1 Kushandiswa kwelaser beam

The high-density Pcb bhodhi is a multi-layer structure, iyo inoparadzaniswa ne insulating resin yakasanganiswa negirazi fiber zvinhu, uye conductive layer yemhangura foil inoiswa pakati pavo. Zvadaro iyo laminated uye yakasungwa. Mufananidzo 1 unoratidza chikamu che 4-layer board. Iyo musimboti welaser processing ndeye kushandisa laser matanda kutarisa pamusoro pePCB kuti inyunguduke ipapo nekunyungudutsa zvinhu kuita maburi madiki. Sezvo mhangura neresin zvinhu zviviri zvakasiyana, tembiricha yekunyunguduka yefoil yemhangura i1084 ° C, nepo tembiricha yekunyungudika ye insulating resin ingori 200-300 ° C. Naizvozvo, zvinodikanwa kusarudza zvine musoro uye kunyatso kudzora ma paramita senge beam wavelength, modhi, dhayamita, uye pulse kana laser drilling ikaiswa.

1.1 Kupesvedzera kwebeam wavelength uye modhi pakugadzirisa

Ndeapi mashandisirwo e laser processing mune yakakwira-density PCB kugadzira

Mufananidzo 1 Muchinjikwa-chikamu maonero e4-layer PCB

Zvinogona kuonekwa kubva kuMufananidzo 1 kuti laser inotanga kugadzirisa foil yemhangura painoputika, uye chiyero chekunyura kwemhangura kune laser inowedzera nekuwedzera kwewavelength. Iyo YAG/UV laser absorption rate ye351 kusvika 355 m yakakwira se70%. YAG/UV laser kana conformal mask nzira inogona kushandiswa kupaza akajairwa akadhindwa mabhodhi. Kuti uwedzere kubatanidzwa kwe-high-density PCB, imwe neimwe yemhangura foil inongova 18μm, uye resin substrate pasi pefoil yemhangura ine yakanyanya kunyura mwero wecarbon dioxide laser (inenge 82%), iyo inopa mamiriro ekushandisa. ye carbon dioxide laser perforation. Nekuti iyo photoelectric shanduko yekuchinja uye kushanda kwayo kwekabhoni dioxide laser yakakwira zvakanyanya kupfuura yeYAG/UV laser, chero paine simba rakakwana resimbi uye foil yemhangura inogadziriswa kuti iwedzere kunyudzwa kwayo kwelaser, iyo carbon dioxide laser. inogona kushandiswa kuvhura zvakananga PCB.

Iyo transverse mode modhi yelaser beam ine simba rakakura pane divergence angle uye simba rekubuda kwelaser. Kuti uwane simba rakakwana resimbi, zvinodikanwa kuve neyakanaka beam yekubuda mode. Mamiriro akakodzera ndeyekuumba yakaderera-yakarongeka Gaussian mode yakabuda sezvinoratidzwa muMufananidzo 2. Nenzira iyi, simba rakawanda rinogona kuwanikwa, iro rinopa chinodiwa kuti danda rinyatsotariswa pane lens.

Ndeapi mashandisirwo e laser processing mune yakakwira-density PCB kugadzira

Mufananidzo 2 Yakaderera-inodhura Gaussian modhi yekugovera simba

Iyo yakaderera-yakarongeka modhi inogona kuwanikwa nekugadzirisa iyo parameter ye resonator kana kuisa diaphragm. Kunyangwe kuisirwa diaphragm kuchidzikisa kubuda kwesimba resimbi, inogona kudzikamisa iyo yepamusoro-yakarongeka mode laser kutora chikamu mukuboora uye kubatsira kuvandudza kutenderera kwegomba diki. .

1.2 Kuwana micropores

Mushure mekunge wavelength uye maitiro edanda zvasarudzwa, kuti uwane gomba rakakodzera paPCB, dhayamita yenzvimbo yacho inofanirwa kudzorwa. Chete kana dhayamita yenzvimbo iri diki zvakakwana, simba rinogona kutarisisa pakubvisa ndiro. Kune nzira dzakawanda dzekugadzirisa dhayamita yenzvimbo, kunyanya kuburikidza nespherical lens inotarisa. Kana iyo Gaussian modhi danda ichipinda mulenzi, iyo dhayamita yekumashure yakatarisana nendege yelens inogona kuverengerwa neinotevera fomula:

D≈λF/(πd)

Muchirevo: F ndiyo yakatarisa kureba; d ndiyo nzvimbo yeradius yeGaussian danda rinoratidzwa nemunhu ari pamusoro pe lens; λ ndiyo laser wavelength.

Zvinogona kuvonekwa kubva kuformula kuti iyo yakakura dhayamita yechiitiko, idiki iyo yakatariswa nzvimbo. Kana mamwe mamiriro akasimbiswa, kupfupisa kureba kwefocal kunobatsira kuderedza dhayamita yedanda. Zvisinei, mushure mokunge F yakapfupiswa, chinhambwe pakati pe lens uye workpiece chakaderedzwa zvakare. Iyo slag inogona kupfachukira pamusoro peiyo lens panguva yekuchera, izvo zvinokanganisa maitiro ekuchera uye hupenyu hwelens. Muchiitiko ichi, chigadzirwa chekubatsira chinogona kuiswa padivi re lens uye gasi rinoshandiswa. Ita purge.

1.3 Pesvedzero yebeam pulse

Iyo yakawanda-pulse laser inoshandiswa kuchera, uye iyo simba density ye pulsed laser inofanirwa kusvika kusvika pakupisa kwekupisa kwefoiri yemhangura. Nemhaka yokuti simba re-single-pulse laser rave risina simba mushure mekupisa kuburikidza nemhangura yemhangura, iyo substrate iri pasi haigoni kunyatsogadziriswa, uye mamiriro anoratidzwa muFig. 3a achaumbwa, kuitira kuti kuburikidza negomba haigoni kuumbwa. Zvisinei, simba redanda harifaniri kunge rakanyanyisa kana richirova, uye simba racho rakanyanyisa. Mushure mokunge mhangura yemhangura inopinda, kubviswa kwe substrate kuchave kwakakura zvikuru, zvichiita kuti mamiriro ezvinhu anoratidzwa mumufananidzo 3b, izvo zvisingabatsiri kune post-processing yebhodhi redunhu. Inonyanya kunaka kuumba ma micro-holes ane zvishoma tapered buri pateni sezvinoratidzwa muFig. 3c. Iyi gomba pateni inogona kupa nyore kune inotevera mhangura-plating maitiro.

Ndeapi mashandisirwo e laser processing mune yakakwira-density PCB kugadzira

Mufananidzo 3 Hole mhando dzakagadziriswa neasiyana simba lasers

Kuti uwane iyo gomba pateni inoratidzwa muMufananidzo 3c, pulsed laser waveform ine peak yekumberi inogona kushandiswa (Mufananidzo 4). Iyo yakakwira pulse simba kumucheto wepamberi inogona kupisa foil yemhangura, uye mapuruzi akawanda ane simba rakaderera kumucheto kumashure anogona kudzima iyo insulating substrate uye Ita kuti gomba ridzike kusvika yakadzika foil yemhangura.

Ndeapi mashandisirwo e laser processing mune yakakwira-density PCB kugadzira

Mufananidzo 4 Pulse laser waveform

2 Laser beam effect

Nekuti zvinhu zvemukati zvefoiri yemhangura uye substrate zvakasiyana zvakanyanya, iyo laser danda uye redunhu bhodhi zvinhu zvinopindirana kugadzira akasiyana mhedzisiro, ane yakakosha kukanganisa pakuvhura, kudzika, uye gomba mhando yemakropores.

2.1 Kufungidzira uye kutorwa kwelaser

Kudyidzana pakati pelaser nePCB kunotanga kunotanga kubva kune chiitiko laser chiri kuratidzwa uye kunyudzwa nefoiri yemhangura pamusoro. Nekuti iyo foil yemhangura ine yakaderera kunyura mwero we infrared wavelength kabhoni dioxide laser, zvakaoma kugadzirisa uye kushanda kwacho kwakadzikira zvakanyanya. Chikamu chakanyura chesimba rechiedza chichawedzera emahara erekitironi kinetic simba remhangura foil zvinhu, uye mazhinji acho anoshandurwa kuita kupisa kwesimba refoiri yemhangura kuburikidza nekudyidzana kwemaerekitironi nemakristaro lattices kana maion. Izvi zvinoratidza kuti paunenge uchivandudza mhando yedanda, zvinodikanwa kuita pre-kurapwa pamusoro peiyo foil yemhangura. Pamusoro pefoiri yemhangura inogona kuputirwa nezvinhu zvinowedzera kunyura kwechiedza kuti iwedzere kunyudzwa kwayo kwelaser light.

2.2 Basa rekuita beam

Munguva yekugadziriswa kwelaser, mwenje wemwenje unopenya iyo yemhangura foil zvinhu, uye iyo yemhangura foil inopisa kuti ive vaporization, uye tembiricha yehutsi yakakwira, iri nyore kuputsa uye ionize, kureva kuti, plasma-inokonzeresa inogadzirwa nekunakidzwa kwechiedza. . Iyo foto-induced plasma inowanzova plasma yehupfu hwezvinhu. Kana simba rinotumirwa kune workpiece ne plasma yakakura kudarika kurasikirwa kwesimba rechiedza rinogamuchirwa ne workpiece inokonzerwa nekutorwa kweplasma. Iyo plasma pachinzvimbo inosimudzira kutorwa kwelaser simba neiyo workpiece. Zvikasadaro, iyo plasma inovhara iyo laser uye inonetesa kutorwa kwelaser neiyo workpiece. Kune carbon dioxide lasers, photo-induced plasma inogona kuwedzera kunyura kwemhangura foil. Nekudaro, yakawandisa plasma ichaita kuti danda ridzoke kana richipfuura, izvo zvinokanganisa kumira kwegomba. Kazhinji, iyo laser simba density inodzorwa kune yakakosha kukosha pazasi 107 W/cm2, iyo inogona kudzora zvirinani plasma.

Iyo pinhole mhedzisiro inoita basa rakakosha zvakanyanya mukusimudzira kunyudzwa kwesimba rechiedza muiyo laser drilling process. Iyo laser inoenderera mberi nekudzima iyo substrate mushure mekupisa kuburikidza nefoiri yemhangura. Iyo substrate inogona kutora huwandu hukuru hwesimba rechiedza, nechisimba vaporize uye kuwedzera, uye kudzvanywa kunogadzirwa kunogona kuve Iyo yakanyungudutswa inokandwa kunze kuumba maburi madiki. Iyo buri diki inozadzwawo nephoto-induced plasma, uye iyo laser simba inopinda mugomba diki inogona kunge yakanyatso kunyudzwa neakawanda maratidziro emadziro egomba uye chiito cheplasma (Mufananidzo 5). Nekuda kwekunyudzwa kweplasma, iyo laser simba density inopfuura nepaburi diki kusvika pasi pegomba diki inoderera, uye iyo laser simba density pazasi pegomba diki yakakosha kuburitsa imwe vaporization pressure kuchengetedza imwe kudzika kwe. iyo buri diki, iyo inosarudza Kudzika kwekupinda kweiyo machining process.

Ndeapi mashandisirwo e laser processing mune yakakwira-density PCB kugadzira

Mufananidzo 5 Laser refraction mugomba

3 Mhedziso

Iko kushandiswa kwelaser processing tekinoroji kunogona kuvandudza zvakanyanya kudhirowa kweakakwira-density PCB madiki maburi. Ongororo dzinoratidza kuti: ① Yakasanganiswa nenhamba yekudzora tekinoroji, anopfuura 30,000 madiki maburi anogona kugadziriswa paminiti pabhodhi rakadhindwa, uye aperture iri pakati pe75 ne100; ② Kushandiswa kweUV laser kunogona kuita kuti aperture isasvike 50μm kana idiki, izvo zvinogadzira mamiriro ekuwedzera kuwedzera nzvimbo yekushandisa yePCB mabhodhi.