kufuneka lube lukhulu kangangoko. Ukuba umgca womhlaba mde kakhulu, isiseko sokutshintsha okunokubakho kungoku, ukuze ukusebenza okuchasene nengxolo kuncitshiswe. Ucingo olusezantsi kufuneka lubengqindilili ukuze lukwazi ukugqitha amaxesha amathathu izinto ezikhoyo kwibhodi eprintiweyo. Ukuba kunokwenzeka, intambo yomhlaba kufuneka ibe nkulu kune-2 mm ukuya kwi-3mm.

(3) Ucingo olungumhlaba luba ngumngxuma ovaliweyo. Uninzi lwebhodi eshicilelweyo eyakhiwe kuphela yisekethe yedijithali inokuphucula amandla okulwa nengxolo yesekethe yomhlaba.

3. Ukucutha uqwalaselo lwe-capacitor

Enye yeendlela eziqhelekileyo kuyilo lwe-PCB kukuhambisa ii-capacitor ezifanelekileyo zokucoca kwindawo nganye kwibhodi eprintiweyo. Umgaqo ngokubanzi wokumiswa kwe-capacitor decoupling yile:

(1) Isiphelo segalelo lamandla sinxibelelene ne-electrolytic capacitor ye-10 ~ 100uF. Ukuba kunokwenzeka, kungcono ukudibanisa i-100uF okanye ngaphezulu.

(2) ngokomgaqo, i-chip nganye ye-IC kufuneka ixhotyiswe nge-0.01pF ceramic capacitor. Ukuba indawo yebhodi eprintiweyo ayonelanga, i-1 ~ 10pF capacitor inokucwangciswa ngeetshiphusi ezi-4 ~ 8.

(3) Isakhono sokulwa nengxolo sibuthathaka. Izixhobo ezinamandla amakhulu otshintsho ngexesha lokucima, njenge-RAM.Izixhobo zeememori ze-ROM, i-capacitor decoupling kufuneka idityaniswe ngqo phakathi komgca wamandla kunye nomgca womhlaba we-chip.

(4) Isikhokelo se-capacitor asinakuba side kakhulu, ngakumbi isantya esiphezulu sokudlula kwi-capacitor asinakho ukukhokela. Ukongeza, la manqaku mabini alandelayo kufuneka aqatshelwe:

(1 Kukho umnxibelelanisi kwibhodi eprintiweyo. Ukudlulisa. Ukukhutshwa kwentlantsi enkulu kuya kwenziwa xa kusetyenziswa amaqhosha kunye nezinye izinto, kwaye isekethe ye-RC eboniswe kumzobo oqhotyoshelweyo kufuneka isetyenziselwe ukufunxa ukuphuma ngoku. Ngokubanzi, R yi-1 ~ 2K, kunye no-C ngu-2.2 ~ 47UF.

I-impedance yegalelo le-2CMOS iphezulu kakhulu kwaye inovakalelo, ngenxa yoko isiphelo esingasetyenziswanga kufuneka sibekiwe okanye siqhagamshelwe kunikezelo lwamandla.