1 Ukusetshenziswa kwe-laser beam

I-high-density PCB ibhodi iyisakhiwo esinezingqimba eziningi, esihlukaniswa nge-resin evikelayo exutshwe nezinto ze-fiber yengilazi, futhi ungqimba olusebenzayo lwe-foil yethusi lufakwa phakathi kwabo. Khona-ke i-laminated futhi iboshwe. Umfanekiso 1 ubonisa ingxenye yebhodi enezingqimba ezi-4. Umgomo wokucutshungulwa kwe-laser ukusebenzisa imishayo ye-laser ukugxila ebusweni be-PCB ukuze incibilike ngokushesha futhi ihwamulise into ukuze yakhe izimbobo ezincane. Njengoba ithusi ne-resin kuyizinto ezimbili ezihlukene, izinga lokushisa elincibilikayo le-foil yethusi lingu-1084 ° C, kuyilapho izinga lokushisa elincibilikayo le-resin evikelayo lingama-200-300 ° C kuphela. Ngakho-ke, kuyadingeka ukukhetha ngokunengqondo futhi ulawule ngokunembile imingcele efana nobude be-beam, imodi, ububanzi, kanye ne-pulse lapho kusetshenziswa ukumba i-laser.

1.1 Umthelela we-beam wavelength nemodi ekucutshungulweni

Yiziphi izinhlelo zokusebenza zokucutshungulwa kwe-laser ekukhiqizeni i-PCB ephezulu kakhulu

Umfanekiso 1 Ukubuka kwe-cross-sectional ye-PCB enezingqimba ezi-4

Kungabonakala kuMfanekiso 1 ukuthi i-laser iqala ukucubungula i-foil yethusi lapho ibhoboza, futhi izinga lokumunca ithusi ku-laser liyakhula ngokukhula kwe-wavelength. Izinga lokumuncwa kwe-laser ye-YAG/UV lika-351 kuya ku-355 m liphezulu njenge-70%. Ilaser ye-YAG/UV noma indlela yemaski ehlelekile ingasetshenziswa ukubhoboza amabhodi aphrintiwe ajwayelekile. Ukuze kwandiswe ukuhlanganiswa kwe-PCB ephezulu kakhulu, ungqimba ngalunye lwe-foil yethusi luyi-18μm kuphela, futhi i-resin substrate ngaphansi kwe-foil yethusi inezinga eliphezulu lokumuncwa kwe-carbon dioxide laser (cishe i-82%), ehlinzeka ngezimo zohlelo lokusebenza. i-carbon dioxide laser perforation. Ngenxa yokuthi izinga lokuguqulwa kwe-photoelectric kanye nokusebenza kahle kokucubungula kwe-carbon dioxide laser liphakeme kakhulu kunelaser ye-YAG/UV, inqobo nje uma kunamandla anele e-beam kanye ne-foil yethusi icutshungulwa ukuze kwandiswe izinga lokumuncwa kwe-laser, i-carbon dioxide laser. ingasetshenziswa ukuvula i-PCB ngokuqondile.

Imodi yemodi eguquguqukayo ye-laser beam inethonya elikhulu ku-engeli yokuhlukana kanye nokuphuma kwamandla kwe-laser. Ukuze uthole amandla anele e-beam, kuyadingeka ukuba nemodi yokukhishwa kwe-beam enhle. Isimo esikahle siwukwenza ukukhishwa kwemodi ye-Gaussian esezingeni eliphansi njengoba kuboniswe kuMfanekiso 2. Ngale ndlela, umthamo omkhulu wamandla ungatholakala, ohlinzeka ngesidingo sokuba i-beam igxile kahle kwi-lens.

Yiziphi izinhlelo zokusebenza zokucutshungulwa kwe-laser ekukhiqizeni i-PCB ephezulu kakhulu

Umfanekiso 2 Ukusabalalisa amandla kwemodi ye-Gaussian enezindleko eziphansi

Imodi ye-oda eliphansi ingatholakala ngokushintsha imingcele ye-resonator noma ukufaka i-diaphragm. Nakuba ukufakwa kwe-diaphragm kunciphisa ukuphuma kwamandla e-beam, kungakhawulela i-laser yemodi ye-oda eliphezulu ukuze ibambe iqhaza ekubhobozeni futhi kusize ukuthuthukisa ukuzungeza kwembobo encane. .

1.2 Ukuthola ama-micropores

Ngemva kokukhethwa kwe-wavelength nemodi ye-beam, ukuze kutholwe imbobo ekahle ku-PCB, ububanzi bendawo kufanele bulawuleke. Kuphela uma ububanzi bendawo buncane ngokwanele, amandla angagxila ekuqothulweni kwepuleti. Kunezindlela eziningi zokulungisa ububanzi bendawo, ikakhulukazi ngokugxila kwilensi eyindilinga. Lapho i-beam yemodi ye-Gaussian ingena kulensi, ububanzi bendawo endizeni yangemuva egxilile yelensi ingabalwa cishe ngale fomula elandelayo:

D≈λF/(πd)

Kufomula: F ubude bokugxila; d irediyasi yendawo ye-Gaussian beam evezwa ngumuntu endaweni yelensi; λ ubude begagasi be-laser.

Kungabonakala kufomula ukuthi uma ubukhulu besigameko bukhulu, indawo okugxilwe kuyo incane. Uma ezinye izimo ziqinisekiswa, ukufushanisa ubude bokugxila kusiza ekwehliseni ububanzi be-beam. Kodwa-ke, ngemuva kokuthi u-F efinyeziwe, ibanga phakathi kwe-lens ne-workpiece nalo liyancishiswa. I-slag ingase ishaye phezu kwe-lens ngesikhathi sokumba, okuzothinta umphumela wokubhoboza nempilo ye-lens. Kulokhu, idivayisi yokusiza ingafakwa ohlangothini lwe-lens kanye negesi isetshenziswa. Yenza ukuhlanza.

1.3 Umthelela we-beam pulse

I-laser enama-pulse amaningi isetshenziselwa ukumba, futhi ukuminyana kwamandla we-laser pulsed kufanele okungenani kufinyelele izinga lokushisa lokuhwamuka kwefoyili yethusi. Ngenxa yokuthi amandla e-laser ye-pulse eyodwa abe buthakathaka ngemva kokushisa nge-foil yethusi, i-substrate engaphansi ayikwazi ukukhishwa ngokuphumelelayo, futhi isimo esiboniswe ku-Fig. 3a sizokwakhiwa, ukuze i-via hole ingakwazi ukwakhiwa. Kodwa-ke, amandla we-beam akufanele abe phezulu kakhulu lapho ushaya, futhi amandla aphezulu kakhulu. Ngemuva kokuthi i-foil yethusi ingene, ukuchithwa kwe-substrate kuyoba kukhulu kakhulu, okuholela esimweni esiboniswe ku-Figure 3b, esingahambisani nokucubungula kwebhodi lesifunda. Kuhle kakhulu ukwenza izimbobo ezincane ngephethini yembobo ethe shibhile kancane njengoba kuboniswe kumfanekiso 3c. Le phethini yembobo inganikeza ukunethezeka kwenqubo elandelayo ye-copper-plating.

Yiziphi izinhlelo zokusebenza zokucutshungulwa kwe-laser ekukhiqizeni i-PCB ephezulu kakhulu

Umfanekiso 3 Izinhlobo zezimbobo ezicutshungulwa ngamalaser ahlukene wamandla

Ukuze kuzuzwe iphethini yembobo ekhonjiswe ku-Figure 3c, i-pulsed laser waveform ene-front peak ingasetshenziswa (Umfanekiso 4). Amandla aphezulu we-pulse ekugcineni angashisa i-foil yethusi, futhi ama-pulses amaningi anamandla aphansi ekugcineni angashisa i-substrate evikelayo futhi Yenza imbobo ijule kuze kube i-foil yethusi ephansi.

Yiziphi izinhlelo zokusebenza zokucutshungulwa kwe-laser ekukhiqizeni i-PCB ephezulu kakhulu

Umfanekiso 4 Pulse laser waveform

2 Umphumela we-laser

Ngenxa yokuthi izinto ezibonakalayo ze-foil yethusi kanye ne-substrate zihluke kakhulu, i-laser beam kanye nezinto zebhodi lesifunda ziyasebenzisana ukuze zikhiqize imiphumela ehlukahlukene, enomthelela obalulekile ekungeneni, ukujula, kanye nohlobo lwembobo yama-micropores.

2.1 Ukubonakaliswa nokumuncwa kwe-laser

Ukusebenzisana phakathi kwe-laser ne-PCB kuqala kuqala kusukela ku-laser yesigameko eboniswa futhi imuncwe ucwecwe lwethusi olungaphezulu. Ngenxa yokuthi ucwecwe lwethusi lunezinga eliphansi kakhulu lokumunca le-infrared wavelength carbon dioxide laser, kunzima ukusetshenzwa futhi ukusebenza kahle kuphansi kakhulu. Ingxenye emuncwe yamandla okukhanya izokhuphula amandla e-electron kinetic amahhala ensimbi ye-foil yethusi, futhi iningi lawo lizoguqulwa libe amandla okushisa efoyili yethusi ngokusebenzisana kwama-electron nama-crystal lattices noma ama-ion. Lokhu kubonisa ukuthi ngenkathi kuthuthukiswa ikhwalithi ye-boam, kuyadingeka ukwenza ukwelashwa kwangaphambili ebusweni be-foil yethusi. Ingaphezulu le-foil yethusi lingagcotshwa ngezinto ezikhulisa ukumuncwa kokukhanya ukuze kwandiswe izinga lokumunca kokukhanya kwe-laser.

2.2 Indima yomphumela we-beam

Ngesikhathi sokucutshungulwa kwe-laser, i-light beam ikhipha i-copper foil, futhi i-foil yethusi iyashiswa ukuze i-vaporization, futhi izinga lokushisa le-steam liphezulu, okulula ukulihlephula futhi i-ionize, okungukuthi, i-plasma eyenziwe ngesithombe ikhiqizwa ukukhanya okukhanyayo. . I-plasma eyenziwe ngesithombe ngokuvamile iyi-plasma yomhwamuko wezinto ezibonakalayo. Uma amandla adluliselwa kucezu lokusebenza nge-plasma makhulu kunokulahlekelwa amandla okukhanya atholwe ucezu lokusebenza okubangelwa ukumuncwa kwe-plasma. I-plasma esikhundleni salokho ithuthukisa ukumuncwa kwamandla e-laser ngocezu lokusebenza. Uma kungenjalo, i-plasma ivimba i-laser futhi yenza buthaka ukumuncwa kwe-laser ngocezu lokusebenza. Kuma-lasers e-carbon dioxide, i-plasma eyenziwe ngesithombe ingakhuphula izinga lokumuncwa kwefoyili yethusi. Kodwa-ke, i-plasma eningi kakhulu izobangela ukuthi i-beam iguqulwe lapho idlula, okuzophazamisa ukunemba kokuma kwembobo. Ngokuvamile, ukuminyana kwamandla e-laser kulawulwa kunani elifanele elingaphansi kuka-107 W/cm2, elingalawula kangcono i-plasma.

Umthelela wephinifa udlala indima ebaluleke kakhulu ekuthuthukiseni ukumuncwa kwamandla okukhanya enqubweni yokumba i-laser. I-laser iyaqhubeka nokucisha i-substrate ngemva kokushiswa nge-foil yethusi. I-substrate ingakwazi ukumunca inani elikhulu lamandla okukhanya, ihwamuke ngobudlova futhi yandise, futhi ukucindezela okukhiqizwa kungaba Izinto ezincibilikisiwe ziphonswa ngaphandle ukuze zenze izimbobo ezincane. Imbobo encane iphinde igcwaliswe nge-plasma eyenziwe ngesithombe, futhi amandla e-laser angena emgodini omncane angacishe athathwe ngokuphelele yizibonisi eziningi zodonga lwembobo kanye nesenzo se-plasma (Umfanekiso 5). Ngenxa yokumuncwa kwe-plasma, ukuminyana kwamandla e-laser adlula embotsheni encane kuya phansi kwembobo encane kuzokwehla, futhi ukuminyana kwamandla e-laser phansi kwembobo encane kubalulekile ukuze kukhiqizwe ingcindezi ethile yokuhwamuka ukuze kugcinwe ukujula okuthile. umgodi omncane, onquma Ukujula kokungena kwenqubo yomshini.

Yiziphi izinhlelo zokusebenza zokucutshungulwa kwe-laser ekukhiqizeni i-PCB ephezulu kakhulu

Umfanekiso 5 Ukulungiswa kwe-laser emgodini

Isiphetho se-3

Ukusetshenziswa kobuchwepheshe bokucutshungulwa kwe-laser kungathuthukisa kakhulu ukusebenza kahle kokumba kwezimbobo ezincane ze-PCB ezixinene kakhulu. Ukuhlola kubonisa ukuthi: ①Kuhlanganiswe nobuchwepheshe bokulawula izinombolo, izimbobo ezincane ezingaphezu kuka-30,000 zingasetshenzwa ngomzuzu ebhodini eliphrintiwe, futhi indawo yokumboza iphakathi kuka-75 no-100; ② Ukusetshenziswa kwe-laser ye-UV kungenza imbobo ibe ngaphansi kuka-50μm noma ibe yincane, okudala izimo zokunweba ngokwengeziwe indawo yokusebenzisa yamabhodi e-PCB.