1 Aikace-aikacen katako na Laser

Maɗaukakin girma Kwamitin PCB wani nau’i ne mai nau’i-nau’i da yawa, wanda aka rabu da shi ta hanyar insulating resin gauraye da kayan fiber gilashi, kuma an saka wani nau’i na nau’i na takarda na jan karfe a tsakanin su. Sa’an nan kuma a yi laminate da kuma bonded. Hoto na 1 yana nuna sashe na allo mai Layer 4. Ka’idar sarrafa Laser ita ce yin amfani da katako na Laser don mayar da hankali kan saman PCB don narke nan take da vaporize kayan don samar da ƙananan ramuka. Tunda jan karfe da guduro abubuwa ne daban-daban guda biyu, zafin narkar da foil ɗin tagulla shine 1084 ° C, yayin da zafin narkewa na guduro mai rufewa shine kawai 200-300 ° C. Sabili da haka, ya zama dole a zaɓi da kyau da kuma sarrafa daidaitattun sigogi kamar tsayin katako, yanayi, diamita, da bugun jini lokacin da ake amfani da hakowa ta Laser.

1.1 Tasirin tsayin tsayin katako da yanayi akan aiki

Mene ne aikace-aikace na Laser aiki a high-yawa PCB masana’antu

Hoto 1 Duban sashe na PCB mai Layer 4

Ana iya gani daga Hoto na 1 cewa Laser shine farkon aiwatar da foil ɗin tagulla lokacin da ake zugawa, kuma yawan ɗaukar jan ƙarfe zuwa Laser yana ƙaruwa tare da haɓaka tsayin raƙuman ruwa. Adadin sha Laser YAG/UV na 351 zuwa 355 m ya kai 70%. Ana iya amfani da laser YAG/UV ko hanyar abin rufe fuska don lalata allunan bugu na yau da kullun. Domin ƙara haɗin PCB mai girma, kowane Layer na takarda na jan karfe yana da 18μm kawai, kuma resin substrate a ƙarƙashin foil na jan karfe yana da babban adadin laser carbon dioxide (kimanin 82%), wanda ke ba da yanayi don aikace-aikacen. na carbon dioxide Laser perforation. Domin yawan jujjuyawar photoelectric da ingancin sarrafa laser carbon dioxide ya fi na laser YAG/UV girma, muddin akwai isasshen makamashin katako kuma ana sarrafa foil ɗin tagulla don ƙara yawan sha na Laser, carbon dioxide laser. ana iya amfani dashi don buɗe PCB kai tsaye.

Yanayin juzu’i na katako na Laser yana da tasiri mai girma akan kusurwar banbanta da makamashi na laser. Domin samun isassun makamashin katako, wajibi ne a sami yanayin fitarwa mai kyau. Matsayin da ya dace shine samar da yanayin yanayin Gaussian mai ƙarancin tsari kamar yadda aka nuna a cikin Hoto 2. Ta wannan hanyar, ana iya samun ƙarfin makamashi mai yawa, wanda ke ba da buƙatun don katako ya kasance mai kyau a kan ruwan tabarau.

Mene ne aikace-aikace na Laser aiki a high-yawa PCB masana’antu

Hoto 2 Rarraba makamashin yanayin Gaussian mai rahusa

Za’a iya samun yanayin ƙananan oda ta hanyar gyaggyara sigogi na resonator ko shigar da diaphragm. Kodayake shigarwa na diaphragm yana rage yawan fitarwa na makamashin katako, zai iya ƙayyade yanayin laser mai girma don shiga cikin ɓarna kuma yana taimakawa wajen inganta zagaye na ƙananan rami. .

1.2 Samun micropores

Bayan an zaɓi tsayin tsayi da yanayin katako, don samun rami mai kyau akan PCB, dole ne a sarrafa diamita na wurin. Sai kawai idan diamita na wurin yana da ƙananan isa, makamashi zai iya mayar da hankali kan zubar da farantin. Akwai hanyoyi da yawa don daidaita diamita ta tabo, musamman ta hanyar mai da hankali kan ruwan tabarau. Lokacin da katakon yanayin Gaussian ya shiga cikin ruwan tabarau, diamita tabo akan jirgin saman baya na ruwan tabarau za a iya ƙididdige shi da wannan dabara:

D≈λF/ (πd)

A cikin dabara: F shine tsayin mai da hankali; d shine radius tabo na katakon Gaussian wanda mutum yayi hasashe akan saman ruwan tabarau; λ shine tsawon zangon Laser.

Ana iya gani daga dabarar cewa girman diamita na abin da ya faru, ƙarami wurin mayar da hankali. Lokacin da aka tabbatar da wasu sharuɗɗa, rage tsawon tsayin daka yana da amfani don rage diamita na katako. Koyaya, bayan an gajarta F, an rage nisa tsakanin ruwan tabarau da kayan aikin. Slag na iya fantsama a saman ruwan tabarau yayin hakowa, wanda zai shafi tasirin hakowa da rayuwar ruwan tabarau. A wannan yanayin, ana iya shigar da na’urar taimako a gefen ruwan tabarau kuma ana amfani da iskar gas. Yi tsarkakewa.

1.3 Tasirin bugun bugun katako

Ana amfani da Laser mai nau’in bugun jini da yawa don hakowa, kuma ƙarfin ƙarfin Laser ɗin da aka buga dole ne aƙalla ya kai zafin ƙafewar tagulla. Saboda makamashi na Laser-pulse guda daya ya raunana bayan konewa ta hanyar tagulla na jan karfe, ba za a iya kawar da substrate mai mahimmanci yadda ya kamata ba, kuma yanayin da aka nuna a cikin siffa 3a za a kafa, ta yadda ba za a iya kafa ta hanyar rami ba. Duk da haka, makamashin katako bai kamata ya yi girma ba lokacin da ake bugawa, kuma makamashi yana da yawa. Bayan an shigar da jakar tagulla, zubar da substrate zai yi girma sosai, wanda zai haifar da yanayin da aka nuna a cikin Hoto na 3b, wanda ba shi da kyau ga bayan aiwatar da tsarin kewayawa. Ya fi dacewa don samar da ƙananan ramuka tare da ƙirar rami mai ɗanɗano kamar yadda aka nuna a hoto 3c. Wannan ƙirar ramin na iya ba da dacewa ga aikin da aka yi na jan karfe na gaba.

Mene ne aikace-aikace na Laser aiki a high-yawa PCB masana’antu

Hoto na 3 Nau’in ramukan da ake sarrafa su ta hanyar laser makamashi daban-daban

Domin cimma tsarin ramin da aka nuna a cikin Hoto na 3c, ana iya amfani da nau’in igiyar igiyar Laser da ke da tsayin gaba (Hoto na 4). Ƙarfin bugun jini mafi girma a ƙarshen gaba zai iya kawar da foil na jan karfe, kuma nau’in nau’i na nau’i mai yawa tare da ƙananan makamashi a ƙarshen baya zai iya kawar da substrate mai rufewa kuma Ya sa ramin ya zurfafa har sai ƙananan tagulla.

Mene ne aikace-aikace na Laser aiki a high-yawa PCB masana’antu

Hoto 4 Pulse Laser waveform

2 Tasirin katako na Laser

Saboda kayan kayan aikin ƙarfe na jan karfe da substrate sun bambanta sosai, katako na laser da kayan aikin kewayawa suna hulɗa da juna don samar da tasiri iri-iri, waɗanda ke da tasiri mai mahimmanci akan budewa, zurfin, da nau’in rami na micropores.

2.1 Tunani da sha na Laser

Ma’amala tsakanin Laser da PCB na farko yana farawa ne daga abin da ya faru na Laser da aka nuna da kuma shanye shi ta hanyar bangon jan karfe a saman. Saboda foil ɗin jan ƙarfe yana da ƙarancin ɗaukar nauyin infrared carbon dioxide laser, yana da wahala a sarrafa shi kuma ingancin yana da ƙasa sosai. Bangaren makamashin hasken da ke shanyewa zai ƙara yawan kuzarin motsa jiki na lantarki na kayan foil ɗin tagulla, kuma mafi yawansu za su zama ƙarfin zafi na foil ɗin tagulla ta hanyar hulɗar electrons da crystal lattices ko ions. Wannan yana nuna cewa yayin da yake inganta ingancin katako, wajibi ne don aiwatar da maganin da aka rigaya a saman murfin tagulla. Za a iya lulluɓe saman murfin tagulla tare da kayan da ke ƙara ɗaukar haske don ƙara yawan ɗaukar hasken laser.

2.2 Matsayin tasirin katako

A lokacin sarrafa Laser, hasken hasken yana haskaka kayan foil ɗin tagulla, kuma foil ɗin tagulla yana dumama zuwa tururi, kuma zafin tururi yana da girma, wanda ke da sauƙin rushewa da ionize, wato, plasma mai ɗaukar hoto yana haifar da motsin haske. . Plas ɗin da aka haifar da hoto gabaɗaya plasma ce ta tururin abu. Idan makamashin da ake watsawa zuwa kayan aikin ta plasma ya fi asarar makamashin hasken da aka samu ta hanyar aikin aikin da ya haifar da sha na plasma. A maimakon haka, plasma yana haɓaka ɗaukar makamashin Laser ta wurin aikin aikin. In ba haka ba, plasma yana toshe Laser kuma yana raunana shayar da Laser ta wurin aikin. Don Laser carbon dioxide, plasma da aka haifar da hoto na iya ƙara yawan ɗaukar foil na jan karfe. Duk da haka, da yawa plasma zai sa katako ya rabu da shi lokacin wucewa, wanda zai shafi daidaitattun matsayi na rami. Gabaɗaya, ƙarfin ƙarfin laser ana sarrafa shi zuwa ƙimar da ta dace ƙasa da 107 W/cm2, wanda zai iya sarrafa plasma mafi kyau.

Tasirin pinhole yana taka muhimmiyar rawa wajen haɓaka haɓakar kuzarin haske a cikin aikin hakowa na Laser. Laser ya ci gaba da kawar da substrate bayan ya ƙone ta cikin jakar tagulla. Matsakaicin na iya ɗaukar babban adadin kuzarin haske, da ƙarfi da ƙarfi da faɗaɗawa, kuma matsa lamba da aka haifar na iya zama narkakkar kayan ana jefar da su don samar da ƙananan ramuka. Hakanan ƙaramin rami yana cike da plasma da aka haifar da hoto, kuma makamashin Laser da ke shiga cikin ƙaramin rami zai iya kusan cika shi ta hanyar tunani da yawa na bangon rami da aikin plasma (Hoto 5). Saboda shayarwar plasma, ƙarfin wutar lantarki da ke wucewa ta cikin ƙaramin rami zuwa kasan ƙaramin ramin zai ragu, kuma ƙarfin wutar lantarki a ƙasan ƙaramin rami yana da mahimmanci don samar da wani matsa lamba na vaporization don kula da wani zurfin zurfin. ƙananan rami, wanda ke ƙayyade zurfin shigar da tsarin mashin ɗin.

Mene ne aikace-aikace na Laser aiki a high-yawa PCB masana’antu

Hoto 5 Tunanin Laser a cikin rami

Kammalallen 3

A aikace-aikace na Laser aiki fasahar iya ƙwarai inganta hakowa yadda ya dace na high-yawa PCB micro-ramuka. Gwaje-gwaje sun nuna cewa: ①Haɗe da fasahar sarrafa lambobi, ana iya sarrafa fiye da ƙananan ramuka 30,000 a cikin minti ɗaya akan allon buga, kuma buɗewar yana tsakanin 75 da 100; ② Aikace-aikacen Laser UV na iya ƙara sanya buɗaɗɗen ƙasa da 50μm ko ƙarami, wanda ke haifar da yanayi don ƙara faɗaɗa sararin amfani da allon PCB.