Qanday dizayn qilish kerak 4 qatlamli PCB g’aram

Nazariy jihatdan uchta variant mavjud.

1-tartib:

A power supply layer, a ground layer and two signal layers are arranged as follows:

TOP (signal qatlami); L2 (shakllanishi); L3 (quvvat manbai qatlami); BOT (signal layer).

2-dastur:

A power supply layer, a ground layer and two signal layers are arranged as follows:

TOP (power supply layer); L2 (signal qatlami); L3 (Signal layer; BOT (birinchi qavat).

3-reja:

A power supply layer, a ground layer and two signal layers are arranged as follows:

TOP (signal qatlami); L2 (quvvat qatlami); L3 (connecting strata); BOT (signal layer).

Signal qatlami

The ground floor

elektr

Signal qatlami

Ushbu uchta variantning afzalliklari va kamchiliklari qanday?

1 -protsedura, PCB dizaynining to’rtta qatlamining asosiy to’plami, komponentlar yuzasi tagida zamin mavjud, asosiy signal eng yaxshi qatlamdir; Qatlamning qalinligi sozlamalari uchun quyidagi tavsiyalar tavsiya qilinadi: Empedansni boshqarish yadro plitalari (GND – POWER) POWER manbai va topraklanmasının taqsimlangan empedansini kamaytirish uchun juda qalin bo’lmasligi kerak; Ensure power plane decoupling.

Procedure 2, in order to achieve a certain shielding effect, the power supply and grounding are placed on the TOP and BOTTOM layers. However, the program must achieve the desired masking effect. Hech bo’lmaganda quyidagi kamchiliklar mavjud:

1, elektr ta’minoti va tuproq juda uzoq. Samolyotning empedansi juda katta.

2, komponentlar yostig’ining ta’siri tufayli, elektr ta’minoti va topraklama juda to’liq emas. Yo’naltiruvchi yuzasi to’liq bo’lmaganligi sababli signal impedansi uziladi.

Amalda, eritmaning elektr ta’minoti va topraklanmasını sirtga o’rnatilgan qurilmalar ko’pligi sababli to’liq mos yozuvlar tekisligi sifatida ishlatish qiyin. Kutilgan himoya effekti juda yaxshi. Amalga oshirish qiyin; Uning ishlatilishi cheklangan. Biroq, bu bitta elektron kartada qatlamlarni o’rnatishning eng yaxshi usuli.

3 -protseduraga o’xshash 1 -protsedura asosiy uskunalar BOTTOM yoki tayanch signal simlari bilan yotqizilgan hollarda qo’llaniladi.