Ibhodi PCB I-electro-golide ifumana igolide nge-electrolysis, ngelixa igolide yeekhemikhali ifumana igolide ngokusabela kokunciphisa imichiza!

Ngamafutshane, PCB electroplating yegolide, njengenye iPCB electroplating, ifuna amandla kunye nesilungisi. Kukho iintlobo ezininzi zeenkqubo, eziquka i-cyanide-containing, i-non-cyanide systems, kunye ne-non-cyanide systems, ezifana nohlobo lwe-citric acid kunye nohlobo lwe-sulfite. Zonke iinkqubo non-cyanide zisetyenziswa kushishino PCB.

Igolide yekhemikhali (i-electroless gold plating) ayifuni ukuba inikwe amandla, ibeka igolide ebhodini ngokusabela kweekhemikhali kwisisombululo.

Baneengenelo zabo kunye nezingeloncedo zabo. Ukongeza kwi-power-on kodwa ingabikho amandla, ibhodi yePCB inokwenziwa ngqindilili kakhulu, nje ukuba ixesha landisiwe, ifanelekile kwiibhodi ezidibanisayo. Ithuba lokuba iPCB yokuvelisa i-electro-gold potion ilahlwe lincinci kunelo lekhemikhali yegolide. Nangona kunjalo, igolide yombane yePCB kufuneka idityaniswe kwibhodi yonke, kwaye ayifanelekanga kwimigca ebhityileyo ngokukodwa.

Igolide yekhemikhali incinci kakhulu (ngaphantsi kwe-0.2 microns), kwaye ukucoceka kwegolide kuphantsi. Ulwelo olusebenzayo lunokulahlwa kuphela xa lusetyenziswe kwinqanaba elithile.

Enye yi-PCB electroplating ukwenza igolide ye-nickel

Enye kukusetyenziswa kwe-sodium hypophosphite’s own reduction reaction reaction to make the nickel layer, and substitution reaction to form the gold layer (I-Uemura’s (TSB71 inegolide ezincitshisiweyo)), eyindlela yekhemikhali.

Ivy: Ukongeza kumahluko wenkqubo phakathi kwe-PCB yokufakwa kwe-electroplating kunye negolide yokuntywiliselwa, kukho lo mahluko ulandelayo:

I-PCB electroplating igolide umaleko uyajiya kwaye unzima, ngoko ke idla ngokusetyenziselwa ukuplaga rhoqo kunye nokufaka iindawo ezityibilikayo, njengeminwe yegolide yamakhadi okutshintsha;

Igolide yokuntywiliselwa ilungele ukunyuswa ngenxa yomphezulu othe tyaba wepadi kwaye ikwasetyenziselwa ukuthengisela okungenalothe.