PCB ibhodi electro-gold obtains gold through electrolysis, while chemical gold obtains gold through chemical reduction reaction!

Simply put, PCB electroplating gold, like other PCB electroplating, requires power and a rectifier. There are many kinds of processes, including cyanide-containing, non-cyanide systems, and non-cyanide systems, such as citric acid type and sulfite type. All non-cyanide systems are used in the PCB industry.

Igolide lamakhemikhali (i-electroless gold plating) alidingi ukunikwa amandla, lifaka igolide ebhodini ngokusabela kwamakhemikhali esixazululweni.

Banezinzuzo zabo siqu kanye nokubi. Ngaphezu kokuvula amandla kodwa hhayi amandla, ibhodi le-PCB lingenziwa libe likhulu kakhulu, inqobo nje uma isikhathi sinwetshiwe, lifanele amabhodi okubopha. Ithuba lokuthi i-PCB yokukhiqiza i-electro-gold potion ilahlwe mancane kunalelo legolide lamakhemikhali. Nokho, igolide likagesi le-PCB lidinga ukuxhunywa kulo lonke ibhodi, futhi alifanele imigqa emincane kakhulu.

Igolide lamakhemikhali ngokuvamile lincane kakhulu (lingaphansi kwama-microns angu-0.2), futhi ubumsulwa begolide buphansi. Uketshezi olusebenzayo lungalahlwa kuphela uma lusetshenziswe ngezinga elithile.

Enye i-PCB electroplating ukwenza igolide le-nickel

Enye iwukusetshenziswa kwe-sodium hypophosphite’s own oxidation-reduction reaction ukuze kwakhe ungqimba lwe-nickel, kanye nokusabela esikhundleni sokwenza ungqimba lwegolide (I-Uemura’s (TSB71 inegolide elizinciphisile)), okuyindlela yamakhemikhali.

I-Ivy: Ngaphezu komehluko wenqubo phakathi kwe-PCB electroplating negolide lokucwiliswa, kunomehluko olandelayo:

I-PCB electroplating ungqimba lwegolide lushubile futhi luqinile, ngakho-ke ngokuvamile lusetshenziselwa ukuxhuma nokufaka izingxenye ezishelelayo, njengeminwe yegolide yamakhadi okushintsha;

Igolide lokucwiliswa lilungele ukugxunyekwa ngenxa yendawo eyisicaba yephedi futhi liphinde lisetshenziswe ekuhlanganiseni okunganomthofu.